JP2003526901A - 集積回路の相互接続システム - Google Patents

集積回路の相互接続システム

Info

Publication number
JP2003526901A
JP2003526901A JP2000601543A JP2000601543A JP2003526901A JP 2003526901 A JP2003526901 A JP 2003526901A JP 2000601543 A JP2000601543 A JP 2000601543A JP 2000601543 A JP2000601543 A JP 2000601543A JP 2003526901 A JP2003526901 A JP 2003526901A
Authority
JP
Japan
Prior art keywords
node
interconnection system
frequency response
inductor
capacitive element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000601543A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003526901A5 (https=
Inventor
ミラー，チャールズ，エイ
Original Assignee
フォームファクター，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/258,185 external-priority patent/US6448865B1/en
Application filed by フォームファクター，インコーポレイテッド filed Critical フォームファクター，インコーポレイテッド
Publication of JP2003526901A publication Critical patent/JP2003526901A/ja
Publication of JP2003526901A5 publication Critical patent/JP2003526901A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Filters And Equalizers (AREA)
  • Wire Bonding (AREA)
  • Waveguide Connection Structure (AREA)
JP2000601543A 1999-02-25 2000-02-23 集積回路の相互接続システム Pending JP2003526901A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/258,185 US6448865B1 (en) 1999-02-25 1999-02-25 Integrated circuit interconnect system
US09/258,185 1999-02-25
US09/510,657 2000-02-21
US09/510,657 US6459343B1 (en) 1999-02-25 2000-02-22 Integrated circuit interconnect system forming a multi-pole filter
PCT/US2000/004715 WO2000051012A2 (en) 1999-02-25 2000-02-23 Integrated circuit interconnect system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007043028A Division JP2007189241A (ja) 1999-02-25 2007-02-22 集積回路の相互接続システム

Publications (2)

Publication Number Publication Date
JP2003526901A true JP2003526901A (ja) 2003-09-09
JP2003526901A5 JP2003526901A5 (https=) 2007-04-12

Family

ID=26946481

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000601543A Pending JP2003526901A (ja) 1999-02-25 2000-02-23 集積回路の相互接続システム
JP2007043028A Ceased JP2007189241A (ja) 1999-02-25 2007-02-22 集積回路の相互接続システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007043028A Ceased JP2007189241A (ja) 1999-02-25 2007-02-22 集積回路の相互接続システム

Country Status (5)

Country Link
US (2) US6459343B1 (https=)
EP (1) EP1200990A2 (https=)
JP (2) JP2003526901A (https=)
KR (1) KR100640130B1 (https=)
WO (1) WO2000051012A2 (https=)

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JP2004328190A (ja) * 2003-04-23 2004-11-18 Renesas Technology Corp 高周波電力増幅モジュール
US7737553B2 (en) 2004-10-06 2010-06-15 Panasonic Corporation Semiconductor device
JP2013183072A (ja) * 2012-03-02 2013-09-12 Toshiba Corp 半導体装置
JP2014053566A (ja) * 2012-09-10 2014-03-20 Toshiba Corp 半導体装置
JP2014154870A (ja) * 2013-02-14 2014-08-25 Rohm Co Ltd Ｌｓｉのｅｓｄ保護回路および半導体装置
WO2015076008A1 (ja) * 2013-11-20 2015-05-28 株式会社村田製作所 インピーダンス変換回路および通信端末装置
WO2016063459A1 (ja) * 2014-10-24 2016-04-28 株式会社ソシオネクスト 半導体集積回路装置
WO2016063458A1 (ja) * 2014-10-24 2016-04-28 株式会社ソシオネクスト 半導体集積回路装置
KR20210103416A (ko) * 2020-02-13 2021-08-23 쟈인 에레쿠토로닉스 가부시키가이샤 반도체 장치, 수신 장치, 및, 송신 장치

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JP2013183072A (ja) * 2012-03-02 2013-09-12 Toshiba Corp 半導体装置
JP2014053566A (ja) * 2012-09-10 2014-03-20 Toshiba Corp 半導体装置
JP2014154870A (ja) * 2013-02-14 2014-08-25 Rohm Co Ltd Ｌｓｉのｅｓｄ保護回路および半導体装置
WO2015076008A1 (ja) * 2013-11-20 2015-05-28 株式会社村田製作所 インピーダンス変換回路および通信端末装置
WO2016063459A1 (ja) * 2014-10-24 2016-04-28 株式会社ソシオネクスト 半導体集積回路装置
WO2016063458A1 (ja) * 2014-10-24 2016-04-28 株式会社ソシオネクスト 半導体集積回路装置
JPWO2016063459A1 (ja) * 2014-10-24 2017-08-03 株式会社ソシオネクスト 半導体集積回路装置
JPWO2016063458A1 (ja) * 2014-10-24 2017-08-03 株式会社ソシオネクスト 半導体集積回路装置
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JP2021129009A (ja) * 2020-02-13 2021-09-02 ザインエレクトロニクス株式会社 半導体装置
JP7426702B2 (ja) 2020-02-13 2024-02-02 ザインエレクトロニクス株式会社 半導体装置
KR102871611B1 (ko) * 2020-02-13 2025-10-15 쟈인 에레쿠토로닉스 가부시키가이샤 반도체 장치, 수신 장치, 및, 송신 장치

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WO2000051012A3 (en) 2001-02-01
JP2007189241A (ja) 2007-07-26
KR100640130B1 (ko) 2006-10-31
KR20020013504A (ko) 2002-02-20
US6459343B1 (en) 2002-10-01
US6646520B2 (en) 2003-11-11
WO2000051012A2 (en) 2000-08-31
EP1200990A2 (en) 2002-05-02
WO2000051012A8 (en) 2001-12-06

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