KR100695547B1 - 반도체 장치 및 그 제조 방법 - Google Patents
반도체 장치 및 그 제조 방법 Download PDFInfo
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- KR100695547B1 KR100695547B1 KR1020010081684A KR20010081684A KR100695547B1 KR 100695547 B1 KR100695547 B1 KR 100695547B1 KR 1020010081684 A KR1020010081684 A KR 1020010081684A KR 20010081684 A KR20010081684 A KR 20010081684A KR 100695547 B1 KR100695547 B1 KR 100695547B1
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- electrode
- storage electrode
- insulating film
- capacitor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 238000003860 storage Methods 0.000 claims abstract description 110
- 239000003990 capacitor Substances 0.000 claims abstract description 107
- 238000009825 accumulation Methods 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims description 81
- 238000000034 method Methods 0.000 claims description 77
- 238000005530 etching Methods 0.000 claims description 41
- 230000005684 electric field Effects 0.000 abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052710 silicon Inorganic materials 0.000 abstract description 17
- 239000010703 silicon Substances 0.000 abstract description 17
- 229910052721 tungsten Inorganic materials 0.000 abstract description 17
- 239000010937 tungsten Substances 0.000 abstract description 17
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract description 15
- 238000002955 isolation Methods 0.000 abstract description 10
- 238000009413 insulation Methods 0.000 abstract description 7
- 239000011229 interlayer Substances 0.000 description 82
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 38
- 229910052707 ruthenium Inorganic materials 0.000 description 38
- 239000010410 layer Substances 0.000 description 35
- 229910052581 Si3N4 Inorganic materials 0.000 description 27
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 21
- 229910052814 silicon oxide Inorganic materials 0.000 description 21
- 238000005229 chemical vapour deposition Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 17
- 238000009792 diffusion process Methods 0.000 description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 13
- 239000001301 oxygen Substances 0.000 description 13
- 229910052760 oxygen Inorganic materials 0.000 description 13
- 239000013078 crystal Substances 0.000 description 10
- 238000001459 lithography Methods 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 3
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- -1 tungsten nitride Chemical class 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004121 SrRuO Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008521 reorganization Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
- H01L28/91—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by depositing layers, e.g. by depositing alternating conductive and insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (10)
- 반도체 기판 상에 형성되어, 축적 전극과, 상기 축적 전극 상에 형성된 커패시터 유전체막과, 상기 커패시터 유전체막 상에 형성된 플레이트 전극으로 이루어지는 커패시터를 갖는 반도체 장치로서,상기 축적 전극은 상단부가 둥글게 되어 있고, 상기 상단부의 두께가 다른 영역의 두께보다도 두꺼운 것을 특징으로 하는 반도체 장치.
- 제 1 항에 있어서,상기 축적 전극은 상기 상단부로 향할수록 두께가 두껍게 되어 있는 것을 특징으로 하는 반도체 장치.
- 제 1 항 또는 제 2 항에 있어서,상기 축적 전극은 측면부가 테이퍼 각도를 갖고, 상기 상단부로 향할수록 외주가 넓어져 있는 것을 특징으로 하는 반도체 장치.
- 제 1 항 또는 제 2 항에 있어서,상기 축적 전극은 원통형상을 갖는 것을 특징으로 하는 반도체 장치.
- 제 4 항에 있어서,상기 축적 전극은 내측면과 저면 사이의 경계 부분이 둥글게 되어 있는 것을 특징으로 하는 반도체 장치.
