DE69222714T2 - Wärmeableiter - Google Patents
WärmeableiterInfo
- Publication number
- DE69222714T2 DE69222714T2 DE69222714T DE69222714T DE69222714T2 DE 69222714 T2 DE69222714 T2 DE 69222714T2 DE 69222714 T DE69222714 T DE 69222714T DE 69222714 T DE69222714 T DE 69222714T DE 69222714 T2 DE69222714 T2 DE 69222714T2
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9109281A FR2679729B1 (fr) | 1991-07-23 | 1991-07-23 | Dissipateur thermique. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69222714D1 DE69222714D1 (de) | 1997-11-20 |
DE69222714T2 true DE69222714T2 (de) | 1998-04-09 |
Family
ID=9415424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69222714T Expired - Fee Related DE69222714T2 (de) | 1991-07-23 | 1992-07-21 | Wärmeableiter |
Country Status (7)
Country | Link |
---|---|
US (1) | US5307236A (de) |
EP (1) | EP0527359B1 (de) |
JP (1) | JPH06209174A (de) |
CA (1) | CA2074436C (de) |
DE (1) | DE69222714T2 (de) |
ES (1) | ES2109960T3 (de) |
FR (1) | FR2679729B1 (de) |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5549155A (en) * | 1995-04-18 | 1996-08-27 | Thermacore, Inc. | Integrated circuit cooling apparatus |
US5734554A (en) * | 1996-07-01 | 1998-03-31 | Sun Microsystems, Inc. | Heat sink and fan for cooling CPU chip |
US5777844A (en) * | 1996-08-30 | 1998-07-07 | General Electric Company | Electronic control with heat sink |
US6014031A (en) * | 1996-12-10 | 2000-01-11 | International Business Machines Corporation | Apparatus for pressing an electronic card against contacts of a test socket |
DE19701731A1 (de) * | 1997-01-20 | 1998-07-23 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
US6134112A (en) * | 1997-06-27 | 2000-10-17 | Sun Microsystems, Inc. | Heat sink attachment |
US6091199A (en) * | 1997-07-30 | 2000-07-18 | Energy Savings, Inc. | Heat spreader for electronic ballast |
US6257327B1 (en) * | 1997-08-15 | 2001-07-10 | Intel Corporation | Heat sink including pedestal |
US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
US6043981A (en) * | 1997-11-13 | 2000-03-28 | Chrysler Corporation | Heat sink assembly for electrical components |
US7082033B1 (en) * | 1998-02-13 | 2006-07-25 | Micron Technology, Inc. | Removing heat from integrated circuit devices mounted on a support structure |
US6160710A (en) * | 1998-04-03 | 2000-12-12 | Ericsson Inc. | Capacitive mounting arrangement for securing an integrated circuit package to a heat sink |
JP3619670B2 (ja) * | 1998-05-27 | 2005-02-09 | アルプス電気株式会社 | 電子機器 |
SE515449C2 (sv) * | 1999-02-09 | 2001-08-06 | Ericsson Telefon Ab L M | Anordning för kylning av komponenter i en elektrisk apparat |
US6088226A (en) * | 1999-03-31 | 2000-07-11 | Lucent Technologies, Inc. | Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink |
US6262512B1 (en) * | 1999-11-08 | 2001-07-17 | Jds Uniphase Inc. | Thermally actuated microelectromechanical systems including thermal isolation structures |
GB9929800D0 (en) * | 1999-12-17 | 2000-02-09 | Pace Micro Tech Plc | Heat dissipation in electrical apparatus |
US6469893B1 (en) * | 2000-09-29 | 2002-10-22 | Intel Corporation | Direct heatpipe attachment to die using center point loading |
US6683449B1 (en) * | 2000-10-06 | 2004-01-27 | Dell Products, L.P. | Apparatus and method for detecting a mechanical component on a computer system substrate |
US6445588B1 (en) | 2001-01-02 | 2002-09-03 | Motorola, Inc. | Apparatus and method for securing a printed circuit board to a base plate |
DE10213648B4 (de) * | 2002-03-27 | 2011-12-15 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
JP3771518B2 (ja) * | 2002-05-31 | 2006-04-26 | 三菱電機株式会社 | 電力変換装置 |
US6785137B2 (en) * | 2002-07-26 | 2004-08-31 | Stmicroelectronics, Inc. | Method and system for removing heat from an active area of an integrated circuit device |
