US20080006396A1 - Multi-stage staggered radiator for high performance liquid cooling applications - Google Patents

Multi-stage staggered radiator for high performance liquid cooling applications Download PDF

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Publication number
US20080006396A1
US20080006396A1 US11823796 US82379607A US2008006396A1 US 20080006396 A1 US20080006396 A1 US 20080006396A1 US 11823796 US11823796 US 11823796 US 82379607 A US82379607 A US 82379607A US 2008006396 A1 US2008006396 A1 US 2008006396A1
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Prior art keywords
air
radiator
fluid
heat
multistage
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Abandoned
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US11823796
Inventor
Girish Upadhya
Norman Chow
Douglas Werner
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Cooligy Inc
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Cooligy Inc
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • F28F9/262Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators

Abstract

A fluid-based cooling system including a multistage staggered radiator is configured to distribute a parallel airflow to each radiator in the multistage radiator. Each radiator is staggered so as to expose a total frontal area of the radiators to the parallel airflow in a minimized vertical space. Air ducts are configured to provide isolated air pathways into and, in some cases, out of each radiator in the multistage radiator.

Description

    RELATED APPLICATIONS
  • [0001]
    This Patent Application claims priority under 35 U.S.C. 119 (e) of the co-pending U.S. Provisional Patent Application Ser. No. 60/817,855 filed Jun. 30, 2006, and entitled “MULTI-STAGE STAGGERED RADIATOR FOR HIGH PERFORMANCE LIQUID COOLING APPLICATIONS”. The Provisional Patent Application Ser. No. 60/817,855 filed Jun. 30, 2006, and entitled “MULTI-STAGE STAGGERED RADIATOR FOR HIGH PERFORMANCE LIQUID COOLING APPLICATIONS” is also hereby incorporated by reference.
  • FIELD OF THE INVENTION
  • [0002]
    The invention relates to an apparatus for cooling a heat producing device in general, and specifically, to a multi-stage staggered radiator used in liquid cooling applications.
  • BACKGROUND OF THE INVENTION
  • [0003]
    Cooling of high performance integrated circuits with high heat dissipation is presenting significant challenge in the electronics cooling arena. Conventional cooling with heat pipes and fan mounted heat sinks are not adequate for cooling chips with ever increasing wattage requirements.
  • [0004]
    A particular problem with cooling integrated circuits within personal computers is that more numerous and powerful integrated circuits are configured within the same size or smaller personal computer chassis. As more powerful integrated circuits are developed, each with an increasing density of heat generating transistors, the heat generated by each individual integrated circuit continues to increase. Further, more and more integrated circuits, such as graphics processing units, microprocessors, and multiple-chip sets, are being added to personal computers. Still further, the more powerful and more plentiful integrated circuits are being added to the same, or smaller size personal computer chassis, thereby increasing the per unit heat generated for these devices. In such configurations, conventional personal computer chassis' provide limited dimensions within which to provide an adequate cooling solution. Conventionally, the integrated circuits within a personal computer are cooled using a heat sink and a large fan that blows air over the heat sink, or simply by blowing air directly over the circuit boards containing the integrated circuits. However, considering the limited free space within the personal computer chassis, the amount of air available for cooling the integrated circuits and the space available for conventional cooling equipment, such as heat sinks and fans, is limited.
  • [0005]
    Closed loop liquid cooling presents alternative methodologies for conventional cooling solutions. Closed loop liquid cooling solutions more efficiently reject heat to the ambient than air cooling solutions. A closed loop cooling system includes a cold plate to receive heat from a heat source, a radiator with fan cooling for heat rejection, and a pump to drive liquid through the closed loop. The design of each component is often complex and requires detailed analysis and optimization for specific applications. A conventional micro-tube radiator is designed with two header tanks and a set of parallel liquid channels through which heated liquid flows. The liquid channels have internal fins for enhanced heat transfer, and folded fins brazed on the outside for air cooling. The performance of the radiator depends on an air flow rate over the external radiator fins, a liquid flow rate through the liquid channels, a surface area of the internal fins and the external fins on the air side, and the difference in temperature between the air and the liquid. In general, the radiator performance is limited by the size of the radiator, the space constraints within which the radiator is installed, the ability of the fan to move air, and the resistance of the radiator to airflow.
  • [0006]
    What is needed is a more efficient cooling methodology for cooling integrated circuits within a personal computer. What is also needed is a cooling methodology that increases cooling performance within a given space constraint.
  • SUMMARY OF THE INVENTION
  • [0007]
    A fluid-based cooling system including a multistage staggered radiator is configured to distribute a parallel airflow to each radiator in the multistage radiator. Each radiator is staggered so as to expose a total frontal area of the radiators to the parallel airflow in a minimized vertical space. Air ducts are configured to provide isolated air pathways into and, in some cases, out of each radiator in the multistage radiator. By staggering the stages, more frontal area for cooling is obtained with the same total airflow.
