KR100732214B1 - 휴대전화기용 고주파 모듈 - Google Patents

휴대전화기용 고주파 모듈 Download PDF

Info

Publication number
KR100732214B1
KR100732214B1 KR1020050098272A KR20050098272A KR100732214B1 KR 100732214 B1 KR100732214 B1 KR 100732214B1 KR 1020050098272 A KR1020050098272 A KR 1020050098272A KR 20050098272 A KR20050098272 A KR 20050098272A KR 100732214 B1 KR100732214 B1 KR 100732214B1
Authority
KR
South Korea
Prior art keywords
signal
dielectric substrate
power amplifier
antenna switch
transceiver
Prior art date
Application number
KR1020050098272A
Other languages
English (en)
Korean (ko)
Other versions
KR20060054090A (ko
Inventor
가즈히로 나카노
Original Assignee
알프스 덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알프스 덴키 가부시키가이샤 filed Critical 알프스 덴키 가부시키가이샤
Publication of KR20060054090A publication Critical patent/KR20060054090A/ko
Application granted granted Critical
Publication of KR100732214B1 publication Critical patent/KR100732214B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/44—Transmit/receive switching
    • H04B1/48—Transmit/receive switching in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Structure Of Printed Boards (AREA)
KR1020050098272A 2004-10-19 2005-10-18 휴대전화기용 고주파 모듈 KR100732214B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004303904A JP2006121147A (ja) 2004-10-19 2004-10-19 携帯電話機用高周波モジュール
JPJP-P-2004-00303904 2004-10-19

Publications (2)

Publication Number Publication Date
KR20060054090A KR20060054090A (ko) 2006-05-22
KR100732214B1 true KR100732214B1 (ko) 2007-06-25

Family

ID=36538659

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050098272A KR100732214B1 (ko) 2004-10-19 2005-10-18 휴대전화기용 고주파 모듈

Country Status (3)

Country Link
JP (1) JP2006121147A (zh)
KR (1) KR100732214B1 (zh)
CN (1) CN100420159C (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028612A (ja) 2006-07-20 2008-02-07 Matsushita Electric Ind Co Ltd 通信装置およびそれを用いた電子機器
US7978031B2 (en) 2008-01-31 2011-07-12 Tdk Corporation High frequency module provided with power amplifier
JP5799959B2 (ja) * 2010-11-24 2015-10-28 日立金属株式会社 電子部品
WO2012111711A1 (ja) 2011-02-15 2012-08-23 株式会社村田製作所 多層配線基板およびその製造方法
US8526890B1 (en) * 2012-03-11 2013-09-03 Mediatek Inc. Radio frequency modules capable of self-calibration
JP5285806B1 (ja) 2012-08-21 2013-09-11 太陽誘電株式会社 高周波回路モジュール
JP5117632B1 (ja) 2012-08-21 2013-01-16 太陽誘電株式会社 高周波回路モジュール
JP5768941B2 (ja) 2012-10-17 2015-08-26 株式会社村田製作所 高周波モジュール
JP6448199B2 (ja) * 2014-03-11 2019-01-09 日本電波工業株式会社 恒温槽付水晶発振器
CN106330236B (zh) * 2016-09-28 2018-12-18 深圳三星通信技术研究有限公司 一种射频拉远模块及射频基站
JP6463323B2 (ja) * 2016-12-01 2019-01-30 太陽誘電株式会社 無線モジュール、およびその製造方法
JP2018098677A (ja) * 2016-12-14 2018-06-21 株式会社村田製作所 送受信モジュール
US11038096B2 (en) 2017-10-15 2021-06-15 Skyworks Solutions, Inc. Stack assembly having electro-acoustic device
JP2020027975A (ja) * 2018-08-09 2020-02-20 株式会社村田製作所 高周波モジュールおよび通信装置
JP2020126921A (ja) * 2019-02-04 2020-08-20 株式会社村田製作所 高周波モジュールおよび通信装置
EP4089731A4 (en) * 2020-01-10 2024-01-10 Sumitomo Electric Industries HIGH FREQUENCY AMPLIFIER
JP2021158554A (ja) 2020-03-27 2021-10-07 株式会社村田製作所 高周波モジュールおよび通信装置
JP2021197569A (ja) * 2020-06-09 2021-12-27 株式会社村田製作所 高周波モジュールおよび通信装置
JP7098820B2 (ja) * 2020-07-16 2022-07-11 株式会社フジクラ 無線通信モジュール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020021366A (ko) * 2000-09-14 2002-03-20 이데이 노부유끼 고주파 모듈 장치 및 그 제조 방법
KR20040060843A (ko) * 2001-11-22 2004-07-06 소니 가부시끼 가이샤 멀티칩 회로 모듈 및 그 제조 방법
KR20040086286A (ko) * 2002-01-25 2004-10-08 소니 가부시끼 가이샤 고주파 모듈 및 그 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057597A (ja) * 2000-08-10 2002-02-22 Tdk Corp 高周波フロントエンドモジュール
JP2003032035A (ja) * 2001-07-17 2003-01-31 Alps Electric Co Ltd 送受信ユニット
US6873529B2 (en) * 2002-02-26 2005-03-29 Kyocera Corporation High frequency module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020021366A (ko) * 2000-09-14 2002-03-20 이데이 노부유끼 고주파 모듈 장치 및 그 제조 방법
KR20040060843A (ko) * 2001-11-22 2004-07-06 소니 가부시끼 가이샤 멀티칩 회로 모듈 및 그 제조 방법
KR20040086286A (ko) * 2002-01-25 2004-10-08 소니 가부시끼 가이샤 고주파 모듈 및 그 제조 방법

Also Published As

Publication number Publication date
CN100420159C (zh) 2008-09-17
JP2006121147A (ja) 2006-05-11
KR20060054090A (ko) 2006-05-22
CN1770649A (zh) 2006-05-10

Similar Documents

Publication Publication Date Title
KR100732214B1 (ko) 휴대전화기용 고주파 모듈
EP1368858B1 (en) Module and electronic device
US6420937B1 (en) Voltage controlled oscillator with power amplifier
US7515879B2 (en) Radio frequency circuit module
US10362678B2 (en) Crystal packaging with conductive pillars
US6633005B2 (en) Multilayer RF amplifier module
US20030060172A1 (en) Radio frequency module
WO2002017502A1 (fr) Dispositif radio emetteur/recepteur
US20100289599A1 (en) High Performance RF Rx Module
US20070066243A1 (en) Rf circuit module
JP4553627B2 (ja) 高周波回路モジュールおよび無線通信機器
JP2003060523A (ja) 無線通信モジュール
JPH11330163A (ja) マイクロ波・ミリ波装置
US7952197B2 (en) Electrical component
US7763960B2 (en) Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
TW200845605A (en) Sending/receiving circuit module
US20080259570A1 (en) Transmitting device and electronic apparatus using the same
JP2008263077A (ja) 半導体装置および電子装置
JP3897016B2 (ja) 高出力電圧制御発振器
KR20080073433A (ko) 통신회로 집적모듈
JP3925929B2 (ja) マイクロ波・ミリ波装置
JP2006049661A (ja) 半導体モジュール及びその製造方法
JP2002026227A (ja) 集積回路パッケージ
KR20060074260A (ko) 휴대 단말기의 인쇄회로기판
JP2007243553A (ja) 高周波信号受信装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20100531

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee