KR100565112B1 - 두 기판의 접속 표면의 열접속 방법 및 열접속 제조용 장치 - Google Patents

두 기판의 접속 표면의 열접속 방법 및 열접속 제조용 장치 Download PDF

Info

Publication number
KR100565112B1
KR100565112B1 KR1020007005515A KR20007005515A KR100565112B1 KR 100565112 B1 KR100565112 B1 KR 100565112B1 KR 1020007005515 A KR1020007005515 A KR 1020007005515A KR 20007005515 A KR20007005515 A KR 20007005515A KR 100565112 B1 KR100565112 B1 KR 100565112B1
Authority
KR
South Korea
Prior art keywords
substrates
laser
substrate
connection
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020007005515A
Other languages
English (en)
Korean (ko)
Other versions
KR20010032305A (ko
Inventor
모메니카베
Original Assignee
파크 테크-파카징 테크놀로지이스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파크 테크-파카징 테크놀로지이스 게엠베하 filed Critical 파크 테크-파카징 테크놀로지이스 게엠베하
Publication of KR20010032305A publication Critical patent/KR20010032305A/ko
Application granted granted Critical
Publication of KR100565112B1 publication Critical patent/KR100565112B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07188—Apparatus chuck
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07235—Applying EM radiation, e.g. induction heating or using a laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Laser Beam Processing (AREA)
KR1020007005515A 1997-11-20 1998-11-20 두 기판의 접속 표면의 열접속 방법 및 열접속 제조용 장치 Expired - Lifetime KR100565112B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19751487A DE19751487A1 (de) 1997-11-20 1997-11-20 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
DE19751487.1 1997-11-20

Publications (2)

Publication Number Publication Date
KR20010032305A KR20010032305A (ko) 2001-04-16
KR100565112B1 true KR100565112B1 (ko) 2006-03-30

Family

ID=7849341

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007005515A Expired - Lifetime KR100565112B1 (ko) 1997-11-20 1998-11-20 두 기판의 접속 표면의 열접속 방법 및 열접속 제조용 장치

Country Status (6)

