JP5285806B1 - 高周波回路モジュール - Google Patents
高周波回路モジュール Download PDFInfo
- Publication number
- JP5285806B1 JP5285806B1 JP2012249160A JP2012249160A JP5285806B1 JP 5285806 B1 JP5285806 B1 JP 5285806B1 JP 2012249160 A JP2012249160 A JP 2012249160A JP 2012249160 A JP2012249160 A JP 2012249160A JP 5285806 B1 JP5285806 B1 JP 5285806B1
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- power amplifier
- frequency
- duplexer
- rfic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 46
- 239000010410 layer Substances 0.000 claims description 50
- 239000004020 conductor Substances 0.000 claims description 45
- 239000012792 core layer Substances 0.000 claims description 39
- 239000012212 insulator Substances 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 11
- 230000003321 amplification Effects 0.000 claims description 10
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010897 surface acoustic wave method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/34—Networks for connecting several sources or loads working on different frequencies or frequency bands, to a common load or source
- H03H11/344—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/34—Networks for connecting several sources or loads working on different frequencies or frequency bands, to a common load or source
- H03H11/348—Networks for connecting several sources or loads working on different frequencies or frequency bands, to a common load or source particularly adapted as coupling circuit between transmitters and antenna
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/08—Holders with means for regulating temperature
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/44—Transmit/receive switching
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L5/00—Arrangements affording multiple use of the transmission path
- H04L5/14—Two-way operation using the same type of signal, i.e. duplex
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/54—Circuits using the same frequency for two directions of communication
- H04B1/58—Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Acoustics & Sound (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Transceivers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】高周波回路モジュール100は、高周波信号の送信処理及び受信処理を行うRFIC160と、該RFIC160からの送信信号を増幅するパワーアンプIC155と、パワーアンプIC155からアンテナへ出力される送信信号とアンテナからRFIC160に入力される受信信号とを分離するデュプレクサ110,120とを備え、RFIC160及びパワーアンプIC155の何れか一方又は双方は回路基板200内に埋設され、且つ、デュプレクサ110,120はRFIC160とパワーアンプIC155との間に配置されている。
【選択図】図6
Description
本発明の第1の実施の形態に係る高周波回路モジュールについて図面を参照して説明する。図1に高周波回路モジュールの概略回路図を示す。なお本実施の形態では、説明の簡単のため、主として本発明の要旨に係る構成についてのみ説明する。
本発明の第2の実施の形態に係る高周波回路モジュールについて図面を参照して説明する。本実施の形態に係る高周波回路モジュールが第1の実施の形態と相違する点は、RFIC及びパワーアンプICの実装形態にある。その他の点、例えば高周波回路モジュールの概略回路図については第1の実施の形態と同様なので、ここでは主として相違点について詳述する。
Claims (6)
- 絶縁体層と導体層とを交互に積層してなる回路基板と、
回路基板に実装され高周波信号の送信処理及び受信処理を行う高周波ICと、
回路基板に実装され高周波ICからの送信信号を増幅するパワーアンプICと、
