KR100661937B1 - 집적된 커패시터를 갖는 전자 패키지 - Google Patents

집적된 커패시터를 갖는 전자 패키지 Download PDF

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KR100661937B1
KR100661937B1 KR1020027009502A KR20027009502A KR100661937B1 KR 100661937 B1 KR100661937 B1 KR 100661937B1 KR 1020027009502 A KR1020027009502 A KR 1020027009502A KR 20027009502 A KR20027009502 A KR 20027009502A KR 100661937 B1 KR100661937 B1 KR 100661937B1
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capacitor
layer
interconnect
conductive
conductive layer
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Expired - Fee Related
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Korean (ko)
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KR20020069020A (ko
Inventor
존 디. 게이신저
폴 엠. 하비
로버트 알. 키에츠케
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쓰리엠 이노베이티브 프로퍼티즈 캄파니
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Publication of KR20020069020A publication Critical patent/KR20020069020A/ko
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Publication of KR100661937B1 publication Critical patent/KR100661937B1/ko
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020027009502A 2000-01-25 2000-05-25 집적된 커패시터를 갖는 전자 패키지 Expired - Fee Related KR100661937B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/491,302 2000-01-25
US09/491,302 US7064412B2 (en) 2000-01-25 2000-01-25 Electronic package with integrated capacitor

Publications (2)

Publication Number Publication Date
KR20020069020A KR20020069020A (ko) 2002-08-28
KR100661937B1 true KR100661937B1 (ko) 2006-12-28

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Country Link
US (2) US7064412B2 (enExample)
EP (1) EP1250709B1 (enExample)
JP (1) JP4878100B2 (enExample)
KR (1) KR100661937B1 (enExample)
AT (1) ATE345576T1 (enExample)
AU (1) AU2000252898A1 (enExample)
DE (1) DE60031887T2 (enExample)
HK (1) HK1051087B (enExample)
WO (1) WO2001056054A1 (enExample)

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US7055119B2 (en) * 2003-07-31 2006-05-30 International Business Machines Corporation Customized mesh plane, method and computer program product for creating customized mesh planes within electronic packages
CN100468612C (zh) * 2004-03-25 2009-03-11 株式会社东芝 半导体器件及其制造方法
US20070177331A1 (en) * 2005-01-10 2007-08-02 Endicott Interconnect Technologies, Inc. Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate
US8607445B1 (en) 2005-01-10 2013-12-17 Endicott Interconnect Technologies, Inc. Substrate having internal capacitor and method of making same
US7772974B2 (en) * 2005-02-28 2010-08-10 Cypak Ab Tamper evident seal system and method
JP4659488B2 (ja) * 2005-03-02 2011-03-30 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
JP4621049B2 (ja) * 2005-03-25 2011-01-26 富士通株式会社 配線基板の製造方法
US20060213957A1 (en) * 2005-03-26 2006-09-28 Addington Cary G Conductive trace formation via wicking action
US7731085B2 (en) * 2006-07-10 2010-06-08 The Procter + Gamble Company Product display
US20080006552A1 (en) * 2006-07-10 2008-01-10 The Procter & Gamble Company Pallet display assembly
US9730078B2 (en) * 2007-08-31 2017-08-08 Fisher-Rosemount Systems, Inc. Configuring and optimizing a wireless mesh network
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US8988093B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Bumped semiconductor wafer or die level electrical interconnect
WO2012061008A1 (en) 2010-10-25 2012-05-10 Hsio Technologies, Llc High performance electrical circuit structure
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US7064412B2 (en) 2006-06-20
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US20030015787A1 (en) 2003-01-23
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US7388275B2 (en) 2008-06-17
EP1250709B1 (en) 2006-11-15
DE60031887D1 (de) 2006-12-28
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US20060203458A1 (en) 2006-09-14

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