KR100749144B1 - 실리콘 웨이퍼중의 금속불순물 농도 평가방법 - Google Patents
실리콘 웨이퍼중의 금속불순물 농도 평가방법 Download PDFInfo
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- KR100749144B1 KR100749144B1 KR1020017012274A KR20017012274A KR100749144B1 KR 100749144 B1 KR100749144 B1 KR 100749144B1 KR 1020017012274 A KR1020017012274 A KR 1020017012274A KR 20017012274 A KR20017012274 A KR 20017012274A KR 100749144 B1 KR100749144 B1 KR 100749144B1
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- wafer
- silicon wafer
- sulfuric acid
- concentrated sulfuric
- metal
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- 238000000034 method Methods 0.000 title claims abstract description 64
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 60
- 239000010703 silicon Substances 0.000 title claims abstract description 60
- 239000012535 impurity Substances 0.000 title claims abstract description 38
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 88
- 239000002184 metal Substances 0.000 claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 238000011156 evaluation Methods 0.000 claims abstract description 28
- 238000011084 recovery Methods 0.000 claims description 46
- 238000010438 heat treatment Methods 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 27
- 238000011109 contamination Methods 0.000 claims description 23
- 238000004458 analytical method Methods 0.000 claims description 17
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000003472 neutralizing effect Effects 0.000 claims description 2
- 230000007547 defect Effects 0.000 claims 1
- 238000000918 plasma mass spectrometry Methods 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 20
- 235000012431 wafers Nutrition 0.000 description 163
- 239000010949 copper Substances 0.000 description 44
- 239000000243 solution Substances 0.000 description 29
- 238000000137 annealing Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 11
- 238000001514 detection method Methods 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 5
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 5
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 5
- 235000011130 ammonium sulphate Nutrition 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 238000006386 neutralization reaction Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000011978 dissolution method Methods 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004445 quantitative analysis Methods 0.000 description 2
- 238000011158 quantitative evaluation Methods 0.000 description 2
- 238000010206 sensitivity analysis Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000004 White lead Inorganic materials 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- -1 but in particular Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001793 charged compounds Chemical class 0.000 description 1
- 238000009614 chemical analysis method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N31/00—Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0095—Semiconductive materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/25—Chemistry: analytical and immunological testing including sample preparation
- Y10T436/25375—Liberation or purification of sample or separation of material from a sample [e.g., filtering, centrifuging, etc.]
- Y10T436/255—Liberation or purification of sample or separation of material from a sample [e.g., filtering, centrifuging, etc.] including use of a solid sorbent, semipermeable membrane, or liquid extraction
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Molecular Biology (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims (8)
- 실리콘 웨이퍼중의 금속불순물을 평가하는 방법에 있어서,실리콘 웨이퍼표면에 진한 황산을 적하하고,실리콘 웨이퍼내부에 고용되어 있는 금속불순물을 그 진한 황산중에 추출하고,상기 진한 황산중의 금속불순물을 화학 분석하는 것을 특징으로 하는 실리콘 웨이퍼중의 금속불순물 농도 평가방법.
- 제1항에 있어서, 상기 실리콘 웨이퍼 내부에 고용되어 있는 금속불순물을 진한 황산중에 추출하는 방법은 상기 실리콘 웨이퍼 표면에 진한 황산을 적하한 후, 그 실리콘 웨이퍼상의 진한 황산을 오염이 없는 별도의 웨이퍼로 협지하고, 그 상태에서 웨이퍼 전체를 열처리하여 행해짐을 특징으로 하는 실리콘 웨이퍼중의 금속불순물 농도 평가방법.
- 제2항에 있어서, 상기 열처리가 100∼290℃범위에서 실시됨을 특징으로 하는 실리콘 웨이퍼중의 금속불순물 농도 평가방법.