US20050211427A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
US7836597B2 (en) * | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US6700782B1 (en) * | 2002-11-27 | 2004-03-02 | Intel Corporation | Apparatus and method to retain an electronic component in a precise position during assembly manufacturing |
US20040233639A1 (en) * | 2003-01-31 | 2004-11-25 | Cooligy, Inc. | Removeable heat spreader support mechanism and method of manufacturing thereof |
US20090044928A1 (en) * | 2003-01-31 | 2009-02-19 | Girish Upadhya | Method and apparatus for preventing cracking in a liquid cooling system |
US6831838B1 (en) * | 2003-05-14 | 2004-12-14 | Illinois Tool Works Inc. | Circuit board assembly for welding power supply |
US7536781B2 (en) * | 2003-06-06 | 2009-05-26 | Hewlett-Packard Development Company, L.P. | Method of assembling an application specific integrated circuit (ASIC) assembly with attach hardware |
US7591302B1 (en) * | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
EP1508916B1 (de) * | 2003-08-07 | 2008-03-05 | Harman Becker Automotive Systems GmbH | Vorrichtung zur Kühlung von Halbleiterbauteilen auf Leiterplatten |
US7180745B2 (en) * | 2003-10-10 | 2007-02-20 | Delphi Technologies, Inc. | Flip chip heat sink package and method |
JP4052995B2 (ja) * | 2003-10-27 | 2008-02-27 | 三洋電機株式会社 | 回路装置 |
US7183775B2 (en) * | 2003-11-06 | 2007-02-27 | Hewlett-Packard Development Company, L.P. | Systems and methods for determining whether a heat sink is installed |
CN1294794C (zh) * | 2004-05-21 | 2007-01-10 | 台达电子工业股份有限公司 | 具散热结构的电子装置 |
US20050269691A1 (en) * | 2004-06-04 | 2005-12-08 | Cooligy, Inc. | Counter flow micro heat exchanger for optimal performance |
US7616444B2 (en) * | 2004-06-04 | 2009-11-10 | Cooligy Inc. | Gimballed attachment for multiple heat exchangers |
US7272006B2 (en) * | 2005-09-30 | 2007-09-18 | Intel Corporation | IC coolant microchannel assembly with integrated attachment hardware |
US20070114010A1 (en) * | 2005-11-09 | 2007-05-24 | Girish Upadhya | Liquid cooling for backlit displays |
JP2007180453A (ja) * | 2005-12-28 | 2007-07-12 | Nippon Densan Corp | ヒートシンク冷却装置 |
US7913719B2 (en) * | 2006-01-30 | 2011-03-29 | Cooligy Inc. | Tape-wrapped multilayer tubing and methods for making the same |
US20070175621A1 (en) * | 2006-01-31 | 2007-08-02 | Cooligy, Inc. | Re-workable metallic TIM for efficient heat exchange |
EP1989935A4 (de) * | 2006-02-16 | 2012-07-04 | Cooligy Inc | Flüssigkeitskühlungsschleifen für serveranwendungen |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
JP2009532868A (ja) | 2006-03-30 | 2009-09-10 | クーリギー インコーポレイテッド | 冷却装置及び冷却装置製造方法 |
US20070256825A1 (en) * | 2006-05-04 | 2007-11-08 | Conway Bruce R | Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect |
US20070256815A1 (en) * | 2006-05-04 | 2007-11-08 | Cooligy, Inc. | Scalable liquid cooling system with modular radiators |
US7606036B2 (en) * | 2006-05-25 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080006396A1 (en) * | 2006-06-30 | 2008-01-10 | Girish Upadhya | Multi-stage staggered radiator for high performance liquid cooling applications |
US7492598B2 (en) * | 2006-09-20 | 2009-02-17 | Cisco Technology, Inc. | Heatsink attachment mechanism |
CN101277599A (zh) * | 2007-03-30 | 2008-10-01 | 富准精密工业(深圳)有限公司 | 散热装置 |
WO2008137143A1 (en) * | 2007-05-02 | 2008-11-13 | Cooligy Inc. | Micro-tube/multi-port counter flow radiator design for electronic cooling applications |
KR101503308B1 (ko) * | 2007-05-21 | 2015-03-18 | 엘지디스플레이 주식회사 | 액정표시장치 |
TW200924625A (en) * | 2007-08-07 | 2009-06-01 | Cooligy Inc | Deformable duct guides that accommodate electronic connection lines |
JP4400662B2 (ja) * | 2007-09-12 | 2010-01-20 | 株式会社デンソー | 電子回路部品実装構造 |
