ES2090568T3 - Composiciones reticulables termicamente. - Google Patents

Composiciones reticulables termicamente.

Info

Publication number
ES2090568T3
ES2090568T3 ES92810237T ES92810237T ES2090568T3 ES 2090568 T3 ES2090568 T3 ES 2090568T3 ES 92810237 T ES92810237 T ES 92810237T ES 92810237 T ES92810237 T ES 92810237T ES 2090568 T3 ES2090568 T3 ES 2090568T3
Authority
ES
Spain
Prior art keywords
anions
compound
binders
initiator
additive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92810237T
Other languages
English (en)
Inventor
Dieter Baumann
Werner Margotte
Beat Dr Muller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Application granted granted Critical
Publication of ES2090568T3 publication Critical patent/ES2090568T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Abstract

COMPOSICIONES TERMICAMENTE ENDURECIBLES. ESTE DOCUMENTO DESCRIBE LA UTILIZACION DE UN INHIBIDOR PARA LA POLIMERIZACION CATIONICA, COMO ADITIVO PARA UNA COMPOSICION TERMICAMENTE ENDURECIBLE, A BASE DE AL MENOS UN MATERIAL ORGANICO CATIONICO POLIMERIZABLE, Y DE UN INICIADOR PARA LA POLIMERIZACION CATIONICA EN FORMA DE UN COMPUESTO DE ONIO O DE UN COMPUESTO DE LA FORMULA (I) EN DONDE N ES IGUAL A 2 O 3, M EQUIVALE A UN CATION METALICO ESCOGIDO DEL GRUPO COMPUESTO POR ZN2+, MG2+, FE2+, CO2+, NI2+, CR2+, RU2+, MN2+, SN2+, VO2+, FE3+, AL3+, Y CO3+, XPF6-, ASF6-, SBF6-, BIF6-, DE LOS DERIVADOS DE ESTOS ANIONES, DONDE AL MENOS SE HA SUSTITUIDO UN ATOMO DE FLUOR POR UN GRUPO HIDROXILO, Y CF3SO3 -, O DONDE HASTA EL 50% DE LOS ANIONES X-, REFERIDOS AL CONJUNTO DE LOS ANIONES, TAMBIEN PUEDE SER CUALQUIER ANION, L ES AGUA O UN LIGANTE ORGANICO DONOR O, QUE PRESENTA COMO LUGARES DE LIGANTES A UNO O MAS RESTOS FUNCIONALES ELEGIDOS DEL GRUPO COMPUESTO POR CO -, O - O -, Y QUE FORMA MEDIANTE EL ATOMO DE OXIGENO O MEDIANTE LOS ATOMOS DE OXIGENO CON EL ATOMO CENTRAL ENLACES O, Y X SIGNIFICA UN NUMERO ENTERO ENTRE 0 Y 6, Y DONDE LOS LIGANTES L, EN EL MARCO DE LA DEFINICION DADA, PUEDEN SER DIFERENTES, O COMO ADITIVO A LOS COMPONENTES PARA LA OBTENCION DE UN COMPUESTO SIMILAR, PARA EVITAR LOS PRODUCTOS DE DISGREGACION DEL INICIADOR CONDICIONADOS POR LA HUMEDAD QUE REDUCEN LA ESTABILIDAD TERMICA DEL COMPUESTO Y/O PARA UNA ELEVACION DE LA ESTABILIDAD TERMICA DEL COMPUESTO, QUE ESTA LIMITADA A UN MARGEN DE TIEMPO ANTES DEL ENDURECIMIENTO
ES92810237T 1991-04-08 1992-03-31 Composiciones reticulables termicamente. Expired - Lifetime ES2090568T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH102991 1991-04-08

Publications (1)

Publication Number Publication Date
ES2090568T3 true ES2090568T3 (es) 1996-10-16

Family

ID=4200791

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92810237T Expired - Lifetime ES2090568T3 (es) 1991-04-08 1992-03-31 Composiciones reticulables termicamente.

Country Status (7)

Country Link
US (1) US5296567A (es)
EP (1) EP0508951B1 (es)
JP (1) JP2704690B2 (es)
KR (1) KR100216155B1 (es)
DE (1) DE59206930D1 (es)
DK (1) DK0508951T3 (es)
ES (1) ES2090568T3 (es)