  • [0008]
    In one aspect, a cooling system for cooling one or more heat generating devices is disclosed. The cooling system includes a multistage fluid-to-air heat exchanger including a plurality of individual fluid-to-air heat exchangers and a plurality of independent air ducts, a specific air duct coupled to each individual fluid-to-air heat exchanger, wherein each air duct is configured to provide a portion of an input airflow received by the multistage fluid-to-air heat exchanger to a corresponding fluid-to-air heat exchanger, further wherein the plurality of fluid-to-air heat exchangers are positioned in a staggered configuration such that a frontal area of the multistage fluid-to-air heat exchanger is less than a sum of a frontal area of each fluid-to-air heat exchanger within the multistage fluid-to-air heat exchanger, and a fluid-based cooling loop coupled to the multistage fluid-to-air heat exchanger, wherein the cooling loop is configured to provide heated fluid to each of the multistage fluid-to-air heat exchangers. The multistage fluid-to-air heat exchanger can be a multistage radiator, and each individual fluid-to-air heat exchanger within the multistage radiator can be a radiator. The cooling system can also include one or more air movers configured to provide the input airflow to the multistage fluid-to-air heat exchanger. In this case, each air mover can be a fan. Each cooling loop can also include one or more heat exchangers and a pump. The cooling loop can be configured to fluidically couple the plurality of individual fluid-to-air heat exchangers in series. Alternatively, the cooling loop can be configured to fluidically couple the plurality of fluid-to-air heat exchangers in parallel such that each individual fluid-to-air heat exchanger receives a portion of the heated fluid provided to the multistage radiator. In some embodiments, each independent air duct includes an output air duct dedicated to the corresponding fluid-to-air heat exchanger. In these embodiments, each independent air duct can be configured to form an isolated air pathway through the multistage fluid-to-air heat exchanger via one of the individual fluid-to-air heat exchangers. In some embodiments, each independent air duct is configured to form an isolated air pathway to the corresponding individual fluid-to-air heat exchanger.
  • [0009]
    In another aspect, a multistage fluid-to-air heat exchanger includes a plurality of individual fluid-to-air heat exchangers positioned in a staggered configuration such that a frontal area of the multistage fluid-to-air heat exchanger is less than a sum of a frontal area of each individual fluid-to-air heat exchanger within the multistage fluid-to-air heat exchanger, a plurality of air ducts, an independent air duct coupled to each individual fluid-to-air heat exchanger, wherein each air duct is configured to provide a portion of an input airflow received by the multistage fluid-to-air heat exchanger to a corresponding individual fluid-to-air heat exchanger, and a plurality of fluid lines coupled to each of the plurality of individual fluid-to-air heat exchangers and configured to distribute fluid to each of the plurality of individual fluid-to-air heat exchangers, wherein the plurality of fluid lines includes an input fluid line to receive heated fluid and an output fluid line to output cooled fluid from the multistage radiator. The multistage fluid-to-air heat exchanger can be a multistage radiator, and each individual fluid-to-air heat exchanger within the multistage radiator can be a radiator. The plurality of individual fluid-to-air heat exchangers can be fluidically coupled in series. Alternatively, the plurality of fluid-to-air heat exchangers can be fluidically coupled in parallel such that each individual fluid-to-air heat exchanger receives a portion of the heated fluid provided to the multistage radiator. Each independent air duct can include an output air duct dedicated to the corresponding fluid-to-air heat exchanger. In some embodiments, each independent air duct is configured to form an isolated air pathway through the multistage fluid-to-air heat exchanger via one of the individual fluid-to-air heat exchangers. In some embodiments, each independent air duct is configured to form an isolated air pathway to the corresponding individual fluid-to-air heat exchanger.
  • [0010]
    Other features and advantages of the present invention will become apparent after reviewing the detailed description of the embodiments set forth below.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0011]
    FIG. 1 illustrates a cut out side view of an exemplary configuration of a multistage radiator.
  • [0012]
    FIG. 2A illustrates a relationship between the frontal area A for each individual radiator and a frontal area AT for the multistage radiator configuration.
  • [0013]
    FIG. 2B illustrates a relationship between the frontal area A for each individual radiator and the frontal area AT′ for a stacked radiator configuration.
  • [0014]
    FIG. 3 illustrates a perspective view of an exemplary configuration of the multistage radiator coupled to a cooling loop.
  • [0015]
    FIG. 4 illustrates a cut out side view of an alternative configuration of a multistage radiator.
  • [0016]
    FIG. 5 illustrates a first exemplary configuration of the four radiator multistage radiator
  • [0017]
    FIG. 6 illustrates a second exemplary configuration of the four radiator multistage radiator
  • [0018]
    FIG. 7 illustrates a third exemplary configuration of the four radiator multistage radiator.
  • [0019]
    The present invention is described relative to the several views of the drawings. Where appropriate and only where identical elements are disclosed and shown in more than one drawing, the same reference numeral will be used to represent such identical elements.
  • DETAILED DESCRIPTION OF THE PRESENT INVENTION
  • [0020]
    Embodiments of the present invention are directed to a cooling system including a multistage liquid-to-air heat exchanger, where the cooling system removes heat generated by one or more heat generating devices within a personal computer. The heat generating devices include, but are not limited to, one or more central processing units (CPU), a chipset used to manage the input/output of one or more CPUs, one or more graphics processing units (GPUs), and/or one or more physics processing units (PPUs), mounted on a motherboard, a daughter card, and/or a PC expansion card. The cooling system can also be used to cool power electronics, such as mosfets, switches, and other high-power electronics requiring cooling. In general, the cooling system described herein can be applied to any electronics sub-system that includes a heat generating device to be cooled. For simplicity, any sub-system installed within the personal computer that includes one or more heat generating devices to be cooled is referred to as a PC card.
