DE59206930D1 - Thermisch härtbare Zusammensetzungen - Google Patents
Thermisch härtbare ZusammensetzungenInfo
- Publication number
- DE59206930D1 DE59206930D1 DE59206930T DE59206930T DE59206930D1 DE 59206930 D1 DE59206930 D1 DE 59206930D1 DE 59206930 T DE59206930 T DE 59206930T DE 59206930 T DE59206930 T DE 59206930T DE 59206930 D1 DE59206930 D1 DE 59206930D1
- Authority
- DE
- Germany
- Prior art keywords
- curable compositions
- thermally curable
- thermally
- compositions
- curable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Polymerization Catalysts (AREA)
- Paints Or Removers (AREA)
- Polymerisation Methods In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH102991 | 1991-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59206930D1 true DE59206930D1 (de) | 1996-09-26 |
Family
ID=4200791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE59206930T Expired - Lifetime DE59206930D1 (de) | 1991-04-08 | 1992-03-31 | Thermisch härtbare Zusammensetzungen |
Country Status (7)
Country | Link |
---|---|
US (1) | US5296567A (es) |
EP (1) | EP0508951B1 (es) |
JP (1) | JP2704690B2 (es) |
KR (1) | KR100216155B1 (es) |
DE (1) | DE59206930D1 (es) |
DK (1) | DK0508951T3 (es) |
ES (1) | ES2090568T3 (es) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH055006A (ja) * | 1990-11-16 | 1993-01-14 | Nippon Kayaku Co Ltd | カチオン重合性有機材料組成物および当該組成物の安定化法 |
TW237466B (es) * | 1992-07-21 | 1995-01-01 | Giba Gerigy Ag | |
US5494943A (en) * | 1993-06-16 | 1996-02-27 | Minnesota Mining And Manufacturing Company | Stabilized cationically-curable compositions |
US5362421A (en) * | 1993-06-16 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive compositions |
JP3907217B2 (ja) * | 1993-07-29 | 2007-04-18 | 日立化成工業株式会社 | 回路接続材料とその接続材料を用いた回路の接続方法 |
JP4539644B2 (ja) * | 1993-07-29 | 2010-09-08 | 日立化成工業株式会社 | 回路接続材料とその接続材料を用いた回路の接続方法 |
DE4340949A1 (de) * | 1993-12-01 | 1995-06-08 | Thera Ges Fuer Patente | Lichtinitiiert kationisch härtende Epoxidmasse und ihre Verwendung |
KR100333452B1 (ko) | 1994-12-26 | 2002-04-18 | 이사오 우치가사키 | 필름 형상의 유기 다이본딩재 및 이를 이용한 반도체 장치 |
TW310481B (es) * | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
US6717242B2 (en) * | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
EP0799682A3 (de) * | 1996-04-04 | 1998-01-21 | Ciba SC Holding AG | Herstellung von Formkörpern aus Epoxidharzen mit Hilfe der automatischen Druckgeliertechnik |
TW460509B (en) * | 1996-07-12 | 2001-10-21 | Ciba Sc Holding Ag | Curing process for cationically photocurable formulations |
JP3626302B2 (ja) * | 1996-12-10 | 2005-03-09 | Jsr株式会社 | 光硬化性樹脂組成物 |
KR20000069904A (ko) * | 1997-01-06 | 2000-11-25 | 프랭크 디. 휴슨, 쥬니어 | 경화성 접착 제제에서의 공극 형성의 저하 방법 |
CA2307100A1 (en) * | 1997-10-20 | 1999-04-29 | Satoshi Ikushima | A coating composition and a method for coating thereof |
DE19810549A1 (de) | 1998-03-11 | 1999-09-16 | Delo Industrieklebstoffe Gmbh | Polymerisierbare fluorhaltige Zubereitung, ihre Verwendung und Verfahren zur Herstellung ausgehärteter Polymermassen aus dieser Zubereitung |
US6187965B1 (en) | 1998-11-06 | 2001-02-13 | International Business Machines Corporation | Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric units |
US5994597A (en) * | 1998-11-06 | 1999-11-30 | International Business Machines Corporation | Process for recovering high boiling solvents from a photolithographic waste stream comprising less than 10 percent by weight monomeric units |