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JPH055006A (ja) * 1990-11-16 1993-01-14 Nippon Kayaku Co Ltd カチオン重合性有機材料組成物および当該組成物の安定化法
TW237466B (es) * 1992-07-21 1995-01-01 Giba Gerigy Ag
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US5494943A (en) * 1993-06-16 1996-02-27 Minnesota Mining And Manufacturing Company Stabilized cationically-curable compositions
JP4539644B2 (ja) * 1993-07-29 2010-09-08 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
JP3907217B2 (ja) * 1993-07-29 2007-04-18 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
DE4340949A1 (de) * 1993-12-01 1995-06-08 Thera Ges Fuer Patente Lichtinitiiert kationisch härtende Epoxidmasse und ihre Verwendung
KR100399332B1 (ko) 1994-12-26 2003-09-26 히다치 가세고교 가부시끼가이샤 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체장치의 제조방법
TW310481B (es) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US6717242B2 (en) * 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
EP0799682A3 (de) * 1996-04-04 1998-01-21 Ciba SC Holding AG Herstellung von Formkörpern aus Epoxidharzen mit Hilfe der automatischen Druckgeliertechnik
TW460509B (en) * 1996-07-12 2001-10-21 Ciba Sc Holding Ag Curing process for cationically photocurable formulations
JP3626302B2 (ja) * 1996-12-10 2005-03-09 Ｊｓｒ株式会社 光硬化性樹脂組成物
DE69721309T9 (de) * 1997-01-06 2005-03-10 QUANTUM MATERIALS, INC., San Diego Verminderung der bildung von hohlräumen in härtbaren klebstoffzusammensetzungen
WO1999020702A1 (fr) * 1997-10-20 1999-04-29 Kansai Paint Co., Ltd. Composition de revetement et procede de revetement avec celle-ci
DE19810549A1 (de) * 1998-03-11 1999-09-16 Delo Industrieklebstoffe Gmbh Polymerisierbare fluorhaltige Zubereitung, ihre Verwendung und Verfahren zur Herstellung ausgehärteter Polymermassen aus dieser Zubereitung
US6187965B1 (en) 1998-11-06 2001-02-13 International Business Machines Corporation Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric units
US5994597A (en) * 1998-11-06 1999-11-30 International Business Machines Corporation Process for recovering high boiling solvents from a photolithographic waste stream comprising less than 10 percent by weight monomeric units
JP2004323642A (ja) * 2003-04-23 2004-11-18 Riso Kagaku Corp カチオン重合性組成物及びインク
JP4569095B2 (ja) * 2003-11-11 2010-10-27 コニカミノルタエムジー株式会社 カチオン重合性組成物、活性エネルギー線硬化型インクジェットインク、カチオン重合性組成物の製造方法及び活性エネルギー線硬化型インクジェットインクの製造方法
JP2005325312A (ja) * 2004-05-17 2005-11-24 Hitachi Chem Co Ltd 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法
JP2006089722A (ja) * 2004-08-26 2006-04-06 Konica Minolta Medical & Graphic Inc カチオン重合性組成物、活性エネルギー線硬化型インクジェットインク及びカチオン重合性組成物の製造方法
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
CN102119184A (zh) * 2008-08-12 2011-07-06 亨斯迈先进材料（瑞士）有限公司 热固性组合物
JP2011080017A (ja) * 2009-10-09 2011-04-21 Denso Corp カチオン重合性組成物
JP2015209492A (ja) * 2014-04-25 2015-11-24 旭化成イーマテリアルズ株式会社 液状硬化剤、硬化性樹脂組成物、ファイン化学品及び組成物
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
DE102022106647A1 (de) 2022-03-22 2023-09-28 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Niedertemperaturhärtende Massen auf Basis von Glycidylethern

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* Cited by examiner, † Cited by third party
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US3677978A (en) * 1971-08-23 1972-07-18 Ppg Industries Inc Metal salt complexes of imidazoles as curing agents for one-part epoxy resins
GB1512982A (en) * 1974-05-02 1978-06-01 Gen Electric Salts
US4058400A (en) * 1974-05-02 1977-11-15 General Electric Company Cationically polymerizable compositions containing group VIa onium salts
US4058401A (en) * 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
US4473674A (en) * 1983-11-03 1984-09-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for improving mechanical properties of epoxy resins by addition of cobalt ions
US4554342A (en) * 1984-07-30 1985-11-19 Shell Oil Company Heat-curable compositions comprising an epoxy resin, an amine and a sulfonium salt
JPS61283618A (ja) * 1985-06-10 1986-12-13 Hitachi Chem Co Ltd 光硬化性エポキシ樹脂組成物
ES2045878T3 (es) * 1989-01-16 1994-01-16 Ciba Geigy Ag Sales de sulfonio aralifaticas y su utilizacion.
ES2085294T3 (es) * 1989-03-21 1996-06-01 Ciba Geigy Ag Iniciadores para materiales de polimerizacion cationica.
SE8901048D0 (sv) * 1989-03-23 1989-03-23 Becker Wilhelm Ab Polymerisationsinitiator

Also Published As

Publication number Publication date
KR100216155B1 (ko) 1999-08-16
EP0508951A3 (en) 1993-10-06
DE59206930D1 (de) 1996-09-26
JPH05132505A (ja) 1993-05-28
KR920019823A (ko) 1992-11-20
EP0508951A2 (de) 1992-10-14
EP0508951B1 (de) 1996-08-21
JP2704690B2 (ja) 1998-01-26
DK0508951T3 (da) 1996-09-09
US5296567A (en) 1994-03-22

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