パワーアンプICからアンテナへ出力される送信信号とアンテナから高周波ICに入力される受信信号とを分離するデュプレクサとを備え、
高周波IC及びパワーアンプICの何れか一方又は双方は回路基板内に埋設され、且つ、回路基板を上面から透過してみるとデュプレクサは高周波ICとパワーアンプICとの間に配置されている
ことを特徴とする高周波回路モジュール。 - パワーアンプICにより増幅された送信信号をデュプレクサに伝送する信号線は、高周波ICから出力された増幅前の送信信号をパワーアンプICに伝送する信号線よりも配線長が短い
ことを特徴とする請求項1記載の高周波回路モジュール。 - デュプレクサは回路基板上に実装されている
ことを特徴とする請求項1又は2記載の高周波回路モジュール。 - デュプレクサは回路基板内に埋設されている
ことを特徴とする請求項1又は2記載の高周波回路モジュール。 - 回路基板底面にはグランド電極が形成されており、
パワーアンプICは回路基板内に埋設されており、パワーアンプICの放熱用電極はビア導体を介して回路基板底面のグランド電極に接続されている
ことを特徴とする請求項1乃至4何れか1項記載の高周波回路モジュール。 - 前記回路基板は他の導体層より厚みが大きく且つグランドとして機能する導体層であるコア層を含み、前記高周波IC及びパワーアンプICの何れか一方又は双方は前記高周波スイッチは前記コア層に形成した貫通孔又は凹部内に配置されている
ことを特徴とする請求項1乃至5何れか1項記載の高周波回路モジュール。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012249160A JP5285806B1 (ja) | 2012-08-21 | 2012-11-13 | 高周波回路モジュール |
KR1020130080638A KR101445543B1 (ko) | 2012-08-21 | 2013-07-10 | 고주파 회로 모듈 |
US13/952,509 US9099979B2 (en) | 2012-08-21 | 2013-07-26 | High-frequency circuit module |
TW102127438A TWI493893B (zh) | 2012-08-21 | 2013-07-31 | 高頻電路模組 |
CN201310376792.8A CN103635021B (zh) | 2012-08-21 | 2013-08-21 | 高频电路模块 |
US14/077,697 US8830010B2 (en) | 2012-08-21 | 2013-11-12 | High frequency circuit module with a filter in a core layer of a circuit substrate |
US14/150,599 US8872600B2 (en) | 2012-08-21 | 2014-01-08 | High frequency circuit module with a filter disposed in a core layer of a circuit substrate |
US14/453,345 US20140347145A1 (en) | 2012-08-21 | 2014-08-06 | High frequency circuit module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012182286A JP5117632B1 (ja) | 2012-08-21 | 2012-08-21 | 高周波回路モジュール |
JP2012249160A JP5285806B1 (ja) | 2012-08-21 | 2012-11-13 | 高周波回路モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5285806B1 true JP5285806B1 (ja) | 2013-09-11 |
JP2014099683A JP2014099683A (ja) | 2014-05-29 |
Family
ID=50147836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012249160A Active JP5285806B1 (ja) | 2012-08-21 | 2012-11-13 | 高周波回路モジュール |
Country Status (5)
Country | Link |
---|---|
US (4) | US9099979B2 (ja) |
JP (1) | JP5285806B1 (ja) |
KR (1) | KR101445543B1 (ja) |
CN (1) | CN103635021B (ja) |
TW (1) | TWI493893B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5456935B1 (ja) * | 2013-10-30 | 2014-04-02 | 太陽誘電株式会社 | 回路モジュール |
JP5505915B1 (ja) * | 2013-10-30 | 2014-05-28 | 太陽誘電株式会社 | 通信モジュール |
US9160825B2 (en) | 2013-10-30 | 2015-10-13 | Taiyo Yuden Co., Ltd. | Communication module |
WO2016052909A1 (ko) * | 2014-09-29 | 2016-04-07 | 엘지전자 주식회사 | 셀룰러 통신과 d2d 통신을 동시 수행할 수 있는 단말기 |
JP2016076509A (ja) * | 2014-10-02 | 2016-05-12 | 太陽誘電株式会社 | 回路モジュール |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10433414B2 (en) * | 2010-12-24 | 2019-10-01 | Rayben Technologies (HK) Limited | Manufacturing method of printing circuit board with micro-radiators |
JP5285806B1 (ja) | 2012-08-21 | 2013-09-11 | 太陽誘電株式会社 | 高周波回路モジュール |