Country Link
US (1) US6394158B1 (https=)
EP (2) EP1283085B1 (https=)
JP (1) JP2001523585A (https=)
KR (1) KR100565112B1 (https=)
DE (3) DE19751487A1 (https=)
WO (1) WO1999026753A1 (https=)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19901623B4 (de) * 1999-01-18 2007-08-23 Pac Tech-Packaging Technologies Gmbh Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
JP3914670B2 (ja) * 1999-11-18 2007-05-16 パイオニア株式会社 半導体モジュール及び半導体モジュールの半導体レーザ素子の取り付け方法
DE10036900C2 (de) * 2000-07-28 2002-07-11 Siemens Ag Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner
EP1278240A2 (fr) 2001-07-10 2003-01-22 Koninklijke Philips Electronics N.V. Procédé de report d'un composant sur un support de connexion par soudage sans apport de matière
DE10133731C2 (de) * 2001-07-11 2003-08-14 Huf Tools Gmbh Verfahren zum Herstellen eines elektrischen Endprodukts, welches Löt-oder Schweißstellen aufweist
US6574130B2 (en) 2001-07-25 2003-06-03 Nantero, Inc. Hybrid circuit having nanotube electromechanical memory
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US6924538B2 (en) 2001-07-25 2005-08-02 Nantero, Inc. Devices having vertically-disposed nanofabric articles and methods of making the same
US7259410B2 (en) 2001-07-25 2007-08-21 Nantero, Inc. Devices having horizontally-disposed nanofabric articles and methods of making the same
US7335395B2 (en) 2002-04-23 2008-02-26 Nantero, Inc. Methods of using pre-formed nanotubes to make carbon nanotube films, layers, fabrics, ribbons, elements and articles
EP1424156A1 (en) * 2002-11-29 2004-06-02 Leica Geosystems AG Process for soldering miniaturized components onto a base plate
US6796636B2 (en) * 2002-12-17 2004-09-28 Lexmark International, Inc. Two shot molded inkjet printhead lid for laser welding
JP5230099B2 (ja) * 2003-12-03 2013-07-10 パック テック−パッケージング テクノロジーズ ゲーエムベーハー ２つのウェーハを相互接触させる方法および装置
DE10361521A1 (de) * 2003-12-03 2005-07-07 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
US7205938B2 (en) * 2004-03-05 2007-04-17 Airespace, Inc. Wireless node location mechanism responsive to observed propagation characteristics of wireless network infrastructure signals
US7187066B2 (en) * 2004-09-22 2007-03-06 Intel Corporation Radiant energy heating for die attach
KR100740762B1 (ko) * 2005-02-10 2007-07-19 오므론 가부시키가이샤 접합 방법 및 접합 장치
US20060196600A1 (en) * 2005-03-03 2006-09-07 Gi-Jung Nam Apparatus and method for bonding anisotropic conductive film using laser beam
US7538295B2 (en) * 2005-04-21 2009-05-26 Hewlett-Packard Development Company, L.P. Laser welding system
KR101113850B1 (ko) * 2005-08-11 2012-02-29 삼성테크윈 주식회사 플립 칩 본딩 방법 및 이를 채택한 플립 칩 본딩 장치
FR2895924B1 (fr) * 2006-01-10 2009-09-25 Valeo Electronique Sys Liaison Procede de brasage entre eux d'au moins deux organes empiles
JP4514722B2 (ja) * 2006-02-20 2010-07-28 富士通セミコンダクター株式会社 フィルム貼り付け方法、フィルム貼り付け装置および半導体装置の製造方法
JP4880561B2 (ja) * 2007-10-03 2012-02-22 新光電気工業株式会社 フリップチップ実装装置
US20090120916A1 (en) * 2007-11-12 2009-05-14 L3 Communications Corporation Through-Via Laser Reflow Systems And Methods For Surface Mount Components
NL2001958C (en) * 2008-09-05 2010-03-15 Stichting Energie Method of monolithic photo-voltaic module assembly.
JP5294916B2 (ja) * 2009-02-17 2013-09-18 パナソニック株式会社 レーザはんだ付け装置
DE102009017659A1 (de) * 2009-04-16 2010-10-28 Schott Ag Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat
DE102010015520A1 (de) * 2010-04-16 2011-10-20 Pac Tech-Packaging Technologies Gmbh Verfahren und Vorrichtung zur Ausbildung von Lotdepots
JP5589584B2 (ja) * 2010-06-16 2014-09-17 凸版印刷株式会社 レーザ溶接方法、電子部品接続構造及びレーザ溶接検査方法
JP2014506012A (ja) * 2011-02-02 2014-03-06 パック テック−パッケージング テクノロジーズ ゲーエムベーハー ガスフラックス媒体を用いるレーザ半田付けにより２つの基板の端子面を電気的に接触させるための方法および装置
DE102011104159A1 (de) * 2011-06-14 2012-12-20 Institut Für Solarenergieforschung Gmbh Verfahren zum elektrischen verbinden mehrerer solarzellen und photovoltaikmodul
KR20130039955A (ko) * 2011-10-13 2013-04-23 현대자동차주식회사 용접용 레이저 장치
US10099315B2 (en) * 2014-06-27 2018-10-16 Jabil Inc. System, apparatus and method for hybrid function micro welding
DE102015216205A1 (de) * 2015-08-25 2017-03-02 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen einer Steckverbindung, Verfahren zum Verstärken einer Steckverbindung und Vorrichtung
FR3061801A1 (fr) * 2017-01-12 2018-07-13 Commissariat Energie Atomique Procede de connexion electrique entre au moins deux elements
KR101975103B1 (ko) 2017-06-20 2019-05-03 주식회사 프로텍 플립칩 레이저 본딩 장치 및 플립칩 레이저 본딩 방법
KR20180137888A (ko) 2017-06-20 2018-12-28 주식회사 프로텍 반도체 칩 본딩 장치 및 반도체 칩 본딩 방법
KR102394825B1 (ko) 2020-04-23 2022-05-06 주식회사 프로텍 빅셀 소자를 이용한 플립칩 본딩 장치
US20210398936A1 (en) * 2020-06-23 2021-12-23 Amkor Technology Singapore Holding Pte. Ltd. Laser bonded devices, laser bonding tools, and related methods
US20230088061A1 (en) * 2020-06-23 2023-03-23 Amkor Technology Singapore Holding Pte. Ltd. Laser bonded devices, laser bonding tools, and related methods