  • [0021]
    The cooling system is preferably configured within a personal computer chassis. Alternatively, the cooling system is configured as part of any electronics system that includes heat generating devices to be cooled. The cooling system includes one or more air movers and a fluid-based cooling loop. As described herein, reference is made to a single air mover, although more than one air mover can be used. Each air mover is preferably a fan.
  • [0022]
    The cooling loop includes the multistage liquid-to-air heat exchanger, a pump, and at least one other heat exchanger. The components in the cooling loop are coupled via flexible fluid lines. In some embodiments, the multistage fluid-to-air heat exchanger is a radiator. As described herein, reference to a multistage radiator and a radiator are used. It is understood that reference to a radiator is representative of any type of fluid-to-air heat exchanging system unless specific characteristics of the radiator are explicitly referenced.
  • [0023]
    Each of the other heat exchangers in the cooling loop are coupled to either another heat exchanger, which is part of a different cooling loop or device, or to a heat generating device. As described herein, reference is made to a single heat exchanger within the cooling loop, although the cooling loop can include multiple heat exchangers.
  • [0024]
    The multistage radiator includes a plurality of individual radiators. As described herein, reference is made to a multistage radiator that includes two radiators, although the multistage radiator can include more than two radiators. Each radiator is configured in a staggered series such that each radiator receives a portion of a parallel airflow. On an input side of each radiator, an air duct is configured to provide an isolated air pathway to each radiator. In some embodiments, an air duct is configured on an output side of each radiator. Each radiator is also coupled in series such that a cooling fluid flows from one radiator to another in series. The radiators are coupled in series via the fluid lines.
  • [0025]
    Heat generated from a heat generating device is received by the heat exchanger. The heat exchanger is configured with fluid channels through which fluid in the cooling loop passes. As the fluid passes through the heat exchanger, heat is passed to the fluid, and heated fluid is output from the heat exchanger and directed to the multistage radiator. The heated fluid is input to a first radiator in the multistage radiator. Airflow provided by the air mover is directed over and through the first radiator to cool the fluid. Cooled fluid is output from the first radiator and directed to a second radiator in the multistage radiator. Airflow directed over and through the second radiator cools the fluid. As the airflow directed to the second radiator is part of the same parallel airflow directed to the first radiator, the airflow directed to the second radiator is substantially equal in temperature to the airflow directed to the first radiator. However, since the fluid directed to the second radiator has already been cooled within the first radiator, the temperature of the fluid entering the second radiator is lower than the temperature of the fluid entering the first radiator. As such, the temperature difference, referred to as ΔT, between the fluid entering the first radiator and the airflow directed to the first radiator is greater than the temperature difference ΔT′ between the fluid entering the second radiator and the airflow directed to the second radiator.
  • [0026]
    FIG. 1 illustrates a cut out side view of an exemplary configuration of a multistage radiator. The multistage radiator includes a radiator 10 and a radiator 20 within an outer housing 18. The radiator 10 and the radiator 20 can be of the same or different types. The housing 18 includes an inlet opening 8 and an outlet opening 12 to allow air flow to pass through the housing 18. Internal ducting material 14, 16, 22 and the housing 18 are configured so as to provide isolated air pathways for each of the radiators 10, 20. In reference to FIG. 1, a first air pathway includes the radiator 10 and a second air pathway includes the radiator 20. Although not shown in FIG. 1, the housing 18, or additional internal ducting, is configured around the each radiator 10, 20 to direct the airflow from the front of the radiator to the back, substantially eliminating air from flowing out the sides of the radiator.
  • [0027]
    Each air pathway is defined by a corresponding air resistance through the air pathway. In some embodiments, the total air resistance of each air pathway is defined as the sum of the air resistance through the radiator, referred to as the radiator air resistance, and the air resistance within the air pathway, referred to as the ducting air resistance. In the staggered radiator configuration shown in FIG. 1, the air duct in the first air pathway is constricted nearest the radiator 20, indicated as cross-sectional area B, and the air duct in the second air pathway is constricted nearest the radiator 10, indicated as cross-sectional area A. Cross-sectional area A corresponds approximately to the inlet of the second air pathway, and cross-sectional area B corresponds approximately to the outlet of the first air pathway.
  • [0028]
    In some embodiments, the multistage radiator is configured to provide equal air flow to each radiator. Equal airflow corresponds to equal air resistance in each air pathway. As the total air resistance in each air pathway is measured as the sum of the radiator air resistance and the ducting air resistance, the desired total air resistance in a given air pathway is achieved by specifically configuring both the radiator and the duct of the given air pathway. Air pathways with equal total air resistance can each include radiators with the same air resistance, in which case the ducting air resistance for each air pathway is also the same, or each radiator can be configured with a different air resistance, in which case the correspond ducting air resistance for each air pathway is also different. In other embodiments, the multistage radiator is configured to provide different air flows to each radiator. In general, the total air resistance for a given air pathway is adjusted by changing the characteristics of the radiator, changing the cross-sectional area and/or the length of the duct, and/or adding/removing an impediment within the air duct, such as adding fluid lines and a pump of a cooling loop as in FIG. 3. By adjusting the total air resistance of the given air pathway, the amount of air distributed to the radiator in the given air pathway is adjusted
  • [0029]
    The cooling effectiveness of a radiator is measured in part by the area of the front side of the radiator facing the on-coming airflow. The area of the front side is referred to as the frontal area of the radiator. In general, the larger the frontal area, the better the thermal performance of the radiator.