JP5117632B1 (ja) | 2012-08-21 | 2013-01-16 | 太陽誘電株式会社 | 高周波回路モジュール |
JP2015170770A (ja) * | 2014-03-07 | 2015-09-28 | イビデン株式会社 | プリント配線板 |
TWI554174B (zh) * | 2014-11-04 | 2016-10-11 | 上海兆芯集成電路有限公司 | 線路基板和半導體封裝結構 |
KR101981513B1 (ko) * | 2015-07-17 | 2019-05-23 | 가부시키가이샤 무라타 세이사쿠쇼 | 프런트엔드 모듈 |
KR20170056391A (ko) * | 2015-11-13 | 2017-05-23 | 삼성전기주식회사 | 프론트 엔드 모듈 |
RU2631224C1 (ru) * | 2016-07-29 | 2017-09-19 | Общество с ограниченной ответственностью "Радио Гигабит" | Многоканальный радиочастотный модуль с частотным разнесением приема и передачи |
KR102565119B1 (ko) * | 2016-08-25 | 2023-08-08 | 삼성전기주식회사 | 전자 소자 내장 기판과 그 제조 방법 및 전자 소자 모듈 |
WO2018123698A1 (ja) * | 2016-12-27 | 2018-07-05 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
JP6729790B2 (ja) * | 2017-03-14 | 2020-07-22 | 株式会社村田製作所 | 高周波モジュール |
WO2018173750A1 (ja) * | 2017-03-21 | 2018-09-27 | 株式会社村田製作所 | アンテナモジュール及び通信装置 |
WO2018186154A1 (ja) * | 2017-04-04 | 2018-10-11 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
CN110809859B (zh) | 2017-06-27 | 2021-08-13 | 株式会社村田制作所 | 通信模块 |
DE102017129611B4 (de) * | 2017-12-12 | 2021-04-22 | RF360 Europe GmbH | Elektrische Vorrichtung mit zwei oder mehr Chipkomponenten |
CN212991332U (zh) * | 2018-02-28 | 2021-04-16 | 株式会社村田制作所 | 天线模块和通信装置 |
CN215300624U (zh) * | 2018-03-23 | 2021-12-24 | 株式会社村田制作所 | 高频模块和通信装置 |
DE212019000227U1 (de) * | 2018-03-23 | 2020-11-02 | Murata Manufacturing Co., Ltd. | Hochfrequenzmodul und Kommunikationsgerät |
JP6633151B2 (ja) * | 2018-08-10 | 2020-01-22 | 太陽誘電株式会社 | 回路モジュール |
US10770399B2 (en) * | 2019-02-13 | 2020-09-08 | Infineon Technologies Ag | Semiconductor package having a filled conductive cavity |
WO2020184613A1 (ja) * | 2019-03-13 | 2020-09-17 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
DE112020003287T5 (de) * | 2019-07-09 | 2022-04-21 | Murata Manufacturing Co., Ltd. | Hochfrequenzmodul und Kommunikationsgerät |
WO2021039083A1 (ja) * | 2019-08-28 | 2021-03-04 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
CN114270714B (zh) * | 2019-08-28 | 2024-01-05 | 株式会社村田制作所 | 高频模块以及通信装置 |
JP2021052377A (ja) * | 2019-09-20 | 2021-04-01 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
JP2021052376A (ja) * | 2019-09-20 | 2021-04-01 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
JP2021129217A (ja) * | 2020-02-13 | 2021-09-02 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
TWI785503B (zh) * | 2020-03-11 | 2022-12-01 | 日商村田製作所股份有限公司 | Rf電路模組及其製造方法 |
US11564337B2 (en) | 2020-03-17 | 2023-01-24 | Qorvo Us, Inc. | Thermal structures for heat transfer devices and spatial power-combining devices |
US11621469B2 (en) * | 2021-02-01 | 2023-04-04 | Qorvo Us, Inc. | Power-combining devices with increased output power |
US11955687B2 (en) | 2022-01-10 | 2024-04-09 | Qorvo Us, Inc. | Structural arrangements for spatial power-combining devices |