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE140942C (https=)
US3503804A (en) * 1967-04-25 1970-03-31 Hellmut Schneider Method and apparatus for the production of sonic or ultrasonic waves on a surface
JPS5132836Y2 (https=) * 1972-02-04 1976-08-16
DE2335517C3 (de) * 1973-07-12 1980-04-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Kompensation von Lageabweichungen eines Zifferblattes oder Schildes relativ zu einem Beschriftungsgerät
DD140942A1 (de) * 1978-12-20 1980-04-02 Horst Ahlers Verfahren und anordnung zur mikroverbindungstechnik mittels laser
DE3247338A1 (de) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserloeten von flexiblen verdrahtungen
JPS60172023A (ja) * 1984-02-17 1985-09-05 Nec Corp レ−ザ集光装置
JPS6261789A (ja) * 1985-09-09 1987-03-18 Fuji Electric Co Ltd レ−ザ溶接方法
JPS62108224A (ja) * 1985-11-06 1987-05-19 Inoue Japax Res Inc レ−ザ用レンズ
US4863538A (en) * 1986-10-17 1989-09-05 Board Of Regents, The University Of Texas System Method and apparatus for producing parts by selective sintering
JPS6421997A (en) * 1987-07-16 1989-01-25 Toshiba Corp Method of soldering electronic component
US4845335A (en) * 1988-01-28 1989-07-04 Microelectronics And Computer Technology Corporation Laser Bonding apparatus and method
US4978835A (en) * 1989-08-21 1990-12-18 Microelectronics And Computer Technology Corporation Method of clamping electrical contacts for laser bonding
FR2653367A1 (fr) * 1989-10-24 1991-04-26 Quantel Sa Procede et appareil de brasage au laser.
FR2659886A1 (fr) * 1990-03-26 1991-09-27 Mafond Luc Procede et dispositif destines au chauffage d'une matiere de soudage.
GB2244374B (en) * 1990-05-22 1994-10-05 Stc Plc Improvements in hybrid circuits
JPH0491493A (ja) 1990-08-01 1992-03-24 Nippon Mektron Ltd レーザー半田付け方法とその装置
US5055652A (en) * 1990-10-01 1991-10-08 General Electric Company Laser soldering of flexible leads
JPH04237589A (ja) * 1991-01-21 1992-08-26 Nec Corp レーザ加工装置
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
JPH05109824A (ja) * 1991-10-15 1993-04-30 Omron Corp 電子部品のフリツプチツプ実装方法
JPH0758448A (ja) * 1993-08-09 1995-03-03 Mitsubishi Electric Corp レーザーボンディング装置及び方法
DE4446289C2 (de) * 1994-12-23 1999-02-11 Finn David Verfahren zur Mikroverbindung von Kontaktelementen
DE19504967C2 (de) * 1995-02-15 2002-01-24 Fraunhofer Ges Forschung Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip
JP3285294B2 (ja) * 1995-08-08 2002-05-27 太陽誘電株式会社 回路モジュールの製造方法
JP3779358B2 (ja) * 1995-10-06 2006-05-24 ソニー株式会社 立体形状造形方法
JPH09199846A (ja) * 1996-01-19 1997-07-31 Toshiba Electron Eng Corp 電子部品実装方法および電子部品実装装置
JP3746555B2 (ja) * 1996-02-06 2006-02-15 株式会社フジクラ レーザ加工装置およびこれを用いたレーザ加工方法
US5847356A (en) * 1996-08-30 1998-12-08 Hewlett-Packard Company Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system

Also Published As

Publication number Publication date
EP1283085B1 (de) 2005-06-01
EP1032482A1 (de) 2000-09-06
DE59809879D1 (de) 2003-11-13
WO1999026753A1 (de) 1999-06-03
DE19751487A1 (de) 1999-06-02
DE59812840D1 (de) 2005-07-07
EP1283085A1 (de) 2003-02-12
KR20010032305A (ko) 2001-04-16
US6394158B1 (en) 2002-05-28
EP1032482B1 (de) 2003-10-08
JP2001523585A (ja) 2001-11-27

Similar Documents

Publication Publication Date Title
KR100565112B1 (ko) 두 기판의 접속 표면의 열접속 방법 및 열접속 제조용 장치
CN102853811B (zh) 光学式测距装置和电子设备
US9261362B2 (en) Measuring device for distance measurement
JP4418761B2 (ja) 光電子装置のための組立体、コンタクト及び結合の相互接続
US20070037318A1 (en) Method and apparatus for flip-chip bonding
US20090129412A1 (en) Apparatus for bonding camera module, equipment for assembling camera module having the apparatus, and method of assembling camera module using the equipment
JP3140994B2 (ja) レーザーエネルギーの手段で２つの各々の接触する素子間の接続を生成するデバイス
AU2009316985B2 (en) Mirror structure
JPH09138325A (ja) 光ファイバ実装構造とその製造方法
JP2009075090A (ja) 波面収差計測装置および方法、並びに波面収差調整方法
EP2359109B1 (en) Mirror structure
US20170227811A1 (en) Optical device package, optical switch, and method for manufacturing optical device package
JP3797940B2 (ja) 光伝送モジュールおよびそれを用いた光通信システム
JP4044790B2 (ja) 半導体装置、画像読取ユニット及び画像形成装置
JP2024544904A (ja) 接点接続を確立させるための装置および方法
JP4401795B2 (ja) 光軸ずれの調整方法、及び光軸調整装置
EP2189769A1 (en) Mirror structure
JP7608187B2 (ja) 発光装置の製造方法
CN112912780A (zh) 透镜体接合结构、图像读取装置和透镜体接合方法
EP2189768A1 (en) Mirror Structure
JPH03192208A (ja) 光モジュール
JP4637809B2 (ja) 半導体装置、画像読取ユニット及び画像形成装置
JPH0283984A (ja) 光半導体装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20000519

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20031104

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20050630

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20051223

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20060322

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20060323

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20090116

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20100225

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20110216

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20120206

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20130313

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20130313

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20140313

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20140313

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20150316

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20150316

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20160315

Year of fee payment: 11

PR1001 Payment of annual fee

Payment date: 20160315

Start annual number: 11

End annual number: 11

FPAY Annual fee payment

Payment date: 20170314

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20170314

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20180312

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20180312

Start annual number: 13

End annual number: 13

EXPY Expiration of term
PC1801 Expiration of term

Termination date: 20190520

Termination category: Expiration of duration