DE140942C - - Google Patents

Info

Publication number
DE140942C
DE140942C DENDAT140942D DE140942DA DE140942C DE 140942 C DE140942 C DE 140942C DE NDAT140942 D DENDAT140942 D DE NDAT140942D DE 140942D A DE140942D A DE 140942DA DE 140942 C DE140942 C DE 140942C
Authority
DE
Germany
Prior art keywords
line
beer
valve
catcher
vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DENDAT140942D
Other languages
German (de)
English (en)
Publication of DE140942C publication Critical patent/DE140942C/de
Active legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67D—DISPENSING, DELIVERING OR TRANSFERRING LIQUIDS, NOT OTHERWISE PROVIDED FOR
    • B67D1/00—Apparatus or devices for dispensing beverages on draught
    • B67D1/08—Details
    • B67D1/16—Devices for collecting spilled beverages

Landscapes

  • Devices For Dispensing Beverages (AREA)
DENDAT140942D Active DE140942C (https=)

Publications (1)

Publication Number Publication Date
DE140942C true DE140942C (https=)

Family

ID=408588

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT140942D Active DE140942C (https=)

Country Status (1)

Country Link
DE (1) DE140942C (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6394158B1 (en) 1997-11-20 2002-05-28 Pac Tech Packaging Technologies Gmbh Method and device for thermally bonding connecting surfaces of two substrates
US6478906B1 (en) 1995-02-15 2002-11-12 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E. V. Method for bonding a flexible substrate to a chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6478906B1 (en) 1995-02-15 2002-11-12 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E. V. Method for bonding a flexible substrate to a chip
US6394158B1 (en) 1997-11-20 2002-05-28 Pac Tech Packaging Technologies Gmbh Method and device for thermally bonding connecting surfaces of two substrates

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