WO2023223952A1 (ja) * | 2022-05-19 | 2023-11-23 | 株式会社村田製作所 | 高周波モジュール |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010995A (ja) * | 2006-06-28 | 2008-01-17 | Ngk Spark Plug Co Ltd | アンテナスイッチモジュール |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6501945B1 (en) | 1999-02-05 | 2002-12-31 | Benq Corporation | Cellular phone with an insulating envelope for preventing leakage of electromagnetic radiation |
JP3976297B2 (ja) * | 1999-09-29 | 2007-09-12 | 株式会社ルネサステクノロジ | 高周波回路モジュールおよび通信装置 |
JP3890947B2 (ja) * | 2001-10-17 | 2007-03-07 | 松下電器産業株式会社 | 高周波半導体装置 |
JP3937840B2 (ja) * | 2002-01-10 | 2007-06-27 | 株式会社日立製作所 | 高周波モジュール |
US6873529B2 (en) * | 2002-02-26 | 2005-03-29 | Kyocera Corporation | High frequency module |
US6973330B2 (en) * | 2002-10-04 | 2005-12-06 | Sony Corporation | Optimized two-sided wireless modem card component placement |
TW200520201A (en) * | 2003-10-08 | 2005-06-16 | Kyocera Corp | High-frequency module and communication apparatus |
JP2005198051A (ja) * | 2004-01-08 | 2005-07-21 | Hitachi Ltd | 高周波モジュール |
WO2006003959A1 (ja) * | 2004-06-30 | 2006-01-12 | Hitachi Metals, Ltd. | 高周波回路、高周波部品及びマルチバンド通信装置 |
JP4288529B2 (ja) | 2004-06-30 | 2009-07-01 | 日立金属株式会社 | 高周波部品及びマルチバンド通信装置 |
JP2006073673A (ja) * | 2004-08-31 | 2006-03-16 | Kyocera Corp | 高周波モジュール及び無線通信装置 |
GB2418790A (en) | 2004-09-29 | 2006-04-05 | Renesas Tech Corp | Direct upconversion of transmission signal employing a notch filter |
JP2006121147A (ja) * | 2004-10-19 | 2006-05-11 | Alps Electric Co Ltd | 携帯電話機用高周波モジュール |
JP2006180336A (ja) | 2004-12-24 | 2006-07-06 | Kyocera Corp | 高周波モジュール |
JP4423210B2 (ja) | 2005-01-21 | 2010-03-03 | 京セラ株式会社 | 高周波モジュール及びそれを用いた通信機器 |
JP4521602B2 (ja) | 2005-06-06 | 2010-08-11 | ルネサスエレクトロニクス株式会社 | マルチモード高周波回路 |
JP2007124202A (ja) * | 2005-10-27 | 2007-05-17 | Kyocera Corp | 高周波モジュールおよび無線通信装置 |
JP2008181951A (ja) * | 2007-01-23 | 2008-08-07 | Nec Electronics Corp | 固体撮像装置 |
US20090116510A1 (en) | 2007-11-02 | 2009-05-07 | Broadcom Corporation | High frequency communication device with minimal off chip components |
US7978031B2 (en) * | 2008-01-31 | 2011-07-12 | Tdk Corporation | High frequency module provided with power amplifier |
JP2010171114A (ja) * | 2009-01-21 | 2010-08-05 | Renesas Technology Corp | 半導体装置 |
JP5441007B2 (ja) | 2010-03-10 | 2014-03-12 | Tdk株式会社 | 電子部品内蔵基板の製造方法 |
JP4709316B2 (ja) | 2010-03-17 | 2011-06-22 | ルネサスエレクトロニクス株式会社 | マルチモード高周波回路 |
JP5581126B2 (ja) | 2010-06-15 | 2014-08-27 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置および無線通信システム |
KR101831692B1 (ko) * | 2011-08-17 | 2018-02-26 | 삼성전자주식회사 | 기능적으로 비대칭인 전도성 구성 요소들을 갖는 반도체 소자, 패키지 기판, 반도체 패키지, 패키지 적층 구조물 및 전자 시스템 |
CN202197269U (zh) * | 2011-08-19 | 2012-04-18 | 京信通信系统(中国)有限公司 | 模块化盲插的通信装置 |
JP5241910B2 (ja) * | 2011-12-22 | 2013-07-17 | 太陽誘電株式会社 | 回路基板 |
JP5143972B1 (ja) * | 2012-08-16 | 2013-02-13 | 太陽誘電株式会社 | 高周波回路モジュール |