US7746653B2 (en) * | 2008-01-02 | 2010-06-29 | Harman International Industries Incorporated | Clamp for electrical devices |
CN201263285Y (zh) * | 2008-07-21 | 2009-06-24 | 鸿富锦精密工业(深圳)有限公司 | 电子元件散热组合 |
JP5083459B2 (ja) * | 2009-03-30 | 2012-11-28 | 富士通オプティカルコンポーネンツ株式会社 | 通信モジュール |
JP5402200B2 (ja) * | 2009-04-20 | 2014-01-29 | 株式会社リコー | 熱移動機構及び情報機器 |
US20110073292A1 (en) * | 2009-09-30 | 2011-03-31 | Madhav Datta | Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems |
JP5585071B2 (ja) * | 2009-12-18 | 2014-09-10 | 富士通株式会社 | 電子装置及びその製造方法 |
US8625284B2 (en) | 2010-05-28 | 2014-01-07 | Lear Corporation | Printed circuit board system for automotive power converter |
JP5530517B2 (ja) * | 2010-06-18 | 2014-06-25 | シャープ株式会社 | 電子機器の放熱構造 |
FR2958794A1 (fr) * | 2010-07-28 | 2011-10-14 | Continental Automotive France | Calculateur de vehicule automobile et procede de fabrication d'un calculateur de vehicule automobile |
CN102142407B (zh) * | 2010-11-04 | 2014-02-19 | 华为机器有限公司 | 一种导热垫 |
CN103096678B (zh) * | 2011-10-27 | 2017-09-15 | 全亿大科技(佛山)有限公司 | 散热装置 |
DE102012112393B4 (de) * | 2012-12-17 | 2018-05-03 | Phoenix Contact Gmbh & Co. Kg | Elektrische Baugruppe |
US9769966B2 (en) * | 2015-09-25 | 2017-09-19 | Intel Corporation | EMI shielding structure to enable heat spreading and low cost assembly |
CN110895428A (zh) * | 2019-05-30 | 2020-03-20 | 研祥智能科技股份有限公司 | 国产服务器及国产服务器主板模组 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5241146B2 (de) * | 1974-01-30 | 1977-10-17 | ||
US3996447A (en) * | 1974-11-29 | 1976-12-07 | Texas Instruments Incorporated | PTC resistance heater |
IT7821073V0 (it) * | 1978-03-09 | 1978-03-09 | Ates Componenti Elettron | Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore. |
LU83439A1 (de) * | 1980-09-25 | 1981-10-29 | Siemens Ag | Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul |
US4342068A (en) * | 1980-11-10 | 1982-07-27 | Teknational Industries Inc. | Mounting assembly for semiconductor devices and particularly power transistors |
DE3203609C2 (de) * | 1982-02-03 | 1985-02-14 | Siemens AG, 1000 Berlin und 8000 München | Kühlelement für integrierte Bauelemente |
FR2567324B1 (fr) * | 1984-07-06 | 1986-11-28 | Telemecanique Electrique | Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique |
GB8421499D0 (en) * | 1984-08-24 | 1984-09-26 | British Telecomm | Heat sink |
FR2578710B1 (fr) * | 1985-03-07 | 1988-03-04 | Bendix Electronics Sa | Agrafe multiple de fixation et dispositif de montage collectif de composants electroniques de puissance |
US5019940A (en) * | 1987-02-24 | 1991-05-28 | Thermalloy Incorporated | Mounting apparatus for electronic device packages |
US4845590A (en) * | 1987-11-02 | 1989-07-04 | Chrysler Motors Corporation | Heat sink for electrical components |
US5031028A (en) * | 1990-04-30 | 1991-07-09 | Motorola, Inc. | Heat sink assembly |
-
1991
- 1991-07-23 FR FR9109281A patent/FR2679729B1/fr not_active Expired - Fee Related
-
1992
- 1992-07-21 ES ES92112420T patent/ES2109960T3/es not_active Expired - Lifetime
- 1992-07-21 EP EP92112420A patent/EP0527359B1/de not_active Expired - Lifetime
- 1992-07-21 DE DE69222714T patent/DE69222714T2/de not_active Expired - Fee Related
- 1992-07-22 US US07/917,194 patent/US5307236A/en not_active Expired - Fee Related
- 1992-07-22 CA CA002074436A patent/CA2074436C/fr not_active Expired - Fee Related
- 1992-07-23 JP JP4197213A patent/JPH06209174A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2679729B1 (fr) | 1994-04-29 |
JPH06209174A (ja) | 1994-07-26 |
ES2109960T3 (es) | 1998-02-01 |
FR2679729A1 (fr) | 1993-01-29 |
EP0527359A2 (de) | 1993-02-17 |
CA2074436C (fr) | 1997-01-28 |
US5307236A (en) | 1994-04-26 |
DE69222714D1 (de) | 1997-11-20 |
CA2074436A1 (fr) | 1993-01-24 |
EP0527359B1 (de) | 1997-10-15 |
EP0527359A3 (en) | 1993-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |