KR100640130B1 - 집적 회로 상호 접속 시스템 - Google Patents

집적 회로 상호 접속 시스템 Download PDF

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Publication number
KR100640130B1
KR100640130B1 KR1020017010806A KR20017010806A KR100640130B1 KR 100640130 B1 KR100640130 B1 KR 100640130B1 KR 1020017010806 A KR1020017010806 A KR 1020017010806A KR 20017010806 A KR20017010806 A KR 20017010806A KR 100640130 B1 KR100640130 B1 KR 100640130B1
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KR
South Korea
Prior art keywords
node
integrated circuit
interconnect system
capacitive element
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020017010806A
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English (en)
Korean (ko)
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KR20020013504A (ko
Inventor
찰스 에이. 밀러
Original Assignee
폼팩터, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/258,185 external-priority patent/US6448865B1/en
Application filed by 폼팩터, 인크. filed Critical 폼팩터, 인크.
Publication of KR20020013504A publication Critical patent/KR20020013504A/ko
Application granted granted Critical
Publication of KR100640130B1 publication Critical patent/KR100640130B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Filters And Equalizers (AREA)
  • Wire Bonding (AREA)
  • Waveguide Connection Structure (AREA)
KR1020017010806A 1999-02-25 2000-02-23 집적 회로 상호 접속 시스템 Expired - Fee Related KR100640130B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/258,185 US6448865B1 (en) 1999-02-25 1999-02-25 Integrated circuit interconnect system
US09/258,185 1999-02-25
US09/510,657 2000-02-21
US09/510,657 US6459343B1 (en) 1999-02-25 2000-02-22 Integrated circuit interconnect system forming a multi-pole filter

Publications (2)

Publication Number Publication Date
KR20020013504A KR20020013504A (ko) 2002-02-20
KR100640130B1 true KR100640130B1 (ko) 2006-10-31

Family

ID=26946481

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017010806A Expired - Fee Related KR100640130B1 (ko) 1999-02-25 2000-02-23 집적 회로 상호 접속 시스템

Country Status (5)

Country Link
US (2) US6459343B1 (https=)
EP (1) EP1200990A2 (https=)
JP (2) JP2003526901A (https=)
KR (1) KR100640130B1 (https=)
WO (1) WO2000051012A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200129663A (ko) * 2019-05-09 2020-11-18 베렉스주식회사 반도체 장치

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Publication number Priority date Publication date Assignee Title
KR20200129663A (ko) * 2019-05-09 2020-11-18 베렉스주식회사 반도체 장치
KR102213561B1 (ko) 2019-05-09 2021-02-08 베렉스주식회사 반도체 장치

Also Published As

Publication number Publication date
US20030006856A1 (en) 2003-01-09
WO2000051012A3 (en) 2001-02-01
JP2007189241A (ja) 2007-07-26
KR20020013504A (ko) 2002-02-20
US6459343B1 (en) 2002-10-01
JP2003526901A (ja) 2003-09-09
US6646520B2 (en) 2003-11-11
WO2000051012A2 (en) 2000-08-31
EP1200990A2 (en) 2002-05-02
WO2000051012A8 (en) 2001-12-06

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