KR100621453B1 - 적층판의 절단방법 및 그 절단방법에 사용하는 하프커트장치 - Google Patents

적층판의 절단방법 및 그 절단방법에 사용하는 하프커트장치 Download PDF

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Publication number
KR100621453B1
KR100621453B1 KR1020030042313A KR20030042313A KR100621453B1 KR 100621453 B1 KR100621453 B1 KR 100621453B1 KR 1020030042313 A KR1020030042313 A KR 1020030042313A KR 20030042313 A KR20030042313 A KR 20030042313A KR 100621453 B1 KR100621453 B1 KR 100621453B1
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South Korea
Prior art keywords
laminated
cutting
laminate
predetermined pitch
notch
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KR1020030042313A
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English (en)
Korean (ko)
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KR20040002757A (ko
Inventor
야소다히사시
쯔치다타카시
Original Assignee
유에이치티 가부시키가이샤
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Publication of KR20040002757A publication Critical patent/KR20040002757A/ko
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Publication of KR100621453B1 publication Critical patent/KR100621453B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0675—Grinders for cutting-off methods therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06—Grooving involving removal of material from the surface of the work
    • B26D3/065—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Milling Processes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
KR1020030042313A 2002-06-28 2003-06-27 적층판의 절단방법 및 그 절단방법에 사용하는 하프커트장치 Expired - Lifetime KR100621453B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00190355 2002-06-28
JP2002190355A JP2004034319A (ja) 2002-06-28 2002-06-28 積層板の切断方法及びその切断方法に使用するハーフカット装置

Publications (2)

Publication Number Publication Date
KR20040002757A KR20040002757A (ko) 2004-01-07
KR100621453B1 true KR100621453B1 (ko) 2006-09-13

Family

ID=31700292

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030042313A Expired - Lifetime KR100621453B1 (ko) 2002-06-28 2003-06-27 적층판의 절단방법 및 그 절단방법에 사용하는 하프커트장치

Country Status (4)

Country Link
JP (1) JP2004034319A (enExample)
KR (1) KR100621453B1 (enExample)
CN (1) CN1280074C (enExample)
TW (1) TWI232797B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780752B2 (ja) * 2004-12-28 2011-09-28 Ｕｈｔ株式会社 切断加工装置
CN101160021B (zh) * 2007-10-31 2010-11-10 无锡凯尔科技有限公司 印刷线路板拼板的整板裁切装置及其裁切方法
JP5145499B2 (ja) * 2008-05-14 2013-02-20 国立大学法人福井大学 異形湾曲押出成形品の製造方法およびその製造装置
WO2010074650A1 (en) * 2008-12-23 2010-07-01 Trelleborg Rubore Ab A method of forming a cutting line partially through a multilayer plate structure.
TWI462885B (zh) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
CN102438399B (zh) * 2011-09-30 2014-08-06 景旺电子科技(龙川)有限公司 一种金属基pcb板无间距拼板及其切割方法
CN104028824B (zh) * 2014-06-16 2017-02-15 惠州华阳通用电子有限公司 一种剪断式pcb分板机
CN105174180B (zh) * 2015-09-24 2018-05-01 山东新华医疗器械股份有限公司 塑料安瓿旋转式割缝机构
KR101711451B1 (ko) * 2015-10-05 2017-03-02 양승철 나이프 가공에 의한 프리커팅라인 형성장치
CN105618857A (zh) * 2016-03-28 2016-06-01 胜宏科技（惠州）股份有限公司 一种pcb内斜边制作方法
CN105818177A (zh) * 2016-04-29 2016-08-03 英拓自动化机械（深圳）有限公司 电路板裁切刀具及其裁切电路板的方法
JP6177412B1 (ja) * 2016-11-22 2017-08-09 株式会社ソディック 積層造形装置
CN108040431B (zh) * 2017-12-11 2020-01-07 吉安满坤科技股份有限公司 一种沉铜前锣槽的加工方法
CN108135087A (zh) * 2018-02-05 2018-06-08 江西景旺精密电路有限公司 一种多层pcb大板层压后自动分板的方法
IT201800003287A1 (it) 2018-03-05 2019-09-05 V Shapes S R L Stazione di incisione per macchina confezionatrice e relativo metodo di incisione
TWI659790B (zh) * 2018-10-24 2019-05-21 得力富企業股份有限公司 Multiple half cutting tool set
CN113400383A (zh) * 2021-07-09 2021-09-17 石华 一种改性沥青防水卷材生产工艺
CN114670271A (zh) * 2022-04-06 2022-06-28 林州致远电子科技有限公司 一种pcb覆铜板加工切割一体机
CN118946013A (zh) * 2024-09-05 2024-11-12 江西旭昇电子股份有限公司 一种线路板v-cut制作方法

Also Published As

Publication number Publication date
CN1280074C (zh) 2006-10-18
TW200402354A (en) 2004-02-16
KR20040002757A (ko) 2004-01-07
JP2004034319A (ja) 2004-02-05
CN1480304A (zh) 2004-03-10
TWI232797B (en) 2005-05-21

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