DK0508951T3 - Varmehærdelige blandinger - Google Patents

Varmehærdelige blandinger

Info

Publication number
DK0508951T3
DK0508951T3 DK92810237.5T DK92810237T DK0508951T3 DK 0508951 T3 DK0508951 T3 DK 0508951T3 DK 92810237 T DK92810237 T DK 92810237T DK 0508951 T3 DK0508951 T3 DK 0508951T3
Authority
DK
Denmark
Prior art keywords
heat curable
curable mixtures
mixtures
heat
curable
Prior art date
Application number
DK92810237.5T
Other languages
Danish (da)
English (en)
Inventor
Dieter Baumann
Werner Margotte
Beat Dr Mueller
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Application granted granted Critical
Publication of DK0508951T3 publication Critical patent/DK0508951T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Polymerization Catalysts (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
DK92810237.5T 1991-04-08 1992-03-31 Varmehærdelige blandinger DK0508951T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH102991 1991-04-08

Publications (1)

Publication Number Publication Date
DK0508951T3 true DK0508951T3 (da) 1996-09-09

Family

ID=4200791

Family Applications (1)

Application Number Title Priority Date Filing Date
DK92810237.5T DK0508951T3 (da) 1991-04-08 1992-03-31 Varmehærdelige blandinger

Country Status (7)

Country Link
US (1) US5296567A (es)
EP (1) EP0508951B1 (es)
JP (1) JP2704690B2 (es)
KR (1) KR100216155B1 (es)
DE (1) DE59206930D1 (es)
DK (1) DK0508951T3 (es)
ES (1) ES2090568T3 (es)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH055006A (ja) * 1990-11-16 1993-01-14 Nippon Kayaku Co Ltd カチオン重合性有機材料組成物および当該組成物の安定化法
TW237466B (es) * 1992-07-21 1995-01-01 Giba Gerigy Ag
US5494943A (en) * 1993-06-16 1996-02-27 Minnesota Mining And Manufacturing Company Stabilized cationically-curable compositions
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
JP3907217B2 (ja) * 1993-07-29 2007-04-18 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
JP4539644B2 (ja) * 1993-07-29 2010-09-08 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
DE4340949A1 (de) * 1993-12-01 1995-06-08 Thera Ges Fuer Patente Lichtinitiiert kationisch härtende Epoxidmasse und ihre Verwendung
WO1996029730A1 (fr) 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Procede de stratification utilisant un film de stratification en un materiau organique adherant a la matrice, procede d'adhesion a la matrice, dispositif de stratification, dispositif d'adhesion a la matrice, dispositif semi-conducteur et procede pour fabriquer le dispositif semi-conducteur
TW310481B (es) * 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US7012320B2 (en) * 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
EP0799682A3 (de) * 1996-04-04 1998-01-21 Ciba SC Holding AG Herstellung von Formkörpern aus Epoxidharzen mit Hilfe der automatischen Druckgeliertechnik
TW460509B (en) * 1996-07-12 2001-10-21 Ciba Sc Holding Ag Curing process for cationically photocurable formulations
JP3626302B2 (ja) * 1996-12-10 2005-03-09 Ｊｓｒ株式会社 光硬化性樹脂組成物
KR20000069904A (ko) * 1997-01-06 2000-11-25 프랭크 디. 휴슨, 쥬니어 경화성 접착 제제에서의 공극 형성의 저하 방법
KR100442176B1 (ko) * 1997-10-20 2004-07-30 간사이 페인트 가부시키가이샤 도료 조성물 및 그 도장법
DE19810549A1 (de) * 1998-03-11 1999-09-16 Delo Industrieklebstoffe Gmbh Polymerisierbare fluorhaltige Zubereitung, ihre Verwendung und Verfahren zur Herstellung ausgehärteter Polymermassen aus dieser Zubereitung
US6187965B1 (en) 1998-11-06 2001-02-13 International Business Machines Corporation Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric units
US5994597A (en) * 1998-11-06 1999-11-30 International Business Machines Corporation Process for recovering high boiling solvents from a photolithographic waste stream comprising less than 10 percent by weight monomeric units
JP2004323642A (ja) * 2003-04-23 2004-11-18 Riso Kagaku Corp カチオン重合性組成物及びインク
JP4569095B2 (ja) * 2003-11-11 2010-10-27 コニカミノルタエムジー株式会社 カチオン重合性組成物、活性エネルギー線硬化型インクジェットインク、カチオン重合性組成物の製造方法及び活性エネルギー線硬化型インクジェットインクの製造方法
JP2005325312A (ja) * 2004-05-17 2005-11-24 Hitachi Chem Co Ltd 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法
JP2006089722A (ja) * 2004-08-26 2006-04-06 Konica Minolta Medical & Graphic Inc カチオン重合性組成物、活性エネルギー線硬化型インクジェットインク及びカチオン重合性組成物の製造方法
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
KR101627598B1 (ko) * 2008-08-12 2016-06-07 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 열경화성 조성물
JP2011080017A (ja) * 2009-10-09 2011-04-21 Denso Corp カチオン重合性組成物
JP2015209492A (ja) * 2014-04-25 2015-11-24 旭化成イーマテリアルズ株式会社 液状硬化剤、硬化性樹脂組成物、ファイン化学品及び組成物
DE102022102650A1 (de) 2022-02-04 2023-08-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Kationisch polymerisierbare flammgeschützte Massen
DE102022106647A1 (de) 2022-03-22 2023-09-28 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Niedertemperaturhärtende Massen auf Basis von Glycidylethern

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3677978A (en) * 1971-08-23 1972-07-18 Ppg Industries Inc Metal salt complexes of imidazoles as curing agents for one-part epoxy resins
US4058401A (en) * 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
US4058400A (en) * 1974-05-02 1977-11-15 General Electric Company Cationically polymerizable compositions containing group VIa onium salts
GB1512981A (en) * 1974-05-02 1978-06-01 Gen Electric Curable epoxide compositions
US4473674A (en) * 1983-11-03 1984-09-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for improving mechanical properties of epoxy resins by addition of cobalt ions
US4554342A (en) * 1984-07-30 1985-11-19 Shell Oil Company Heat-curable compositions comprising an epoxy resin, an amine and a sulfonium salt
JPS61283618A (ja) * 1985-06-10 1986-12-13 Hitachi Chem Co Ltd 光硬化性エポキシ樹脂組成物
ES2045878T3 (es) * 1989-01-16 1994-01-16 Ciba Geigy Ag Sales de sulfonio aralifaticas y su utilizacion.
CA2012502A1 (en) * 1989-03-21 1990-09-21 Novartis Ag Initiators for materials which can be polymerized cationically
SE8901048D0 (sv) * 1989-03-23 1989-03-23 Becker Wilhelm Ab Polymerisationsinitiator

Also Published As

Publication number Publication date
DE59206930D1 (de) 1996-09-26
JP2704690B2 (ja) 1998-01-26
ES2090568T3 (es) 1996-10-16
JPH05132505A (ja) 1993-05-28
EP0508951A3 (en) 1993-10-06
EP0508951B1 (de) 1996-08-21
US5296567A (en) 1994-03-22
KR100216155B1 (ko) 1999-08-16
EP0508951A2 (de) 1992-10-14
KR920019823A (ko) 1992-11-20

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