KR100572532B1 - 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판 - Google Patents

난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판 Download PDF

Info

Publication number
KR100572532B1
KR100572532B1 KR1020010063082A KR20010063082A KR100572532B1 KR 100572532 B1 KR100572532 B1 KR 100572532B1 KR 1020010063082 A KR1020010063082 A KR 1020010063082A KR 20010063082 A KR20010063082 A KR 20010063082A KR 100572532 B1 KR100572532 B1 KR 100572532B1
Authority
KR
South Korea
Prior art keywords
prepreg
silicone oligomer
metal hydrate
delete delete
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020010063082A
Other languages
English (en)
Korean (ko)
Other versions
KR20020029639A (ko
Inventor
다까노노조무
후꾸다토미오
미야다께마사토
Original Assignee
히다찌 가세이 고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다찌 가세이 고오교 가부시끼가이샤 filed Critical 히다찌 가세이 고오교 가부시끼가이샤
Publication of KR20020029639A publication Critical patent/KR20020029639A/ko
Application granted granted Critical
Publication of KR100572532B1 publication Critical patent/KR100572532B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31859—Next to an aldehyde or ketone condensation product
    • Y10T428/31862—Melamine-aldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020010063082A 2000-10-13 2001-10-12 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판 Expired - Fee Related KR100572532B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00313720 2000-10-13
JP2000313720 2000-10-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020040086969A Division KR100570924B1 (ko) 2000-10-13 2004-10-29 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판

Publications (2)

Publication Number Publication Date
KR20020029639A KR20020029639A (ko) 2002-04-19
KR100572532B1 true KR100572532B1 (ko) 2006-04-24

Family

ID=18793092

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020010063082A Expired - Fee Related KR100572532B1 (ko) 2000-10-13 2001-10-12 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판
KR1020040086969A Expired - Fee Related KR100570924B1 (ko) 2000-10-13 2004-10-29 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020040086969A Expired - Fee Related KR100570924B1 (ko) 2000-10-13 2004-10-29 난연성 수지 조성물, 그것을 이용한 프리프레그, 적층판,금속 입힌 적층판, 인쇄 배선판 및 다층 인쇄 배선판

Country Status (9)

Country Link
US (1) US6706409B2 (cg-RX-API-DMAC10.html)
EP (1) EP1197514B1 (cg-RX-API-DMAC10.html)
JP (3) JP5186221B2 (cg-RX-API-DMAC10.html)
KR (2) KR100572532B1 (cg-RX-API-DMAC10.html)
CN (1) CN1212354C (cg-RX-API-DMAC10.html)
AT (1) ATE248203T1 (cg-RX-API-DMAC10.html)
DE (1) DE60100652T2 (cg-RX-API-DMAC10.html)
SG (1) SG108282A1 (cg-RX-API-DMAC10.html)
TW (2) TWI293320B (cg-RX-API-DMAC10.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155127A (ja) * 2000-11-22 2002-05-28 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを硬化してなる有機・無機複合体
JP2003003076A (ja) * 2001-06-22 2003-01-08 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、金属箔張積層板及びプリント配線板
CN100339446C (zh) * 2002-04-15 2007-09-26 日本瑞翁株式会社 清漆、成型物、电绝缘膜、层压物、阻燃剂淤浆以及阻燃剂粒子和清漆的制造方法
WO2006057498A1 (en) * 2004-11-26 2006-06-01 Lg Chem, Ltd. Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
US7851536B2 (en) * 2005-09-15 2010-12-14 Rutgers, The State University Flame-retardant coating
TW200831583A (en) * 2006-09-29 2008-08-01 Nippon Catalytic Chem Ind Curable resin composition, optical material, and method of regulating optical material
US7937891B2 (en) * 2006-11-20 2011-05-10 Grassroots Biotechnology, Inc. Plant growth and imaging devices and related methods and computer program products
JP4888719B2 (ja) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 銅張り板
JP5539706B2 (ja) * 2009-12-16 2014-07-02 旭化成ケミカルズ株式会社 プリプレグ、金属箔張積層板、及びプリント配線板
KR20140039034A (ko) * 2011-06-09 2014-03-31 스미또모 세이까 가부시키가이샤 불연 필름, 불연 필름용 분산액, 불연 필름의 제조 방법, 태양 전지 백 시트, 플렉시블 기판, 및 태양 전지
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
CN106364067B (zh) * 2016-08-29 2021-10-12 上海国纪电子材料有限公司 一种p10覆铜板
EP3999516A1 (en) 2019-07-18 2022-05-25 Basf Se Twin-monomer composition and dielectric film thereof
KR102601266B1 (ko) * 2021-04-19 2023-11-13 주식회사 액시드 난연성 필름 및 난연성 필름을 위한 코팅 조성물
KR102807057B1 (ko) * 2021-06-18 2025-05-15 (주)엠케이켐앤텍 폴리실록산 난연성 코팅제, 난연성 폴리실록산, 이의 제조방법 및 이로부터 제조된 난연물품
KR102814780B1 (ko) * 2022-09-05 2025-05-29 주식회사 액시드 난연성 유연 코팅 조성물과 난연성 유연 코팅층을 가지는 난연 제품 및 이를 제조하는 방법
JP7594819B2 (ja) 2022-10-25 2024-12-05 共立エレックス株式会社 自己消火性を有する樹脂材料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731406A (en) * 1985-12-18 1988-03-15 Shin-Etsu Chemical Co., Ltd. Flame-retardant low-smoking rubber composition
EP0906933A1 (en) * 1997-10-01 1999-04-07 Kyowa Chemical Industry Co., Ltd. Flame retardant resin composition