- 제1항에 있어서, 상기 진한 황산중의 금속불순물을 화학분석하는 방법은, 실리콘 웨이퍼 내부에 고용되어 있는 금속불순물을 상기 진한 황산중에 추출한 후, 상기 실리콘 웨이퍼상의 진한 황산을 암모니아가스 분위기중에 폭로하여 중화시킨후, 그 실리콘 웨이퍼상에 잔존한 금속을 회수하기 위한 회수액을 웨이퍼 표면에 적하하고, 웨이퍼 표면에서 상기 회수액을 전개하고, 회수액을 회수하고, 화학분석함을 특징으로 하는 실리콘 웨이퍼중의 금속불순물 농도 평가방법.
- 제4항에 있어서, 상기 회수액은 불산/과산화수소수, 염산/과산화수소수, 불산/질산, 왕수로 구성되는 그룹에서 선택됨을 특징으로 하는 실리콘 웨이퍼중의 금속불순물 농도 평가방법.
- 제4항에 있어서, 상기 화학분석은 프레임레스원자 흡광측정 또는 유도결함 플라스마 질량분석인 것을 특징으로 하는 실리콘 웨이퍼중의 금속불순물 농도 평가방법.
- 제1항 내지 제6항 중의 어느 한 항에 있어서, 상기 실리콘 웨이퍼중의 금속이 Cu인 것을 특징으로 하는 실리콘 웨이퍼중의 금속불순물 농도 평가방법.
- 제1항 내지 제6항 중 어느 한 항에 있어서, 상기 실리콘 웨이퍼의 저항율이 1Ω·㎝이하임을 특징으로 하는 실리콘 웨이퍼중의 금속불순물 농도 평가방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000016517A JP3494102B2 (ja) | 2000-01-26 | 2000-01-26 | シリコンウエーハ中の金属不純物濃度評価方法 |
JPJP-P-2000-00016517 | 2000-01-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010110697A KR20010110697A (ko) | 2001-12-13 |
KR100749144B1 true KR100749144B1 (ko) | 2007-08-14 |
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ID=18543641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020017012274A KR100749144B1 (ko) | 2000-01-26 | 2001-01-18 | 실리콘 웨이퍼중의 금속불순물 농도 평가방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6833273B2 (ko) |
EP (1) | EP1182454A4 (ko) |
JP (1) | JP3494102B2 (ko) |
KR (1) | KR100749144B1 (ko) |
TW (1) | TW507074B (ko) |
WO (1) | WO2001055716A1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101007441B1 (ko) * | 2008-07-14 | 2011-01-12 | 주식회사 엘지실트론 | 웨이퍼의 벌크금속 분석방법 |
KR102400265B1 (ko) * | 2021-12-22 | 2022-05-20 | 램테크놀러지 주식회사 | 증류를 이용한 불산계 혼산액 분석 방법 |
KR102400266B1 (ko) * | 2021-12-22 | 2022-05-20 | 램테크놀러지 주식회사 | 추출을 이용한 불산계 혼산액 분석 방법 |
Families Citing this family (16)
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JP2003229392A (ja) * | 2001-11-28 | 2003-08-15 | Shin Etsu Handotai Co Ltd | シリコンウエーハの製造方法及びシリコンウエーハ並びにsoiウエーハ |
KR100459079B1 (ko) * | 2002-12-05 | 2004-12-03 | 주식회사 실트론 | 실리콘웨이퍼의 게터링 능력 평가 방법 |
JP4877897B2 (ja) * | 2004-07-21 | 2012-02-15 | シルトロニック・ジャパン株式会社 | シリコンウェハの不純物の除去方法及び分析方法 |
JP4852302B2 (ja) | 2004-12-01 | 2012-01-11 | 信越半導体株式会社 | 研磨剤の製造方法及びそれにより製造された研磨剤並びにシリコンウエーハの製造方法 |
US8030082B2 (en) * | 2006-01-13 | 2011-10-04 | Honeywell International Inc. | Liquid-particle analysis of metal materials |
JP4992246B2 (ja) * | 2006-02-22 | 2012-08-08 | 株式会社Sumco | シリコンウェーハ中のCu評価方法 |
JP4772610B2 (ja) | 2006-07-19 | 2011-09-14 | 東京エレクトロン株式会社 | 分析方法 |
JP5067627B2 (ja) * | 2008-05-12 | 2012-11-07 | 信越半導体株式会社 | 多層シリコンウェーハ構造の作製法 |
