KR100489245B1 - 양이온 중합성 수지의 경화 방법 - Google Patents

양이온 중합성 수지의 경화 방법 Download PDF

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Publication number
KR100489245B1
KR100489245B1 KR10-1999-7000095A KR19997000095A KR100489245B1 KR 100489245 B1 KR100489245 B1 KR 100489245B1 KR 19997000095 A KR19997000095 A KR 19997000095A KR 100489245 B1 KR100489245 B1 KR 100489245B1
Authority
KR
South Korea
Prior art keywords
alkyl
substrate
coating
weight
photoinitiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-1999-7000095A
Other languages
English (en)
Korean (ko)
Other versions
KR20000023642A (ko
Inventor
미세프류보미르
Original Assignee
시바 스페셜티 케미칼스 홀딩 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바 스페셜티 케미칼스 홀딩 인크. filed Critical 시바 스페셜티 케미칼스 홀딩 인크.
Publication of KR20000023642A publication Critical patent/KR20000023642A/ko
Application granted granted Critical
Publication of KR100489245B1 publication Critical patent/KR100489245B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR10-1999-7000095A 1996-07-12 1997-07-01 양이온 중합성 수지의 경화 방법 Expired - Fee Related KR100489245B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP96810459.6 1996-07-12
EP96810459 1996-07-12

Publications (2)

Publication Number Publication Date
KR20000023642A KR20000023642A (ko) 2000-04-25
KR100489245B1 true KR100489245B1 (ko) 2005-05-17

Family

ID=8225648

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1999-7000095A Expired - Fee Related KR100489245B1 (ko) 1996-07-12 1997-07-01 양이온 중합성 수지의 경화 방법

Country Status (15)

Country Link
US (1) US6235807B1 (enExample)
EP (1) EP0910612B1 (enExample)
JP (1) JP2000515182A (enExample)
KR (1) KR100489245B1 (enExample)
CN (1) CN1102623C (enExample)
AT (1) ATE279481T1 (enExample)
AU (1) AU710383B2 (enExample)
BR (1) BR9710284A (enExample)
CA (1) CA2258076A1 (enExample)
CZ (1) CZ295709B6 (enExample)
DE (1) DE69731198T2 (enExample)
ES (1) ES2229371T3 (enExample)
RU (1) RU2180669C2 (enExample)
TW (1) TW460509B (enExample)
WO (1) WO1998002493A1 (enExample)

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US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
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US7524614B2 (en) * 2006-05-26 2009-04-28 Eastman Kodak Company Negative-working radiation-sensitive compositions and imageable materials
WO2008049743A1 (en) 2006-10-24 2008-05-02 Ciba Holding Inc. Thermally stable cationic photocurable compositions
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DE102008000721A1 (de) * 2008-03-18 2009-09-24 Evonik Degussa Gmbh Strahlenhärtbare Formulierungen
RU2401703C2 (ru) * 2008-04-22 2010-10-20 Владислав Юрьевич Мирчев Способ отверждения вещества уф-излучением и устройство для его осуществления
EP2283934B1 (en) * 2008-04-22 2018-11-28 Vladislav Yurievich Mirchev Method for curing a substance, device for carrying out said method and ink
WO2011096458A1 (en) * 2010-02-05 2011-08-11 Canon Kabushiki Kaisha Negative photosensitive resin composition, pattern formation method, and liquid discharge head
DE102015200315B4 (de) * 2015-01-13 2018-05-30 Altana Ag Elektroisolierlack für OLED-Leuchtelemente sowie dessen Verwendung
DE102016111590A1 (de) 2016-06-24 2017-12-28 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Einkomponentenmasse auf Basis von Alkoxysilanen und Verfahren zum Fügen oder Vergießen von Bauteilen unter Verwendung der Masse
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DE102017126215A1 (de) 2017-11-09 2019-05-09 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Verfahren zur Erzeugung opaker Beschichtungen, Verklebungen und Vergüsse sowie härtbare Masse zur Verwendung in dem Verfahren
EP3728490B1 (en) * 2017-12-18 2022-02-09 Agfa-Gevaert Nv Solder mask inkjet inks for manufacturing printed circuit boards
DE102018127854A1 (de) 2018-11-08 2020-05-14 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Feuchtigkeitshärtbare Einkomponentenmasse und Verfahren zum Fügen, Vergießen und Beschichten unter Verwendung der Masse
DE102018131513A1 (de) 2018-12-10 2020-06-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch härtbare Masse und Verfahren zum Fügen, Vergießen und Beschichten von Substraten unter Verwendung der Masse
TWI916580B (zh) * 2021-06-08 2026-03-01 瑞士商西克帕控股有限公司 用於安全性文件之混合型ｕｖ-ｌｅｄ輻射可固化的保護清漆及其塗佈方法
IT202200009425A1 (it) * 2022-05-09 2023-11-09 Elixe S R L Rivestimento ibrido cationico a polimerizzazione uv e sua composizione
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Also Published As

Publication number Publication date
ES2229371T3 (es) 2005-04-16
AU710383B2 (en) 1999-09-16
US6235807B1 (en) 2001-05-22
RU2180669C2 (ru) 2002-03-20
JP2000515182A (ja) 2000-11-14
CN1102623C (zh) 2003-03-05
CZ5799A3 (cs) 1999-04-14
CZ295709B6 (cs) 2005-10-12
CN1225109A (zh) 1999-08-04
EP0910612A1 (en) 1999-04-28
DE69731198T2 (de) 2006-03-09
KR20000023642A (ko) 2000-04-25
EP0910612B1 (en) 2004-10-13
CA2258076A1 (en) 1998-01-22
AU3441097A (en) 1998-02-09
ATE279481T1 (de) 2004-10-15
BR9710284A (pt) 1999-08-17
DE69731198D1 (de) 2004-11-18
TW460509B (en) 2001-10-21
WO1998002493A1 (en) 1998-01-22

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Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20090504