KR100747076B1 - 푸숴 및 이것을 갖춘 전자부품시험장치 - Google Patents

푸숴 및 이것을 갖춘 전자부품시험장치 Download PDF

Info

Publication number
KR100747076B1
KR100747076B1 KR1020037009027A KR20037009027A KR100747076B1 KR 100747076 B1 KR100747076 B1 KR 100747076B1 KR 1020037009027 A KR1020037009027 A KR 1020037009027A KR 20037009027 A KR20037009027 A KR 20037009027A KR 100747076 B1 KR100747076 B1 KR 100747076B1
Authority
KR
South Korea
Prior art keywords
test
electronic component
chip
pusher
socket
Prior art date
Application number
KR1020037009027A
Other languages
English (en)
Korean (ko)
Other versions
KR20030068577A (ko
Inventor
케이이치 오노데라
Original Assignee
가부시키가이샤 아드반테스트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아드반테스트 filed Critical 가부시키가이샤 아드반테스트
Publication of KR20030068577A publication Critical patent/KR20030068577A/ko
Application granted granted Critical
Publication of KR100747076B1 publication Critical patent/KR100747076B1/ko

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/58Testing of lines, cables or conductors
    • G01R31/59Testing of lines, cables or conductors while the cable continuously passes the testing apparatus, e.g. during manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020037009027A 2001-01-09 2001-12-26 푸숴 및 이것을 갖춘 전자부품시험장치 KR100747076B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001001934A JP2002207063A (ja) 2001-01-09 2001-01-09 プッシャ及びこれを備えた電子部品試験装置
JPJP-P-2001-00001934 2001-01-09
PCT/JP2001/011477 WO2002056040A1 (en) 2001-01-09 2001-12-26 Pusher and electronic part tester with the pusher

Publications (2)

Publication Number Publication Date
KR20030068577A KR20030068577A (ko) 2003-08-21
KR100747076B1 true KR100747076B1 (ko) 2007-08-07

Family

ID=18870510

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037009027A KR100747076B1 (ko) 2001-01-09 2001-12-26 푸숴 및 이것을 갖춘 전자부품시험장치

Country Status (5)

Country Link
JP (1) JP2002207063A (zh)
KR (1) KR100747076B1 (zh)
CN (1) CN1278130C (zh)
TW (1) TWI224198B (zh)
WO (1) WO2002056040A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG145539A1 (en) * 2004-03-09 2008-09-29 Micron Technology Inc Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
JP4928496B2 (ja) * 2008-05-09 2012-05-09 株式会社アドバンテスト プッシャブロック
KR101830284B1 (ko) * 2011-10-06 2018-02-21 삼성전자주식회사 컨택 장치 및 이를 이용한 반도체 테스트 장치
KR102010275B1 (ko) * 2013-04-03 2019-08-13 (주)테크윙 반도체소자 테스트용 핸들러
CN106903066B (zh) * 2013-07-26 2019-06-21 泰克元有限公司 用于测试分选机的匹配板的推动件组件
KR101624981B1 (ko) * 2014-12-29 2016-05-30 (주) 네스텍코리아 전자부품 테스트용 소켓
TW201715243A (zh) * 2015-07-31 2017-05-01 Seiko Epson Corp 電子零件搬送裝置及電子零件檢查裝置
JP2017116369A (ja) * 2015-12-24 2017-06-29 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694790A (ja) * 1992-09-16 1994-04-08 Matsushita Electric Ind Co Ltd 電子部品の検査装置
JPH0815371A (ja) * 1994-07-04 1996-01-19 Fujitsu Ltd Ic測定方法及び測定機構

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694790A (ja) * 1992-09-16 1994-04-08 Matsushita Electric Ind Co Ltd 電子部品の検査装置
JPH0815371A (ja) * 1994-07-04 1996-01-19 Fujitsu Ltd Ic測定方法及び測定機構

Also Published As

Publication number Publication date
WO2002056040A1 (en) 2002-07-18
CN1486430A (zh) 2004-03-31
JP2002207063A (ja) 2002-07-26
KR20030068577A (ko) 2003-08-21
TWI224198B (en) 2004-11-21
CN1278130C (zh) 2006-10-04

Similar Documents

Publication Publication Date Title
KR100747075B1 (ko) 전자부품시험용소켓트 및 이를 이용한 전자부품시험장치
KR100937930B1 (ko) 히터를 구비한 푸숴, 전자부품 핸들링 장치 및 전자부품의온도제어방법
KR100390636B1 (ko) 전자부품 시험장치
JP4299383B2 (ja) Ic試験装置
KR100810380B1 (ko) 집적회로 시험장치
KR100912875B1 (ko) 인서트 및 이를 구비한 전자부품 핸들링장치
KR100682380B1 (ko) 콘택트, 소켓, 소켓보드 및 전자부품시험장치
KR100747076B1 (ko) 푸숴 및 이것을 갖춘 전자부품시험장치
JP4222442B2 (ja) 電子部品試験装置用インサート
JP2018189392A (ja) 電子部品試験装置用のキャリア
WO2000033360A1 (en) A method and apparatus for the transport and tracking of an electronic component
JP4041609B2 (ja) 電子部品試験装置
KR100824128B1 (ko) 전자 부품 핸들링 장치용 인서트 및 전자 부품 핸들링 장치
JPH09113580A (ja) Ic試験装置
JP2003028920A (ja) 電子部品コンタクト装置
JP3379077B2 (ja) Ic試験装置
WO2002041015A1 (fr) Trousse et procede servant a nettoyer une borne de connexion de prise et appareil de verification de pieces electroniques
KR20050026055A (ko) 전자부품 시험장치
JP2003028924A (ja) 電子部品ハンドリング装置および電子部品の温度制御方法
KR102341037B1 (ko) 전자 부품 시험 장치용 캐리어
KR102352456B1 (ko) 전자 부품 시험 장치용 캐리어
WO2004005948A1 (ja) 電子部品コンタクト装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Re-publication after modification of scope of protection [patent]
LAPS Lapse due to unpaid annual fee