  • [0030]
    FIG. 2A illustrates a relationship between the frontal area A for each individual radiator and a frontal area AT for the multistage radiator configuration. FIG. 2B illustrates a relationship between the frontal area A for each individual radiator and the frontal area AT′ for a stacked radiator configuration. Stacking the radiators 10, 20 obtains a total frontal area, frontal area AR1 plus frontal area AR2, that is equal to the frontal area AT′ of the entire stacked radiator configuration. By staggering the radiators 10, 20 as in the multistage configuration of FIG. 2A, the same total frontal area associated with the radiators 10, 20 is obtained in a smaller frontal area AT of the multistage radiator. Such a configuration is particularly useful in space-constraint applications.
  • [0031]
    Individually, the thermal performance of each radiator is determined by its dimensions, such as the frontal area. However, as part of the cooling system, the thermal performance of one radiator compared to another radiator is dependent on the type of radiator use, the dimensions of the radiator, the temperature difference ΔT of the fluid to air provided to the radiator, and the amount of airflow through the radiator as measured by the total air resistance of the corresponding air pathway. Each of these parameters can be adjusted to meet specific performance requirements.
  • [0032]
    FIG. 3 illustrates a perspective view of an exemplary configuration of the multistage radiator coupled to a cooling loop. The cooling loop includes a heat exchanger 28, a pump 26, the radiator 10, and the radiator 20 coupled together via fluid lines 30, 32, 34, 36. A portion of the housing 18 (FIG. 1) is shown in FIG. 3, including the forward facing sides of the radiators 10, 20, the bottom support surface 24, and the forward and backward facing sides on opposing sides of the pump 26. The remaining portion of the outer housing 18 (FIG. 1) is not shown for ease of illustration. Additional internal ducting material 18 is added at the output of the radiator 10. It is understood that alternative internal ducting configurations can be used to configure the first air pathway for the radiator 10 and the second air pathway for the radiator 20. The surface 24 includes access openings through which the fluid lines 30, 32 pass. In alternative embodiments, the pump 26 is positioned external to the multistage housing 18, thereby removing an impediment from the second air pathway.
  • [0033]
    In some embodiments, the cooling loop is configured to provide heated fluid from the heat exchanger 28 to the radiator 10, fluid from the radiator 10 to the radiator 20, and cooled fluid from the radiator 20 to the heat exchanger 28. In other embodiments, the fluid flow direction is reversed such that fluid flows from the heat exchanger 20 to the radiator 20, from the radiator 20 to the radiator 10, and from the radiator 10 to the heat exchanger 28. It is understood that the relative position of the pump 26 within the cooling loop can be different than the configuration shown in FIG. 3.
  • [0034]
    Although the multistage radiator of FIGS. 1-3 is configured with the radiator 10 in the front position and the radiator 20 in the back position relative to the direction of the air flow, the multistage radiator can alternatively be configured with the radiator positions reversed. FIG. 4 illustrates a cut out side view of an alternative configuration of a multistage radiator. The multistage radiator includes a radiator 110 and a radiator 120 within an outer housing 118. The multistage radiator of FIG. 4 is configured similarly and functions similarly to the multistage radiator of FIG. 1, except that the front radiator is included within a lower air pathway, and a back radiator is included within an upper air pathway. The terms “upper” and “lower” are relative terms only, and are used in reference to the relative positions within the FIG. 4. The housing 18 includes an inlet opening 108 and an outlet opening 112 similar to the inlet opening 8 and the outlet opening 12, respectively, of the multistage radiator of FIG. 1. Internal ducting material 114, 116, 122 and the housing 118 are configured so as to provide isolated air pathways for each of the radiators 110, 120. In reference to FIG. 4, a first air pathway includes the radiator 120 and a second air pathway includes the radiator 110.
  • [0035]
    The multistage radiator can also be extended to include more than two staggered radiators. The number of radiators included in the multistage radiator is limited to the available space into which the multistage radiator is positioned and the applicable size of each radiator. FIGS. 5-6 illustrate three exemplary configurations of a multi-stage radiator that includes four radiators. Each radiator in the series is coupled to the previous radiator by a fluid line, such as the fluid line 36 in FIG. 3. FIG. 5 illustrates a first exemplary configuration of the four radiator multistage radiator in which there are independent air ducts to direct airflow to each of the radiators 110, 120, 130, 140, however, there are no independent air ducts at the output of each radiator. For example, a first input air pathway to the radiator 140 is formed from the internal ducting material 136, 134, and a top and sides of a housing 146. A second input air pathway to the radiator 130 is formed from the internal ducting material 136, 126, 124, and sides of the housing 146. A third input air pathway to the radiator 120 is formed from the internal ducting material 126, 116, 114, and sides of the housing 146. A fourth input air pathway to the radiator 110 is formed from the internal ducting material 116, and a bottom and sides of the housing 146. Air flow output from each of the radiators 110, 120, 130, 140 is directed through a common area and output from the housing 146 via output opening 150.
  • [0036]
    FIG. 6 illustrates a second exemplary configuration of the four radiator multistage radiator in which partial independent ducts are added to the output of each radiator in the multistage radiator. In particular, the multistage radiator of FIG. 6 includes the multistage radiator of FIG. 5 plus partial independent ducts added to the output of each radiator 110, 120, 130, 140. The partial independent output ducts are formed from ducting material 128, 138, 148, and portions of the housing 146. The ducting material 128, 138, 148 does not extend completely to the output opening 150.