JP5117632B1 (ja) | 2012-08-21 | 2013-01-16 | 太陽誘電株式会社 | 高周波回路モジュール |
JP5285806B1 (ja) * | 2012-08-21 | 2013-09-11 | 太陽誘電株式会社 | 高周波回路モジュール |
-
2012
- 2012-11-13 JP JP2012249160A patent/JP5285806B1/ja active Active
-
2013
- 2013-07-10 KR KR1020130080638A patent/KR101445543B1/ko active IP Right Grant
- 2013-07-26 US US13/952,509 patent/US9099979B2/en active Active
- 2013-07-31 TW TW102127438A patent/TWI493893B/zh not_active IP Right Cessation
- 2013-08-21 CN CN201310376792.8A patent/CN103635021B/zh active Active
- 2013-11-12 US US14/077,697 patent/US8830010B2/en not_active Expired - Fee Related
-
2014
- 2014-01-08 US US14/150,599 patent/US8872600B2/en active Active
- 2014-08-06 US US14/453,345 patent/US20140347145A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010995A (ja) * | 2006-06-28 | 2008-01-17 | Ngk Spark Plug Co Ltd | アンテナスイッチモジュール |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5456935B1 (ja) * | 2013-10-30 | 2014-04-02 | 太陽誘電株式会社 | 回路モジュール |
JP5505915B1 (ja) * | 2013-10-30 | 2014-05-28 | 太陽誘電株式会社 | 通信モジュール |
US8849362B1 (en) | 2013-10-30 | 2014-09-30 | Taiyo Yuden Co., Ltd. | Communication module |
US9160825B2 (en) | 2013-10-30 | 2015-10-13 | Taiyo Yuden Co., Ltd. | Communication module |
WO2016052909A1 (ko) * | 2014-09-29 | 2016-04-07 | 엘지전자 주식회사 | 셀룰러 통신과 d2d 통신을 동시 수행할 수 있는 단말기 |
US10313094B2 (en) | 2014-09-29 | 2019-06-04 | Lg Electronics Inc. | Terminal capable of simultaneously performing cellular communication and D2D communication |
JP2016076509A (ja) * | 2014-10-02 | 2016-05-12 | 太陽誘電株式会社 | 回路モジュール |
Also Published As
Publication number | Publication date |
---|---|
US9099979B2 (en) | 2015-08-04 |
TWI493893B (zh) | 2015-07-21 |
US20140132365A1 (en) | 2014-05-15 |
US20140055956A1 (en) | 2014-02-27 |
US8872600B2 (en) | 2014-10-28 |
US20140347145A1 (en) | 2014-11-27 |
JP2014099683A (ja) | 2014-05-29 |
US20140133103A1 (en) | 2014-05-15 |
CN103635021B (zh) | 2016-09-07 |
KR101445543B1 (ko) | 2014-09-29 |
KR20140024802A (ko) | 2014-03-03 |
CN103635021A (zh) | 2014-03-12 |
US8830010B2 (en) | 2014-09-09 |
TW201412036A (zh) | 2014-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5285806B1 (ja) | 高周波回路モジュール | |
JP5117632B1 (ja) | 高周波回路モジュール | |
JP5422078B1 (ja) | 高周波回路モジュール | |
JP5143972B1 (ja) | 高周波回路モジュール | |
JP5677499B2 (ja) | 高周波回路モジュール | |
JP5505915B1 (ja) | 通信モジュール | |
JP5342704B1 (ja) | 高周波回路モジュール | |
JP6438183B2 (ja) | モジュール | |
JP2007036315A (ja) | 高周波電子部品 | |
JP2014099839A (ja) | 高周波回路モジュール | |
JP5420104B1 (ja) | 高周波回路モジュール | |
JP2014039236A (ja) | 高周波回路モジュール | |
WO2013118664A1 (ja) | 高周波モジュール | |
JP5420102B1 (ja) | 高周波回路モジュール | |
JP5420101B1 (ja) | 高周波回路モジュール | |
JP5420103B1 (ja) | 高周波回路モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130508 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130531 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5285806 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |