KR100747076B1 - 푸숴 및 이것을 갖춘 전자부품시험장치 - Google Patents
푸숴 및 이것을 갖춘 전자부품시험장치 Download PDFInfo
- Publication number
- KR100747076B1 KR100747076B1 KR1020037009027A KR20037009027A KR100747076B1 KR 100747076 B1 KR100747076 B1 KR 100747076B1 KR 1020037009027 A KR1020037009027 A KR 1020037009027A KR 20037009027 A KR20037009027 A KR 20037009027A KR 100747076 B1 KR100747076 B1 KR 100747076B1
- Authority
- KR
- South Korea
- Prior art keywords
- test
- electronic component
- chip
- pusher
- socket
- Prior art date
Links
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/58—Testing of lines, cables or conductors
- G01R31/59—Testing of lines, cables or conductors while the cable continuously passes the testing apparatus, e.g. during manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001001934A JP2002207063A (ja) | 2001-01-09 | 2001-01-09 | プッシャ及びこれを備えた電子部品試験装置 |
JPJP-P-2001-00001934 | 2001-01-09 | ||
PCT/JP2001/011477 WO2002056040A1 (en) | 2001-01-09 | 2001-12-26 | Pusher and electronic part tester with the pusher |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030068577A KR20030068577A (ko) | 2003-08-21 |
KR100747076B1 true KR100747076B1 (ko) | 2007-08-07 |
Family
ID=18870510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020037009027A KR100747076B1 (ko) | 2001-01-09 | 2001-12-26 | 푸숴 및 이것을 갖춘 전자부품시험장치 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2002207063A (zh) |
KR (1) | KR100747076B1 (zh) |
CN (1) | CN1278130C (zh) |
TW (1) | TWI224198B (zh) |
WO (1) | WO2002056040A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG145539A1 (en) * | 2004-03-09 | 2008-09-29 | Micron Technology Inc | Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
JP4928496B2 (ja) * | 2008-05-09 | 2012-05-09 | 株式会社アドバンテスト | プッシャブロック |
KR101830284B1 (ko) * | 2011-10-06 | 2018-02-21 | 삼성전자주식회사 | 컨택 장치 및 이를 이용한 반도체 테스트 장치 |
KR102010275B1 (ko) * | 2013-04-03 | 2019-08-13 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
CN106903066B (zh) * | 2013-07-26 | 2019-06-21 | 泰克元有限公司 | 用于测试分选机的匹配板的推动件组件 |
KR101624981B1 (ko) * | 2014-12-29 | 2016-05-30 | (주) 네스텍코리아 | 전자부품 테스트용 소켓 |
TW201715243A (zh) * | 2015-07-31 | 2017-05-01 | Seiko Epson Corp | 電子零件搬送裝置及電子零件檢查裝置 |
JP2017116369A (ja) * | 2015-12-24 | 2017-06-29 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0694790A (ja) * | 1992-09-16 | 1994-04-08 | Matsushita Electric Ind Co Ltd | 電子部品の検査装置 |
JPH0815371A (ja) * | 1994-07-04 | 1996-01-19 | Fujitsu Ltd | Ic測定方法及び測定機構 |
-
2001
- 2001-01-09 JP JP2001001934A patent/JP2002207063A/ja not_active Withdrawn
- 2001-12-26 CN CNB018218601A patent/CN1278130C/zh not_active Expired - Fee Related
- 2001-12-26 KR KR1020037009027A patent/KR100747076B1/ko not_active IP Right Cessation
- 2001-12-26 WO PCT/JP2001/011477 patent/WO2002056040A1/ja active Application Filing
- 2001-12-28 TW TW090133033A patent/TWI224198B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0694790A (ja) * | 1992-09-16 | 1994-04-08 | Matsushita Electric Ind Co Ltd | 電子部品の検査装置 |
JPH0815371A (ja) * | 1994-07-04 | 1996-01-19 | Fujitsu Ltd | Ic測定方法及び測定機構 |
Also Published As
Publication number | Publication date |
---|---|
WO2002056040A1 (en) | 2002-07-18 |
CN1486430A (zh) | 2004-03-31 |
JP2002207063A (ja) | 2002-07-26 |
KR20030068577A (ko) | 2003-08-21 |
TWI224198B (en) | 2004-11-21 |
CN1278130C (zh) | 2006-10-04 |
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Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
G170 | Re-publication after modification of scope of protection [patent] | ||
LAPS | Lapse due to unpaid annual fee |