  • [0037]
    FIG. 7 illustrates a third exemplary configuration of the four radiator multistage radiator in which complete independent ducts are added to the output of each radiator in the multistage radiator. In particular, the multistage radiator of FIG. 7 includes the multistage radiator of FIG. 5 plus complete independent ducts added to the output of each radiator 110, 120, 130, 140. The complete independent output ducts are formed from ducting material 122, 132, 142, and portions of the housing 146. The ducting material 122, 132, 142 extends completely to the output opening 150. The multistage radiator of FIG. 7 is four-radiator version of the multistage radiator of FIG. 4.
  • [0038]
    The cooling system is described above as including a cooling loop that serially delivers fluid to each radiator. In other embodiments, the cooling loop is configured to split the heated fluid output from the heat exchanger and to provide heated fluid to each radiator in parallel via independent fluid lines. Output fluid lines form each radiator are recombined into a single fluid line that is provided as input to the heat exchanger. In this configuration, substantially same temperature fluid is provided to each radiator in parallel. As such, the temperature difference ΔT between the fluid entering the radiator and the airflow directed to the radiator is substantially the same for each radiator.
  • [0039]
    It is apparent to one skilled in the art that the present cooling system is not limited to the components shown in FIG. 3 and alternatively includes other components and devices. For example, although not shown in FIG. 3, the first cooling loop can also include a fluid reservoir. The fluid reservoir accounts for fluid loss over time due to permeation. The cooling system can also include one or more air movers, such as fans, to direct airflow to the multistage radiator.
  • [0040]
    The present invention has been described in terms of specific embodiments incorporating details to facilitate the understanding of the principles of construction and operation of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be apparent to those skilled in the art that modifications may be made in the embodiment chosen for illustration without departing from the spirit and scope of the invention.

Claims (17)

  1. 1. A cooling system for cooling one or more heat generating devices, the cooling system comprising:
    a. a multistage fluid-to-air heat exchanger including a plurality of individual fluid-to-air heat exchangers and a plurality of independent air ducts, a specific air duct coupled to each individual fluid-to-air heat exchanger, wherein each air duct is configured to provide a portion of an input airflow received by the multistage fluid-to-air heat exchanger to a corresponding fluid-to-air heat exchanger, further wherein the plurality of fluid-to-air heat exchangers are positioned in a staggered configuration such that a frontal area of the multistage fluid-to-air heat exchanger is less than a sum of a frontal area of each fluid-to-air heat exchanger within the multistage fluid-to-air heat exchanger; and
    b. a fluid-based cooling loop coupled to the multistage fluid-to-air heat exchanger, wherein the cooling loop is configured to provide heated fluid to each of the multistage fluid-to-air heat exchangers.
  2. 2. The cooling system of claim 1 wherein the multistage fluid-to-air heat exchanger is a multistage radiator, and each individual fluid-to-air heat exchanger within the multistage radiator is a radiator.
  3. 3. The cooling system of claim 1 further comprising one or more air movers configured to provide the input airflow to the multistage fluid-to-air heat exchanger.
  4. 4. The cooling system of claim 3 wherein each air mover comprises a fan.
  5. 5. The cooling system of claim 1 wherein each cooling loop further comprises one or more heat exchangers and a pump.
  6. 6. The cooling system of claim 1 wherein the cooling loop is configured to fluidically couple the plurality of individual fluid-to-air heat exchangers in series.
  7. 7. The cooling system of claim 1 wherein the cooling loop is configured to fluidically couple the plurality of fluid-to-air heat exchangers in parallel such that each individual fluid-to-air heat exchanger receives a portion of the heated fluid provided to the multistage radiator.
  8. 8. The cooling system of claim 1 wherein each independent air duct includes an output air duct dedicated to the corresponding fluid-to-air heat exchanger.
  9. 9. The cooling system of claim 8 wherein each independent air duct is configured to form an isolated air pathway through the multistage fluid-to-air heat exchanger via one of the individual fluid-to-air heat exchangers
  10. 10. The cooling system of claim 1 wherein each independent air duct is configured to form an isolated air pathway to the corresponding individual fluid-to-air heat exchanger.
  11. 11. A multistage fluid-to-air heat exchanger comprising:
    a. a plurality of individual fluid-to-air heat exchangers positioned in a staggered configuration such that a frontal area of the multistage fluid-to-air heat exchanger is less than a sum of a frontal area of each individual fluid-to-air heat exchanger within the multistage fluid-to-air heat exchanger;
    b. a plurality of air ducts, an independent air duct coupled to each individual fluid-to-air heat exchanger, wherein each air duct is configured to provide a portion of an input airflow received by the multistage fluid-to-air heat exchanger to a corresponding individual fluid-to-air heat exchanger; and
    c. a plurality of fluid lines coupled to each of the plurality of individual fluid-to-air heat exchangers and configured to distribute fluid to each of the plurality of individual fluid-to-air heat exchangers, wherein the plurality of fluid lines includes an input fluid line to receive heated fluid and an output fluid line to output cooled fluid from the multistage radiator.
  12. 12. The multistage fluid-to-air heat exchanger of claim 11 wherein the multistage fluid-to-air heat exchanger is a multistage radiator, and each individual fluid-to-air heat exchanger within the multistage radiator is a radiator.
  13. 13. The multistage fluid-to-air heat exchanger of claim 11 wherein the plurality of individual fluid-to-air heat exchangers are fluidically coupled in series.
  14. 14. The multistage fluid-to-air heat exchanger of claim 11 wherein the plurality of fluid-to-air heat exchangers are fluidically coupled in parallel such that each individual fluid-to-air heat exchanger receives a portion of the heated fluid provided to the multistage radiator.
  15. 15. The multistage fluid-to-air heat exchanger of claim 11 wherein each independent air duct includes an output air duct dedicated to the corresponding fluid-to-air heat exchanger.
  16. 16. The multistage fluid-to-air heat exchanger of claim 15 wherein each independent air duct is configured to form an isolated air pathway through the multistage fluid-to-air heat exchanger via one of the individual fluid-to-air heat exchangers
  17. 17. The multistage fluid-to-air heat exchanger of claim 11 wherein each independent air duct is configured to form an isolated air pathway to the corresponding individual fluid-to-air heat exchanger.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130092346A1 (en) * 2011-10-17 2013-04-18 Justin McKie Energy recovery ventilator unit with offset and overlapping enthalpy wheels
WO2017034653A1 (en) * 2015-08-21 2017-03-02 Corsair Memory, Inc. Forced and natural convection liquid cooler for personal computer
US20170099746A1 (en) * 2015-10-01 2017-04-06 Microsoft Technology Licensing, Llc Layered airflow cooling for electronic components
US20170204787A1 (en) * 2016-01-19 2017-07-20 United Technologies Corporation Heat exchanger array

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103118763B (en) * 2010-06-09 2016-08-24 康明公司 Apparatus and method for treating an exhaust gas

Citations (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2039593A (en) * 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US2273505A (en) * 1942-02-17 Container
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3948316A (en) * 1973-02-06 1976-04-06 Gaz De France Process of and device for using the energy given off by a heat source
US4203488A (en) * 1978-03-01 1980-05-20 Aavid Engineering, Inc. Self-fastened heat sinks
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4574876A (en) * 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
US4644385A (en) * 1983-10-28 1987-02-17 Hitachi, Ltd. Cooling module for integrated circuit chips
US4893174A (en) * 1985-07-08 1990-01-09 Hitachi, Ltd. High density integration of semiconductor circuit
US4894709A (en) * 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
US4896719A (en) * 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4908112A (en) * 1988-06-16 1990-03-13 E. I. Du Pont De Nemours & Co. Silicon semiconductor wafer for analyzing micronic biological samples
US4987996A (en) * 1990-03-15 1991-01-29 Atco Rubber Products, Inc. Flexible duct and carton
US5009760A (en) * 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
US5099910A (en) * 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5105530A (en) * 1990-04-13 1992-04-21 Mos Robert J Method of forming high channel density magnetic head
US5203401A (en) * 1990-06-29 1993-04-20 Digital Equipment Corporation Wet micro-channel wafer chuck and cooling method
US5274920A (en) * 1991-04-02 1994-01-04 Microunity Systems Engineering Method of fabricating a heat exchanger for solid-state electronic devices
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5294834A (en) * 1992-06-01 1994-03-15 Sverdrup Technology, Inc. Low resistance contacts for shallow junction semiconductors
US5307236A (en) * 1991-07-23 1994-04-26 Alcatel Telspace Heatsink for contact with multiple electronic components mounted on a circuit board
US5308429A (en) * 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
US5309319A (en) * 1991-02-04 1994-05-03 International Business Machines Corporation Integral cooling system for electric components
US5310440A (en) * 1990-04-27 1994-05-10 International Business Machines Corporation Convection transfer system
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5380956A (en) * 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US5388635A (en) * 1990-04-27 1995-02-14 International Business Machines Corporation Compliant fluidic coolant hat
US5397919A (en) * 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
US5490117A (en) * 1993-03-23 1996-02-06 Seiko Epson Corporation IC card with dual level power supply interface and method for operating the IC card
US5508234A (en) * 1994-10-31 1996-04-16 International Business Machines Corporation Microcavity structures, fabrication processes, and applications thereof
US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
US5520244A (en) * 1992-12-16 1996-05-28 Sdl, Inc. Micropost waste heat removal system
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
US5858188A (en) * 1990-02-28 1999-01-12 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US5863708A (en) * 1994-11-10 1999-01-26 Sarnoff Corporation Partitioned microelectronic device array
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5874795A (en) * 1995-12-28 1999-02-23 Japan Servo Co., Ltd Multi-phase permanent-magnet type electric rotating machine
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US5886870A (en) * 1995-11-07 1999-03-23 Kabushiki Kaisha Toshiba Heat sink device
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6014312A (en) * 1997-03-17 2000-01-11 Curamik Electronics Gmbh Cooler or heat sink for electrical components or circuits and an electrical circuit with this heat sink
US6021045A (en) * 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability
US6054034A (en) * 1990-02-28 2000-04-25 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6174675B1 (en) * 1997-11-25 2001-01-16 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US6176962B1 (en) * 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US6186660B1 (en) * 1997-10-09 2001-02-13 Caliper Technologies Corp. Microfluidic systems incorporating varied channel dimensions
US6196307B1 (en) * 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US6206022B1 (en) * 1998-10-30 2001-03-27 Industrial Technology Research Institute Integrated flow controller module
US6210986B1 (en) * 1999-09-23 2001-04-03 Sandia Corporation Microfluidic channel fabrication method
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6221226B1 (en) * 1997-07-15 2001-04-24 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
US6337794B1 (en) * 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
US6347036B1 (en) * 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6351384B1 (en) * 1999-08-11 2002-02-26 Hitachi, Ltd. Device and method for cooling multi-chip modules
US6360814B1 (en) * 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
US6366467B1 (en) * 2000-03-31 2002-04-02 Intel Corporation Dual-socket interposer and method of fabrication therefor
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6367544B1 (en) * 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
US6508301B2 (en) * 2000-04-19 2003-01-21 Thermal Form & Function Cold plate utilizing fin with evaporating refrigerant
US6519151B2 (en) * 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
US6536516B2 (en) * 2000-12-21 2003-03-25 Long Manufacturing Ltd. Finned plate heat exchanger
US6537437B1 (en) * 2000-11-13 2003-03-25 Sandia Corporation Surface-micromachined microfluidic devices
US20030062149A1 (en) * 2001-09-28 2003-04-03 Goodson Kenneth E. Electroosmotic microchannel cooling system
US6543521B1 (en) * 1999-10-04 2003-04-08 Matsushita Electric Industrial Co., Ltd. Cooling element and cooling apparatus using the same
US6553253B1 (en) * 1999-03-12 2003-04-22 Biophoretic Therapeutic Systems, Llc Method and system for electrokinetic delivery of a substance
US6674642B1 (en) * 2002-06-27 2004-01-06 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
US6700785B2 (en) * 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US20040040695A1 (en) * 2001-09-20 2004-03-04 Intel Corporation Modular capillary pumped loop cooling system
US20040052049A1 (en) * 2002-09-13 2004-03-18 Wu Bo Jiu Integrated fluid cooling system for electronic components
US20040052031A1 (en) * 2002-07-11 2004-03-18 Asml Netherlands B.V. Substrate holder and device manufacturing method
US20040057211A1 (en) * 2002-09-24 2004-03-25 Yoshihiro Kondo Electronic equipment
US6865081B2 (en) * 2002-10-02 2005-03-08 Atotech Deutschland Gmbh Microstructure cooler and use thereof
US20050082666A1 (en) * 2003-10-17 2005-04-21 Hon Hai Precision Industry Co., Ltd. Liquid cooling device
US6992891B2 (en) * 2003-04-02 2006-01-31 Intel Corporation Metal ball attachment of heat dissipation devices
US20060023422A1 (en) * 2004-01-28 2006-02-02 Shum Kent N Modular electronic enclosure with cooling design
US20060037739A1 (en) * 2004-08-18 2006-02-23 Nec Viewtechnology, Ltd. Circulation-type liquid cooling apparatus and electronic device containing same
US7009843B2 (en) * 2002-09-09 2006-03-07 Hon Hai Precision Ind. Co., Ltd. Heat sink clip with pressing post
US20060056156A1 (en) * 2004-09-10 2006-03-16 International Business Machines Corporation Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
US7177931B2 (en) * 2001-05-31 2007-02-13 Yahoo! Inc. Centralized feed manager
US20070042514A1 (en) * 2005-08-22 2007-02-22 Shan Ping Wu Method and apparatus for cooling a blade server
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5927390A (en) * 1996-12-13 1999-07-27 Caterpillar Inc. Radiator arrangement with offset modular cores

Patent Citations (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2273505A (en) * 1942-02-17 Container
US2039593A (en) * 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3948316A (en) * 1973-02-06 1976-04-06 Gaz De France Process of and device for using the energy given off by a heat source
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4203488A (en) * 1978-03-01 1980-05-20 Aavid Engineering, Inc. Self-fastened heat sinks
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4574876A (en) * 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
US4644385A (en) * 1983-10-28 1987-02-17 Hitachi, Ltd. Cooling module for integrated circuit chips
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4893174A (en) * 1985-07-08 1990-01-09 Hitachi, Ltd. High density integration of semiconductor circuit
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US4894709A (en) * 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
US4896719A (en) * 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4908112A (en) * 1988-06-16 1990-03-13 E. I. Du Pont De Nemours & Co. Silicon semiconductor wafer for analyzing micronic biological samples
US5009760A (en) * 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US6054034A (en) * 1990-02-28 2000-04-25 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US5858188A (en) * 1990-02-28 1999-01-12 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US6176962B1 (en) * 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US4987996A (en) * 1990-03-15 1991-01-29 Atco Rubber Products, Inc. Flexible duct and carton
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5105530A (en) * 1990-04-13 1992-04-21 Mos Robert J Method of forming high channel density magnetic head
US5310440A (en) * 1990-04-27 1994-05-10 International Business Machines Corporation Convection transfer system
US5388635A (en) * 1990-04-27 1995-02-14 International Business Machines Corporation Compliant fluidic coolant hat
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5203401A (en) * 1990-06-29 1993-04-20 Digital Equipment Corporation Wet micro-channel wafer chuck and cooling method
US5099910A (en) * 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
US5309319A (en) * 1991-02-04 1994-05-03 International Business Machines Corporation Integral cooling system for electric components
US5274920A (en) * 1991-04-02 1994-01-04 Microunity Systems Engineering Method of fabricating a heat exchanger for solid-state electronic devices
US5307236A (en) * 1991-07-23 1994-04-26 Alcatel Telspace Heatsink for contact with multiple electronic components mounted on a circuit board