JP2009294091A (ja) * | 2008-06-05 | 2009-12-17 | Sumco Corp | シリコンウェーハ中の汚染物の分析方法 |
JP2011100978A (ja) * | 2009-10-07 | 2011-05-19 | Sumco Corp | 半導体基板の洗浄方法および洗浄装置 |
JP2011082338A (ja) * | 2009-10-07 | 2011-04-21 | Sumco Corp | 半導体基板の分析方法および分析装置 |
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JP6922804B2 (ja) | 2018-03-22 | 2021-08-18 | 株式会社Sumco | ボロンドープp型シリコンウェーハのエッチング方法、金属汚染評価方法および製造方法 |
CN112683988B (zh) * | 2020-12-28 | 2023-06-02 | 上海新昇半导体科技有限公司 | 一种晶圆中金属杂质的检测方法 |
CN113820198B (zh) * | 2021-09-30 | 2023-12-26 | 中环领先(徐州)半导体材料有限公司 | 半导体硅片表面金属回收率及设备的检测方法 |
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JPH02272359A (ja) * | 1989-04-14 | 1990-11-07 | Toshiba Ceramics Co Ltd | ウェハ表面の不純物量の測定方法 |
JP2000002632A (ja) * | 1998-04-13 | 2000-01-07 | Shimizu Corp | 汚染物検出方法 |
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JPH0915174A (ja) * | 1995-06-30 | 1997-01-17 | Nec Corp | 薬品分析方法および薬品分析用前処理装置 |
JP2967398B2 (ja) * | 1995-09-18 | 1999-10-25 | 信越半導体株式会社 | シリコンウエーハ内部の不純物分析方法 |
JP3358604B2 (ja) * | 1999-11-11 | 2002-12-24 | 日本電気株式会社 | 白金族不純物回収液及びその回収方法 |
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2000
- 2000-01-26 JP JP2000016517A patent/JP3494102B2/ja not_active Expired - Fee Related
-
2001
- 2001-01-18 WO PCT/JP2001/000301 patent/WO2001055716A1/ja active Application Filing
- 2001-01-18 US US09/937,538 patent/US6833273B2/en not_active Expired - Lifetime
- 2001-01-18 EP EP01901423A patent/EP1182454A4/en not_active Ceased
- 2001-01-18 KR KR1020017012274A patent/KR100749144B1/ko active IP Right Grant
- 2001-01-20 TW TW090101535A patent/TW507074B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02272359A (ja) * | 1989-04-14 | 1990-11-07 | Toshiba Ceramics Co Ltd | ウェハ表面の不純物量の測定方法 |
JP2000002632A (ja) * | 1998-04-13 | 2000-01-07 | Shimizu Corp | 汚染物検出方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101007441B1 (ko) * | 2008-07-14 | 2011-01-12 | 주식회사 엘지실트론 | 웨이퍼의 벌크금속 분석방법 |
KR102400265B1 (ko) * | 2021-12-22 | 2022-05-20 | 램테크놀러지 주식회사 | 증류를 이용한 불산계 혼산액 분석 방법 |
KR102400266B1 (ko) * | 2021-12-22 | 2022-05-20 | 램테크놀러지 주식회사 | 추출을 이용한 불산계 혼산액 분석 방법 |
Also Published As
Publication number | Publication date |
---|---|
US20030073240A1 (en) | 2003-04-17 |
TW507074B (en) | 2002-10-21 |
EP1182454A1 (en) | 2002-02-27 |
JP3494102B2 (ja) | 2004-02-03 |
WO2001055716A1 (fr) | 2001-08-02 |
EP1182454A4 (en) | 2003-04-23 |
JP2001208743A (ja) | 2001-08-03 |
KR20010110697A (ko) | 2001-12-13 |
US6833273B2 (en) | 2004-12-21 |
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