- 반도체 기판 상에 절연막을 형성하는 공정과,상기 절연막에 개구부를 형성하는 공정과,상기 반도체 기판에 전기적으로 접속되어, 상기 개구부 내에 형성된 축적 전극을 형성하는 공정과,상기 축적 전극의 상단부를 둥글게 하기 위한 열처리를 실행하는 공정과,상기 축적 전극 상에 커패시터 유전체막을 형성하는 공정과,상기 커패시터 유전체막 상에 플레이트 전극을 형성하는 공정을 갖는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제 6 항에 있어서,상기 축적 전극을 형성하는 공정 후에 상기 절연막을 제거하는 공정을 더 갖는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제 6 항 또는 제 7 항에 있어서,상기 축적 전극을 형성하는 공정에서는, 상기 개구부가 적어도 상기 측면을 따라 형성된 라이너막을 통해서 상기 축적 전극을 형성하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제 8 항에 있어서,상기 열처리를 실행하는 공정 전에, 상기 절연막의 표면측으로부터 소정의 양만큼 상기 라이너막을 에칭하는 공정을 더 갖는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제 6 항 또는 제 7 항에 있어서,상기 축적 전극을 형성하는 공정에서는 상기 개구부의 측면 및 바닥부를 따라 형성된 원통형상의 상기 축적 전극을 형성하는 것을 특징으로 하는 반도체 장치의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00394492 | 2000-12-26 | ||
JP2000394492A JP4223189B2 (ja) | 2000-12-26 | 2000-12-26 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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KR20020052945A KR20020052945A (ko) | 2002-07-04 |
KR100695547B1 true KR100695547B1 (ko) | 2007-03-15 |
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KR1020010081684A KR100695547B1 (ko) | 2000-12-26 | 2001-12-20 | 반도체 장치 및 그 제조 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6924526B2 (ko) |
JP (1) | JP4223189B2 (ko) |
KR (1) | KR100695547B1 (ko) |
TW (1) | TW516217B (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4543357B2 (ja) * | 2001-01-19 | 2010-09-15 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
JP2002319636A (ja) * | 2001-02-19 | 2002-10-31 | Nec Corp | 半導体記憶装置及びその製造方法 |
KR100773537B1 (ko) * | 2003-06-03 | 2007-11-07 | 삼성전자주식회사 | 한 개의 스위칭 소자와 한 개의 저항체를 포함하는비휘발성 메모리 장치 및 그 제조 방법 |
JP2005032800A (ja) * | 2003-07-08 | 2005-02-03 | Renesas Technology Corp | 半導体装置の製造方法 |
JP3913203B2 (ja) | 2003-08-28 | 2007-05-09 | 松下電器産業株式会社 | 半導体装置 |
US7582901B2 (en) * | 2004-03-26 | 2009-09-01 | Hitachi, Ltd. | Semiconductor device comprising metal insulator metal (MIM) capacitor |
KR101051704B1 (ko) * | 2004-04-28 | 2011-07-25 | 삼성전자주식회사 | 저항 구배를 지닌 다층막을 이용한 메모리 소자 |
KR100533959B1 (ko) * | 2004-06-30 | 2005-12-06 | 삼성전자주식회사 | 반도체 장치 제조 방법 |
KR100599098B1 (ko) * | 2004-08-26 | 2006-07-12 | 삼성전자주식회사 | 커패시터의 제조 방법 |
KR100682926B1 (ko) * | 2005-01-31 | 2007-02-15 | 삼성전자주식회사 | 저항체를 이용한 비휘발성 메모리 소자 및 그 제조방법 |
KR100717279B1 (ko) * | 2005-08-08 | 2007-05-15 | 삼성전자주식회사 | 마스크롬 소자 및 그 형성 방법 |
KR100809324B1 (ko) * | 2006-02-07 | 2008-03-05 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
WO2007125510A2 (en) * | 2006-05-02 | 2007-11-08 | Nxp B.V. | Electric device comprising an improved electrode with a pillar having protrusions or scores for enhanced stability |
KR100716641B1 (ko) | 2006-06-29 | 2007-05-09 | 주식회사 하이닉스반도체 | 비정질카본층을 이용한 실린더형 캐패시터 제조 방법 |
JP2009032808A (ja) * | 2007-07-25 | 2009-02-12 | Toshiba Corp | 半導体装置 |
JP2010177257A (ja) * | 2009-01-27 | 2010-08-12 | Panasonic Corp | 半導体装置及びその製造方法 |
JP2015053337A (ja) * | 2013-09-05 | 2015-03-19 | マイクロン テクノロジー, インク. | 半導体装置及びその製造方法 |
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KR100319884B1 (ko) * | 1999-04-12 | 2002-01-10 | 윤종용 | 반도체소자의 커패시터 및 그 제조방법 |
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2000
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2001
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KR100306183B1 (ko) * | 1997-07-29 | 2001-11-15 | 니시무로 타이죠 | 반도체장치및그제조방법 |
KR20000038514A (ko) * | 1998-12-08 | 2000-07-05 | 윤종용 | 누설 전류 특성이 개선된 디램 셀 캐패시터의제조 방법 |
KR20010045593A (ko) * | 1999-11-05 | 2001-06-05 | 윤종용 | 반도체 집적회로의 커패시터 제조방법 및 그에 의해제조된 커패시터 |
KR20010069118A (ko) * | 2000-01-12 | 2001-07-23 | 윤종용 | 내면에 반구형 실리콘 돌기를 가지는 실린더형 캐패시터형성 방법 |
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KR20020052945A (ko) | 2002-07-04 |
JP4223189B2 (ja) | 2009-02-12 |
TW516217B (en) | 2003-01-01 |
JP2002198498A (ja) | 2002-07-12 |
US20020079526A1 (en) | 2002-06-27 |
US6924526B2 (en) | 2005-08-02 |
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