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4686135A (en) * 1985-01-29 1987-08-11 Hiraoka & Co., Ltd. Composite sheet material
US4666765A (en) * 1985-10-02 1987-05-19 Caldwell James M Silicone coated fabric
JPS6322853A (ja) * 1987-02-13 1988-01-30 Hitachi Ltd シリコ−ンフエノ−ル系化合物の組成物、及びその用途
JP2550808B2 (ja) * 1991-08-23 1996-11-06 日立電線株式会社 難燃性電気絶縁組成物および難燃性電線・ケーブル
CN1234791C (zh) * 1995-06-27 2006-01-04 日立化成工业株式会社 树脂漆的制备方法
JP4164883B2 (ja) * 1997-08-19 2008-10-15 日立化成工業株式会社 印刷配線板用樹脂組成物及びそれを用いたプリプレグ、金属張り積層板
JP3297014B2 (ja) 1997-10-01 2002-07-02 協和化学工業株式会社 難燃性樹脂組成物
JP4245197B2 (ja) * 1997-10-08 2009-03-25 日立化成工業株式会社 印刷配線板用プリプレグの製造方法及びこれを用いた金属張積層板
JP3611435B2 (ja) 1997-10-22 2005-01-19 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
JPH11181243A (ja) 1997-12-18 1999-07-06 Hitachi Chem Co Ltd 難燃性エポキシ樹脂組成物及びこの組成物を用いた電気部品
JPH11181380A (ja) 1997-12-19 1999-07-06 Mitsui Chem Inc 難燃性接着剤組成物
JPH11199753A (ja) 1998-01-05 1999-07-27 Toshiba Chem Corp 積層用難燃性樹脂組成物
JPH11217467A (ja) 1998-02-03 1999-08-10 Yazaki Corp ノンハロゲン難燃性樹脂組成物
EP0960855A1 (en) 1998-05-29 1999-12-01 Martinswerk GmbH für chemische und metallurgische Produktion Non hygroscopic thermally stable aluminium hydroxide
CA2272448A1 (en) 1998-05-29 1999-11-29 Martinswerk Gmbh Fur Chemische Und Metallurgische Produktion Non-hygroscopic thermally stable aluminium hydroxide
JP4399061B2 (ja) 1999-10-13 2010-01-13 東レ・ダウコーニング株式会社 難燃性ポリオレフィン系樹脂組成物、その製造方法および難燃性ケーブル
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
JP2001226676A (ja) * 2000-02-14 2001-08-21 Kansai Research Institute 難燃剤、その製造方法及び難燃樹脂組成物
JP4872160B2 (ja) * 2000-03-21 2012-02-08 日立化成工業株式会社 誘電特性に優れる樹脂組成物並びにこれを用いて作製されるワニス、ワニスの製造方法、プリプレグ及び金属張積層板
JP4365987B2 (ja) * 2000-05-15 2009-11-18 協和化学工業株式会社 積層板用材料および電機および電子機器用樹脂組成物およびその成型品
JP3664124B2 (ja) * 2000-10-13 2005-06-22 日立化成工業株式会社 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731406A (en) * 1985-12-18 1988-03-15 Shin-Etsu Chemical Co., Ltd. Flame-retardant low-smoking rubber composition
EP0906933A1 (en) * 1997-10-01 1999-04-07 Kyowa Chemical Industry Co., Ltd. Flame retardant resin composition

