KR100644848B1 - 점착 시트 부착 장치, 점착 시트 부착 방법, 부품 실장기,및 디스플레이 패널의 제조 방법 - Google Patents

점착 시트 부착 장치, 점착 시트 부착 방법, 부품 실장기,및 디스플레이 패널의 제조 방법 Download PDF

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Publication number
KR100644848B1
KR100644848B1 KR1020047003830A KR20047003830A KR100644848B1 KR 100644848 B1 KR100644848 B1 KR 100644848B1 KR 1020047003830 A KR1020047003830 A KR 1020047003830A KR 20047003830 A KR20047003830 A KR 20047003830A KR 100644848 B1 KR100644848 B1 KR 100644848B1
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KR
South Korea
Prior art keywords
adhesive sheet
attachment
cutting
acf
pressure
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020047003830A
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English (en)
Korean (ko)
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KR20040035794A (ko
Inventor
니시모토도모타카
츠지신지로
가타노료우이치로
Original Assignee
마쯔시다덴기산교 가부시키가이샤
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Publication of KR20040035794A publication Critical patent/KR20040035794A/ko
Application granted granted Critical
Publication of KR100644848B1 publication Critical patent/KR100644848B1/ko
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H26/00Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms
    • B65H26/02Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to presence of irregularities in running webs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00Advancing webs
    • B65H20/16Advancing webs by web-gripping means, e.g. grippers, clips
    • B65H20/18Advancing webs by web-gripping means, e.g. grippers, clips to effect step-by-step advancement of web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00Dimensions; Position; Numbers; Identification; Occurrences
    • B65H2511/10Size; Dimensions
    • B65H2511/16Irregularities, e.g. protuberances
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00Dynamic entities; Timing aspects
    • B65H2513/50Timing
    • B65H2513/51Sequence of process
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00Climate change mitigation technologies for sector-wide applications
    • Y02P80/30Reducing waste in manufacturing processes; Calculations of released waste quantities

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Replacement Of Web Rolls (AREA)
  • Labeling Devices (AREA)
KR1020047003830A 2002-01-15 2003-01-14 점착 시트 부착 장치, 점착 시트 부착 방법, 부품 실장기,및 디스플레이 패널의 제조 방법 Expired - Lifetime KR100644848B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002006514A JP3704502B2 (ja) 2002-01-15 2002-01-15 粘着シート貼付装置、粘着シート貼付方法、部品実装機、及びディスププレイパネルの製造方法。
JPJP-P-2002-00006514 2002-01-15
PCT/JP2003/000188 WO2003060988A1 (en) 2002-01-15 2003-01-14 Adhesive sheet stamping device, adhesive sheet stamping method, part mounter, and display panel manufacturing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020067014126A Division KR100729486B1 (ko) 2002-01-15 2003-01-14 점착 시트 부착 장치, 점착 시트 부착 방법, 부품 실장기,및 디스플레이 패널의 제조 방법

Publications (2)

Publication Number Publication Date
KR20040035794A KR20040035794A (ko) 2004-04-29
KR100644848B1 true KR100644848B1 (ko) 2006-11-10

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020047003830A Expired - Lifetime KR100644848B1 (ko) 2002-01-15 2003-01-14 점착 시트 부착 장치, 점착 시트 부착 방법, 부품 실장기,및 디스플레이 패널의 제조 방법
KR1020067014126A Expired - Lifetime KR100729486B1 (ko) 2002-01-15 2003-01-14 점착 시트 부착 장치, 점착 시트 부착 방법, 부품 실장기,및 디스플레이 패널의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020067014126A Expired - Lifetime KR100729486B1 (ko) 2002-01-15 2003-01-14 점착 시트 부착 장치, 점착 시트 부착 방법, 부품 실장기,및 디스플레이 패널의 제조 방법

Country Status (6)