JP2004323642A (ja) * | 2003-04-23 | 2004-11-18 | Riso Kagaku Corp | カチオン重合性組成物及びインク |
JP4569095B2 (ja) * | 2003-11-11 | 2010-10-27 | コニカミノルタエムジー株式会社 | カチオン重合性組成物、活性エネルギー線硬化型インクジェットインク、カチオン重合性組成物の製造方法及び活性エネルギー線硬化型インクジェットインクの製造方法 |
JP2005325312A (ja) * | 2004-05-17 | 2005-11-24 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
JP2006089722A (ja) * | 2004-08-26 | 2006-04-06 | Konica Minolta Medical & Graphic Inc | カチオン重合性組成物、活性エネルギー線硬化型インクジェットインク及びカチオン重合性組成物の製造方法 |
DE102005040126A1 (de) * | 2005-08-25 | 2007-03-01 | Altana Electrical Insulation Gmbh | Überzugsmasse |
US20110135944A1 (en) * | 2008-08-12 | 2011-06-09 | Huntsman International Llc | Thermosetting composition |
JP2011080017A (ja) * | 2009-10-09 | 2011-04-21 | Denso Corp | カチオン重合性組成物 |
JP2015209492A (ja) * | 2014-04-25 | 2015-11-24 | 旭化成イーマテリアルズ株式会社 | 液状硬化剤、硬化性樹脂組成物、ファイン化学品及び組成物 |
DE102022102650A1 (de) | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Kationisch polymerisierbare flammgeschützte Massen |
DE102022106647A1 (de) | 2022-03-22 | 2023-09-28 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Niedertemperaturhärtende Massen auf Basis von Glycidylethern |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3677978A (en) * | 1971-08-23 | 1972-07-18 | Ppg Industries Inc | Metal salt complexes of imidazoles as curing agents for one-part epoxy resins |
GB1512982A (en) * | 1974-05-02 | 1978-06-01 | Gen Electric | Salts |
US4058400A (en) * | 1974-05-02 | 1977-11-15 | General Electric Company | Cationically polymerizable compositions containing group VIa onium salts |
US4058401A (en) * | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
US4473674A (en) * | 1983-11-03 | 1984-09-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for improving mechanical properties of epoxy resins by addition of cobalt ions |
US4554342A (en) * | 1984-07-30 | 1985-11-19 | Shell Oil Company | Heat-curable compositions comprising an epoxy resin, an amine and a sulfonium salt |
JPS61283618A (ja) * | 1985-06-10 | 1986-12-13 | Hitachi Chem Co Ltd | 光硬化性エポキシ樹脂組成物 |
ES2045878T3 (es) * | 1989-01-16 | 1994-01-16 | Ciba Geigy Ag | Sales de sulfonio aralifaticas y su utilizacion. |
EP0388837B1 (de) * | 1989-03-21 | 1996-04-10 | Ciba-Geigy Ag | Initiatoren für kationisch polymerisierbare Materialien |
SE8901048D0 (sv) * | 1989-03-23 | 1989-03-23 | Becker Wilhelm Ab | Polymerisationsinitiator |
-
1992
- 1992-03-31 ES ES92810237T patent/ES2090568T3/es not_active Expired - Lifetime
- 1992-03-31 EP EP92810237A patent/EP0508951B1/de not_active Expired - Lifetime
- 1992-03-31 DK DK92810237.5T patent/DK0508951T3/da not_active Application Discontinuation
- 1992-03-31 DE DE59206930T patent/DE59206930D1/de not_active Expired - Lifetime
- 1992-04-06 US US07/863,638 patent/US5296567A/en not_active Expired - Fee Related
- 1992-04-08 KR KR1019920005945A patent/KR100216155B1/ko not_active IP Right Cessation
- 1992-04-08 JP JP4115435A patent/JP2704690B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0508951B1 (de) | 1996-08-21 |
ES2090568T3 (es) | 1996-10-16 |
US5296567A (en) | 1994-03-22 |
JP2704690B2 (ja) | 1998-01-26 |
KR920019823A (ko) | 1992-11-20 |
EP0508951A3 (en) | 1993-10-06 |
JPH05132505A (ja) | 1993-05-28 |
EP0508951A2 (de) | 1992-10-14 |
DK0508951T3 (da) | 1996-09-09 |
KR100216155B1 (ko) | 1999-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: CIBA SPECIALTY CHEMICALS HOLDING INC., BASEL, CH |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: VANTICO AG, BASEL, CH |