DE60031887D1 - Elektronikgehäuse mit kondensator - Google Patents

Elektronikgehäuse mit kondensator

Info

Publication number
DE60031887D1
DE60031887D1 DE60031887T DE60031887T DE60031887D1 DE 60031887 D1 DE60031887 D1 DE 60031887D1 DE 60031887 T DE60031887 T DE 60031887T DE 60031887 T DE60031887 T DE 60031887T DE 60031887 D1 DE60031887 D1 DE 60031887D1
Authority
DE
Germany
Prior art keywords
electrodes
capacitor
electronic package
condenser
electronic housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60031887T
Other languages
English (en)
Other versions
DE60031887T2 (de
Inventor
D Geissinger
M Harvey
R Kieschke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of DE60031887D1 publication Critical patent/DE60031887D1/de
Application granted granted Critical
Publication of DE60031887T2 publication Critical patent/DE60031887T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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Landscapes

  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE60031887T 2000-01-25 2000-05-25 Elektronikgehäuse mit kondensator Expired - Lifetime DE60031887T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US491302 2000-01-25
US09/491,302 US7064412B2 (en) 2000-01-25 2000-01-25 Electronic package with integrated capacitor
PCT/US2000/014414 WO2001056054A1 (en) 2000-01-25 2000-05-25 Electronic package with integrated capacitor

Publications (2)

Publication Number Publication Date
DE60031887D1 true DE60031887D1 (de) 2006-12-28
DE60031887T2 DE60031887T2 (de) 2007-07-05

Family

ID=23951623

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60031887T Expired - Lifetime DE60031887T2 (de) 2000-01-25 2000-05-25 Elektronikgehäuse mit kondensator

Country Status (9)

Country Link
US (2) US7064412B2 (de)
EP (1) EP1250709B1 (de)
JP (1) JP4878100B2 (de)
KR (1) KR100661937B1 (de)
AT (1) ATE345576T1 (de)
AU (1) AU2000252898A1 (de)
DE (1) DE60031887T2 (de)
HK (1) HK1051087B (de)
WO (1) WO2001056054A1 (de)

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US7064412B2 (en) * 2000-01-25 2006-06-20 3M Innovative Properties Company Electronic package with integrated capacitor
US7356952B2 (en) * 2002-06-17 2008-04-15 Philip Morris Usa Inc. System for coupling package displays to remote power source
US7055119B2 (en) * 2003-07-31 2006-05-30 International Business Machines Corporation Customized mesh plane, method and computer program product for creating customized mesh planes within electronic packages
US7202563B2 (en) * 2004-03-25 2007-04-10 Kabushiki Kaisha Toshiba Semiconductor device package having a semiconductor element with resin
US8607445B1 (en) 2005-01-10 2013-12-17 Endicott Interconnect Technologies, Inc. Substrate having internal capacitor and method of making same
US20070177331A1 (en) * 2005-01-10 2007-08-02 Endicott Interconnect Technologies, Inc. Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate
US7772974B2 (en) * 2005-02-28 2010-08-10 Cypak Ab Tamper evident seal system and method
JP4659488B2 (ja) * 2005-03-02 2011-03-30 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
JP4621049B2 (ja) * 2005-03-25 2011-01-26 富士通株式会社 配線基板の製造方法
US20060213957A1 (en) * 2005-03-26 2006-09-28 Addington Cary G Conductive trace formation via wicking action
US20080006552A1 (en) * 2006-07-10 2008-01-10 The Procter & Gamble Company Pallet display assembly
US7731085B2 (en) * 2006-07-10 2010-06-08 The Procter + Gamble Company Product display
US9730078B2 (en) * 2007-08-31 2017-08-08 Fisher-Rosemount Systems, Inc. Configuring and optimizing a wireless mesh network
US9276336B2 (en) 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
WO2011153298A1 (en) 2010-06-03 2011-12-08 Hsio Technologies, Llc Electrical connector insulator housing
US8955215B2 (en) 2009-05-28 2015-02-17 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9536815B2 (en) 2009-05-28 2017-01-03 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
WO2010147939A1 (en) * 2009-06-17 2010-12-23 Hsio Technologies, Llc Semiconductor socket
WO2010141303A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Resilient conductive electrical interconnect
US9414500B2 (en) 2009-06-02 2016-08-09 Hsio Technologies, Llc Compliant printed flexible circuit
WO2010141296A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit semiconductor package
WO2014011226A1 (en) 2012-07-10 2014-01-16 Hsio Technologies, Llc Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
WO2010141297A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit wafer level semiconductor package
US9054097B2 (en) 2009-06-02 2015-06-09 Hsio Technologies, Llc Compliant printed circuit area array semiconductor device package
US8912812B2 (en) 2009-06-02 2014-12-16 Hsio Technologies, Llc Compliant printed circuit wafer probe diagnostic tool
WO2010141313A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit socket diagnostic tool
WO2012061008A1 (en) 2010-10-25 2012-05-10 Hsio Technologies, Llc High performance electrical circuit structure
US8970031B2 (en) 2009-06-16 2015-03-03 Hsio Technologies, Llc Semiconductor die terminal
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HK1051087A1 (en) 2003-07-18
WO2001056054A1 (en) 2001-08-02
AU2000252898A1 (en) 2001-08-07
EP1250709B1 (de) 2006-11-15
KR100661937B1 (ko) 2006-12-28
US20060203458A1 (en) 2006-09-14
US7064412B2 (en) 2006-06-20
JP2003521119A (ja) 2003-07-08
US20030015787A1 (en) 2003-01-23
EP1250709A1 (de) 2002-10-23
HK1051087B (zh) 2007-06-29
JP4878100B2 (ja) 2012-02-15
US7388275B2 (en) 2008-06-17
DE60031887T2 (de) 2007-07-05
KR20020069020A (ko) 2002-08-28

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