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US5294834A (en) * 1992-06-01 1994-03-15 Sverdrup Technology, Inc. Low resistance contacts for shallow junction semiconductors
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5308429A (en) * 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5520244A (en) * 1992-12-16 1996-05-28 Sdl, Inc. Micropost waste heat removal system
US5397919A (en) * 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
US5490117A (en) * 1993-03-23 1996-02-06 Seiko Epson Corporation IC card with dual level power supply interface and method for operating the IC card
US5380956A (en) * 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5514832A (en) * 1994-10-31 1996-05-07 International Business Machines Corporation Microcavity structures, fabrication processes, and applications thereof
US5508234A (en) * 1994-10-31 1996-04-16 International Business Machines Corporation Microcavity structures, fabrication processes, and applications thereof
US5863708A (en) * 1994-11-10 1999-01-26 Sarnoff Corporation Partitioned microelectronic device array
US5886870A (en) * 1995-11-07 1999-03-23 Kabushiki Kaisha Toshiba Heat sink device
US5874795A (en) * 1995-12-28 1999-02-23 Japan Servo Co., Ltd Multi-phase permanent-magnet type electric rotating machine
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US6014312A (en) * 1997-03-17 2000-01-11 Curamik Electronics Gmbh Cooler or heat sink for electrical components or circuits and an electrical circuit with this heat sink
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6221226B1 (en) * 1997-07-15 2001-04-24 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
US6186660B1 (en) * 1997-10-09 2001-02-13 Caliper Technologies Corp. Microfluidic systems incorporating varied channel dimensions
US6174675B1 (en) * 1997-11-25 2001-01-16 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US6196307B1 (en) * 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US6021045A (en) * 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability
US6206022B1 (en) * 1998-10-30 2001-03-27 Industrial Technology Research Institute Integrated flow controller module
US6553253B1 (en) * 1999-03-12 2003-04-22 Biophoretic Therapeutic Systems, Llc Method and system for electrokinetic delivery of a substance
US6351384B1 (en) * 1999-08-11 2002-02-26 Hitachi, Ltd. Device and method for cooling multi-chip modules
US6360814B1 (en) * 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6210986B1 (en) * 1999-09-23 2001-04-03 Sandia Corporation Microfluidic channel fabrication method
US6543521B1 (en) * 1999-10-04 2003-04-08 Matsushita Electric Industrial Co., Ltd. Cooling element and cooling apparatus using the same
US6337794B1 (en) * 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
US6347036B1 (en) * 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6366467B1 (en) * 2000-03-31 2002-04-02 Intel Corporation Dual-socket interposer and method of fabrication therefor
US6508301B2 (en) * 2000-04-19 2003-01-21 Thermal Form & Function Cold plate utilizing fin with evaporating refrigerant
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6537437B1 (en) * 2000-11-13 2003-03-25 Sandia Corporation Surface-micromachined microfluidic devices
US6367544B1 (en) * 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
US6536516B2 (en) * 2000-12-21 2003-03-25 Long Manufacturing Ltd. Finned plate heat exchanger
US7177931B2 (en) * 2001-05-31 2007-02-13 Yahoo! Inc. Centralized feed manager
US6519151B2 (en) * 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
US20040040695A1 (en) * 2001-09-20 2004-03-04 Intel Corporation Modular capillary pumped loop cooling system
US20030062149A1 (en) * 2001-09-28 2003-04-03 Goodson Kenneth E. Electroosmotic microchannel cooling system
US6700785B2 (en) * 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
US6674642B1 (en) * 2002-06-27 2004-01-06 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
US20040052031A1 (en) * 2002-07-11 2004-03-18 Asml Netherlands B.V. Substrate holder and device manufacturing method
US7009843B2 (en) * 2002-09-09 2006-03-07 Hon Hai Precision Ind. Co., Ltd. Heat sink clip with pressing post
US20040052049A1 (en) * 2002-09-13 2004-03-18 Wu Bo Jiu Integrated fluid cooling system for electronic components
US20040057211A1 (en) * 2002-09-24 2004-03-25 Yoshihiro Kondo Electronic equipment
US6865081B2 (en) * 2002-10-02 2005-03-08 Atotech Deutschland Gmbh Microstructure cooler and use thereof
US6992891B2 (en) * 2003-04-02 2006-01-31 Intel Corporation Metal ball attachment of heat dissipation devices
US20050082666A1 (en) * 2003-10-17 2005-04-21 Hon Hai Precision Industry Co., Ltd. Liquid cooling device
US20060023422A1 (en) * 2004-01-28 2006-02-02 Shum Kent N Modular electronic enclosure with cooling design
US20060037739A1 (en) * 2004-08-18 2006-02-23 Nec Viewtechnology, Ltd. Circulation-type liquid cooling apparatus and electronic device containing same
US20060056156A1 (en) * 2004-09-10 2006-03-16 International Business Machines Corporation Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
US20070042514A1 (en) * 2005-08-22 2007-02-22 Shan Ping Wu Method and apparatus for cooling a blade server
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130092346A1 (en) * 2011-10-17 2013-04-18 Justin McKie Energy recovery ventilator unit with offset and overlapping enthalpy wheels
US9835353B2 (en) * 2011-10-17 2017-12-05 Lennox Industries Inc. Energy recovery ventilator unit with offset and overlapping enthalpy wheels
WO2017034653A1 (en) * 2015-08-21 2017-03-02 Corsair Memory, Inc. Forced and natural convection liquid cooler for personal computer
US20170099746A1 (en) * 2015-10-01 2017-04-06 Microsoft Technology Licensing, Llc Layered airflow cooling for electronic components
US20170204787A1 (en) * 2016-01-19 2017-07-20 United Technologies Corporation Heat exchanger array

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