Also Published As

Publication number Publication date
TWI293544B (cg-RX-API-DMAC10.html) 2008-02-11
EP1197514A1 (en) 2002-04-17
US6706409B2 (en) 2004-03-16
KR100570924B1 (ko) 2006-04-13
DE60100652D1 (de) 2003-10-02
TWI293320B (cg-RX-API-DMAC10.html) 2008-02-11
ATE248203T1 (de) 2003-09-15
JP2012122081A (ja) 2012-06-28
KR20020029639A (ko) 2002-04-19
DE60100652T2 (de) 2004-06-24
JP2008179819A (ja) 2008-08-07
US20020068173A1 (en) 2002-06-06
TW200423831A (en) 2004-11-01
CN1350031A (zh) 2002-05-22
JP2011099113A (ja) 2011-05-19
EP1197514B1 (en) 2003-08-27
CN1212354C (zh) 2005-07-27
SG108282A1 (en) 2005-01-28
KR20040111217A (ko) 2004-12-31
JP5186221B2 (ja) 2013-04-17

Similar Documents

Publication Publication Date Title
JP5186221B2 (ja) 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板
EP1260551A1 (en) Flame-retardant epoxy resin composition and laminate made with the same
US20140004324A1 (en) Low dielectric resin composition, applicable copper-clad laminate and printed circuit board
CN104583309A (zh) 树脂组成物及应用其之铜箔基板及印刷电路板
CN111655794A (zh) 热固性树脂的含磷聚硅氧烷化合物添加剂、包含其的阻燃组合物和由其制得的制品
TW201940589A (zh) 樹脂組合物、預浸料、層壓板、覆金屬箔層壓板以及印刷電路板
CN101305049B (zh) 印刷电路板用阻燃预浸料坯和层压体
EP1507829A1 (en) Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica
JP3664124B2 (ja) 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板
JP4619084B2 (ja) 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板
JP3484403B2 (ja) リン含有難燃性エポキシレジン、およびその製造方法
CN102369229B (zh) 阻燃性含磷环氧树脂组合物及其固化物
JP2007326956A (ja) プリプレグ、積層板、およびこれらからなるプリント配線板
JP4714970B2 (ja) エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP4821059B2 (ja) 樹脂組成物ならびにそれを用いた難燃性の積層板および印刷配線板
JP4572661B2 (ja) 樹脂組成物、それを用いたプリプレグ、積層板および印刷配線板
JP2002012740A (ja) 難燃性エポキシ樹脂組成物及びその用途
CN111378136B (zh) 活性酯树脂及其制备方法、热固性树脂组合物、半固化片、绝缘薄膜、层压板和印刷电路板
EP2123712A1 (en) Epoxy resin composition and electronic part
JP4984385B2 (ja) エポキシ樹脂組成物およびその硬化物
JP2006137826A (ja) 難燃性樹脂組成物およびその用途
JP4567132B2 (ja) エポキシ樹脂組成物
KR100765898B1 (ko) 인쇄배선판용 수지 조성물, 프리프레그 및 이를 이용한적층판
JP2010159427A (ja) 樹脂組成物、それを用いたプリプレグ、積層板および印刷配線板
JPH0830123B2 (ja) エポキシ樹脂組成物を含浸させた電気絶縁材料用のクロス状またはマット状基材

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

A107 Divisional application of patent
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20130405

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20140404

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20160401

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20180410

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20190414

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20190414

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000