ATE345576T1 - Elektronikgehäuse mit kondensator - Google Patents

Elektronikgehäuse mit kondensator

Info

Publication number
ATE345576T1
ATE345576T1 AT00937769T AT00937769T ATE345576T1 AT E345576 T1 ATE345576 T1 AT E345576T1 AT 00937769 T AT00937769 T AT 00937769T AT 00937769 T AT00937769 T AT 00937769T AT E345576 T1 ATE345576 T1 AT E345576T1
Authority
AT
Austria
Prior art keywords
capacitor
electrodes
electronic package
electronic housing
electronic
Prior art date
Application number
AT00937769T
Other languages
English (en)
Inventor
John D Geissinger
Paul M Harvey
Robert R Kieschke
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE345576T1 publication Critical patent/ATE345576T1/de

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • HELECTRICITY
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838Geometry or layout
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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AT00937769T 2000-01-25 2000-05-25 Elektronikgehäuse mit kondensator ATE345576T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/491,302 US7064412B2 (en) 2000-01-25 2000-01-25 Electronic package with integrated capacitor

Publications (1)

Publication Number Publication Date
ATE345576T1 true ATE345576T1 (de) 2006-12-15

Family

ID=23951623

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00937769T ATE345576T1 (de) 2000-01-25 2000-05-25 Elektronikgehäuse mit kondensator

Country Status (9)

Country Link
US (2) US7064412B2 (de)
EP (1) EP1250709B1 (de)
JP (1) JP4878100B2 (de)
KR (1) KR100661937B1 (de)
AT (1) ATE345576T1 (de)
AU (1) AU2000252898A1 (de)
DE (1) DE60031887T2 (de)
HK (1) HK1051087B (de)
WO (1) WO2001056054A1 (de)

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US7064412B2 (en) 2006-06-20
DE60031887D1 (de) 2006-12-28
EP1250709B1 (de) 2006-11-15
KR100661937B1 (ko) 2006-12-28
EP1250709A1 (de) 2002-10-23
WO2001056054A1 (en) 2001-08-02
AU2000252898A1 (en) 2001-08-07
US20030015787A1 (en) 2003-01-23
US20060203458A1 (en) 2006-09-14
HK1051087A1 (en) 2003-07-18
DE60031887T2 (de) 2007-07-05
JP2003521119A (ja) 2003-07-08
HK1051087B (zh) 2007-06-29
JP4878100B2 (ja) 2012-02-15
US7388275B2 (en) 2008-06-17

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