Country Link
US (1) US7285175B2 (enExample)
JP (1) JP3704502B2 (enExample)
KR (2) KR100644848B1 (enExample)
CN (1) CN100355048C (enExample)
TW (1) TW200301946A (enExample)
WO (1) WO2003060988A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100441069C (zh) * 2005-01-21 2008-12-03 财团法人工业技术研究院 电子元件安装及安装方法
WO2006098876A2 (en) 2005-03-11 2006-09-21 The Trustees Of Boston College Microstructures, microdevices and related methods
JP4708896B2 (ja) * 2005-07-20 2011-06-22 芝浦メカトロニクス株式会社 粘着性テープの貼着装置及び貼着方法
JP4965113B2 (ja) * 2005-11-22 2012-07-04 パナソニック株式会社 接合シート貼付装置及び方法
KR100688973B1 (ko) * 2006-02-14 2007-03-08 삼성전자주식회사 전도성 접착소재 가압장치
US7815766B2 (en) 2006-09-28 2010-10-19 Panasonic Corporation Apparatus and method for applying adhesive sheet
KR100788463B1 (ko) * 2006-12-30 2007-12-24 (주)세스텍 엘시디-인쇄회로기판 접합용 본 압착장치의 시트 공급기
JP4952476B2 (ja) * 2007-09-25 2012-06-13 パナソニック株式会社 電子部品実装システム
KR100892026B1 (ko) 2007-11-26 2009-04-07 제일모직주식회사 가압착 공정에서의 생산성이 향상된 이방 전도성 필름
JP5266582B2 (ja) * 2008-12-26 2013-08-21 Nltテクノロジー株式会社 Acf貼付装置及び表示装置の製造方法
JP2010192840A (ja) * 2009-02-20 2010-09-02 Shibaura Mechatronics Corp 粘着テープの貼着装置
JP5190024B2 (ja) * 2009-05-27 2013-04-24 株式会社日立ハイテクノロジーズ Acf貼付装置およびフラットパネルディスプレイの製造装置
CN101840081A (zh) * 2010-04-13 2010-09-22 苏州凯蒂亚半导体制造设备有限公司 一种异方性导电膜贴附机台
CN104914595B (zh) * 2014-03-10 2018-01-09 旭东机械工业股份有限公司 基板压制机构
CN103895897B (zh) * 2014-04-02 2016-04-27 广州市广达精密机械有限公司 一种精密贴合机
JP6577915B2 (ja) * 2015-07-07 2019-09-18 芝浦メカトロニクス株式会社 粘着テープの貼着装置
CN108858451B (zh) * 2018-06-29 2024-03-22 武汉东海敏实汽车零部件有限公司 汽车门框内水切自动冲切线
EP3778158B1 (en) * 2019-08-13 2022-10-05 Cooper Standard GmbH A method and an apparatus for detecting joints on a material strand
JP2022177553A (ja) * 2021-05-18 2022-12-01 Tdk株式会社 基板処理装置
JP7655776B2 (ja) * 2021-05-18 2025-04-02 Tdk株式会社 基板処理装置および基板処理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437749A (en) * 1993-10-04 1995-08-01 Marquip, Inc. Splice synchronization system
JPH07270742A (ja) 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd テープ圧着装置
KR100285171B1 (ko) * 1994-09-30 2001-03-15 모리시타 요이찌 테이프 접착장치 및 방법
JP3206331B2 (ja) * 1994-10-06 2001-09-10 松下電器産業株式会社 異方性導電テープの貼着装置及び異方性導電テープの貼着方法
JP3271537B2 (ja) * 1996-12-13 2002-04-02 松下電器産業株式会社 異方性導電材の貼り付け方法
JP2940537B1 (ja) * 1998-02-25 1999-08-25 日本精機株式会社 包装装置
JP2000357859A (ja) * 1999-06-14 2000-12-26 Seiko Epson Corp 導電膜貼着装置及び導電膜貼着方法
US6520080B1 (en) * 2000-12-15 2003-02-18 Roll Systems, Inc. System and method for utilizing web from a roll having splices
JP2003012222A (ja) * 2001-06-27 2003-01-15 Shibaura Mechatronics Corp 粘着テープの貼付装置及び貼付方法
JP4587624B2 (ja) * 2001-09-27 2010-11-24 芝浦メカトロニクス株式会社 テープ部材の切り込み形成装置および切り込み形成方法、ならびにテープ部材の貼着装置および貼着方法
US6868883B2 (en) * 2002-07-01 2005-03-22 National Gypsum Properties, Llc Apparatus and method for reducing wallboard waste during manufacture

Also Published As

Publication number Publication date
KR100729486B1 (ko) 2007-06-15
KR20040035794A (ko) 2004-04-29
TW200301946A (en) 2003-07-16
JP2003209143A (ja) 2003-07-25
JP3704502B2 (ja) 2005-10-12
US7285175B2 (en) 2007-10-23
TWI293486B (enExample) 2008-02-11
CN100355048C (zh) 2007-12-12
US20050260341A1 (en) 2005-11-24
CN1592961A (zh) 2005-03-09
KR20060086459A (ko) 2006-07-31
WO2003060988A1 (en) 2003-07-24

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