HK1051087B - 具有集成電容的電子元件 - Google Patents

具有集成電容的電子元件

Info

Publication number
HK1051087B
HK1051087B HK03101835.4A HK03101835A HK1051087B HK 1051087 B HK1051087 B HK 1051087B HK 03101835 A HK03101835 A HK 03101835A HK 1051087 B HK1051087 B HK 1051087B
Authority
HK
Hong Kong
Prior art keywords
electronic package
electrodes
capacitor
integrated capacitor
electronic
Prior art date
Application number
HK03101835.4A
Other languages
English (en)
Other versions
HK1051087A1 (en
Inventor
John D Geissinger
Paul M Harvey
Robert R Kieschke
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of HK1051087A1 publication Critical patent/HK1051087A1/xx
Publication of HK1051087B publication Critical patent/HK1051087B/zh

Links

Classifications

    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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Landscapes

  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
HK03101835.4A 2000-01-25 2003-03-13 具有集成電容的電子元件 HK1051087B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/491,302 US7064412B2 (en) 2000-01-25 2000-01-25 Electronic package with integrated capacitor
PCT/US2000/014414 WO2001056054A1 (en) 2000-01-25 2000-05-25 Electronic package with integrated capacitor

Publications (2)

Publication Number Publication Date
HK1051087A1 HK1051087A1 (en) 2003-07-18
HK1051087B true HK1051087B (zh) 2007-06-29

Family

ID=23951623

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03101835.4A HK1051087B (zh) 2000-01-25 2003-03-13 具有集成電容的電子元件

Country Status (9)

Country Link
US (2) US7064412B2 (zh)
EP (1) EP1250709B1 (zh)
JP (1) JP4878100B2 (zh)
KR (1) KR100661937B1 (zh)
AT (1) ATE345576T1 (zh)
AU (1) AU2000252898A1 (zh)
DE (1) DE60031887T2 (zh)
HK (1) HK1051087B (zh)
WO (1) WO2001056054A1 (zh)

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US7356952B2 (en) * 2002-06-17 2008-04-15 Philip Morris Usa Inc. System for coupling package displays to remote power source
US7055119B2 (en) * 2003-07-31 2006-05-30 International Business Machines Corporation Customized mesh plane, method and computer program product for creating customized mesh planes within electronic packages
CN100468612C (zh) * 2004-03-25 2009-03-11 株式会社东芝 半导体器件及其制造方法
US20070177331A1 (en) * 2005-01-10 2007-08-02 Endicott Interconnect Technologies, Inc. Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate
US8607445B1 (en) 2005-01-10 2013-12-17 Endicott Interconnect Technologies, Inc. Substrate having internal capacitor and method of making same
US7772974B2 (en) * 2005-02-28 2010-08-10 Cypak Ab Tamper evident seal system and method
JP4659488B2 (ja) * 2005-03-02 2011-03-30 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
JP4621049B2 (ja) * 2005-03-25 2011-01-26 富士通株式会社 配線基板の製造方法
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US7731085B2 (en) * 2006-07-10 2010-06-08 The Procter + Gamble Company Product display
US20080006552A1 (en) * 2006-07-10 2008-01-10 The Procter & Gamble Company Pallet display assembly
US9730078B2 (en) * 2007-08-31 2017-08-08 Fisher-Rosemount Systems, Inc. Configuring and optimizing a wireless mesh network
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US9613841B2 (en) 2009-06-02 2017-04-04 Hsio Technologies, Llc Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
US9930775B2 (en) 2009-06-02 2018-03-27 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
WO2012074963A1 (en) 2010-12-01 2012-06-07 Hsio Technologies, Llc High performance surface mount electrical interconnect
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JP2003521119A (ja) 2003-07-08
ATE345576T1 (de) 2006-12-15
KR100661937B1 (ko) 2006-12-28
US20030015787A1 (en) 2003-01-23
JP4878100B2 (ja) 2012-02-15
HK1051087A1 (en) 2003-07-18
DE60031887T2 (de) 2007-07-05
DE60031887D1 (de) 2006-12-28
EP1250709A1 (en) 2002-10-23
US20060203458A1 (en) 2006-09-14
WO2001056054A1 (en) 2001-08-02
EP1250709B1 (en) 2006-11-15
US7388275B2 (en) 2008-06-17
US7064412B2 (en) 2006-06-20
AU2000252898A1 (en) 2001-08-07
KR20020069020A (ko) 2002-08-28

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