ATE521087T1 - Mehrchipmodule mit eingebetteten kondensatoren - Google Patents

Mehrchipmodule mit eingebetteten kondensatoren

Info

Publication number
ATE521087T1
ATE521087T1 AT99951761T AT99951761T ATE521087T1 AT E521087 T1 ATE521087 T1 AT E521087T1 AT 99951761 T AT99951761 T AT 99951761T AT 99951761 T AT99951761 T AT 99951761T AT E521087 T1 ATE521087 T1 AT E521087T1
Authority
AT
Austria
Prior art keywords
chip modules
multiple chip
capacitors
interconnect layer
embedded capacitors
Prior art date
Application number
AT99951761T
Other languages
English (en)
Inventor
Dennis Kling
Christopher Cotton
Bruce Chignola
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of ATE521087T1 publication Critical patent/ATE521087T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT99951761T 1998-10-02 1999-10-04 Mehrchipmodule mit eingebetteten kondensatoren ATE521087T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10287198P 1998-10-02 1998-10-02
PCT/US1999/023061 WO2000021133A1 (en) 1998-10-02 1999-10-04 Embedded capacitor multi-chip modules

Publications (1)

Publication Number Publication Date
ATE521087T1 true ATE521087T1 (de) 2011-09-15

Family

ID=22292095

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99951761T ATE521087T1 (de) 1998-10-02 1999-10-04 Mehrchipmodule mit eingebetteten kondensatoren

Country Status (5)

Country Link
US (1) US6888218B2 (de)
EP (1) EP1123565B1 (de)
AT (1) ATE521087T1 (de)
AU (1) AU6413199A (de)
WO (1) WO2000021133A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7064412B2 (en) * 2000-01-25 2006-06-20 3M Innovative Properties Company Electronic package with integrated capacitor
US7247932B1 (en) 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
US6970362B1 (en) 2000-07-31 2005-11-29 Intel Corporation Electronic assemblies and systems comprising interposer with embedded capacitors
US6775150B1 (en) 2000-08-30 2004-08-10 Intel Corporation Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
TW575949B (en) * 2001-02-06 2004-02-11 Hitachi Ltd Mixed integrated circuit device, its manufacturing method and electronic apparatus
US7919804B2 (en) * 2005-11-08 2011-04-05 Oracle America, Inc. Power distribution for high-speed integrated circuits
US20090296310A1 (en) * 2008-06-03 2009-12-03 Azuma Chikara Chip capacitor precursors, packaged semiconductors, and assembly method for converting the precursors to capacitors
US9502490B2 (en) 2014-05-21 2016-11-22 Qualcomm Incorporated Embedded package substrate capacitor
US9872392B2 (en) 2016-06-08 2018-01-16 International Business Machines Corporation Power decoupling attachment
US10903543B2 (en) 2016-12-06 2021-01-26 Hewlett Packard Enterprise Development Lp PCB transmission lines having reduced loss

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4453199A (en) * 1983-06-17 1984-06-05 Avx Corporation Low cost thin film capacitor
US4890192A (en) * 1987-04-09 1989-12-26 Microelectronics And Computer Technology Corporation Thin film capacitor
FR2625042B1 (fr) * 1987-12-22 1990-04-20 Thomson Csf Structure microelectronique hybride modulaire a haute densite d'integration
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5274270A (en) * 1990-12-17 1993-12-28 Nchip, Inc. Multichip module having SiO2 insulating layer
US5973910A (en) * 1991-12-31 1999-10-26 Intel Corporation Decoupling capacitor in an integrated circuit
JP3441104B2 (ja) * 1993-04-09 2003-08-25 株式会社東芝 半導体装置
US5841193A (en) * 1996-05-20 1998-11-24 Epic Technologies, Inc. Single chip modules, repairable multichip modules, and methods of fabrication thereof

Also Published As

Publication number Publication date
EP1123565A1 (de) 2001-08-16
AU6413199A (en) 2000-04-26
US20020048927A1 (en) 2002-04-25
EP1123565B1 (de) 2011-08-17
US6888218B2 (en) 2005-05-03
WO2000021133A1 (en) 2000-04-13

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties