KR100479893B1 - 다이싱테이프를조사하는조사장치및그조사방법 - Google Patents

다이싱테이프를조사하는조사장치및그조사방법 Download PDF

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Publication number
KR100479893B1
KR100479893B1 KR1019960060273A KR19960060273A KR100479893B1 KR 100479893 B1 KR100479893 B1 KR 100479893B1 KR 1019960060273 A KR1019960060273 A KR 1019960060273A KR 19960060273 A KR19960060273 A KR 19960060273A KR 100479893 B1 KR100479893 B1 KR 100479893B1
Authority
KR
South Korea
Prior art keywords
chamber
light
dicing tape
illuminance
lamp
Prior art date
Application number
KR1019960060273A
Other languages
English (en)
Korean (ko)
Other versions
KR970052125A (ko
Inventor
에이이찌 이리에
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR970052125A publication Critical patent/KR970052125A/ko
Application granted granted Critical
Publication of KR100479893B1 publication Critical patent/KR100479893B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Dicing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1019960060273A 1995-12-02 1996-11-30 다이싱테이프를조사하는조사장치및그조사방법 KR100479893B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33831195A JP3518786B2 (ja) 1995-12-02 1995-12-02 ダイシングテープ用光照射装置および光照射方法
JP95-338311 1995-12-02

Publications (2)

Publication Number Publication Date
KR970052125A KR970052125A (ko) 1997-07-29
KR100479893B1 true KR100479893B1 (ko) 2005-06-27

Family

ID=18316946

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960060273A KR100479893B1 (ko) 1995-12-02 1996-11-30 다이싱테이프를조사하는조사장치및그조사방법

Country Status (6)

Country Link
JP (1) JP3518786B2 (de)
KR (1) KR100479893B1 (de)
DE (1) DE19648062B4 (de)
GB (1) GB2307759B (de)
MY (1) MY116683A (de)
SG (1) SG60026A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101372394B1 (ko) * 2012-11-23 2014-03-12 주식회사 대성엔지니어링 엘이디 자외선 조사장치
US11567247B2 (en) 2018-11-09 2023-01-31 Lg Chem, Ltd. Plasma etching method using faraday cage
US11932784B2 (en) 2019-09-26 2024-03-19 Lg Chem, Ltd. Adhesive composition for dicing tape and dicing tape comprising the same

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3928372B2 (ja) * 2001-05-22 2007-06-13 ウシオ電機株式会社 光照射装置
JP2004072040A (ja) * 2002-08-09 2004-03-04 Lintec Corp 属性表示付ダイシングテープおよびその製造方法
JP4488686B2 (ja) * 2003-03-12 2010-06-23 日東電工株式会社 紫外線照射方法およびそれを用いた装置
EP1498935B1 (de) * 2003-07-15 2006-04-26 Tokyo Seimitsu Co.,Ltd. Verfahren und Vorrichtung zum Berechnen einer Lichtmenge
JP4578165B2 (ja) * 2003-07-15 2010-11-10 株式会社東京精密 光量算出装置および光量算出方法
JP4638172B2 (ja) * 2004-03-31 2011-02-23 積水化学工業株式会社 Ｉｃチップの製造方法及びｉｃチップの製造装置
JP2006324373A (ja) * 2005-05-18 2006-11-30 Matsushita Electric Ind Co Ltd チップのピックアップ装置およびピックアップ方法
JP5117709B2 (ja) 2006-12-04 2013-01-16 リンテック株式会社 紫外線照射装置及び紫外線照射方法
JP5356842B2 (ja) * 2009-01-28 2013-12-04 リンテック株式会社 光照射装置及び光照射方法
JP2011040476A (ja) 2009-08-07 2011-02-24 Lintec Corp エネルギー付与装置およびエネルギー付与方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5098501A (en) * 1989-12-08 1992-03-24 Sumitomo Electric Industries, Ltd. Pickup method and the pickup apparatus for chip-type part
JPH04212422A (ja) * 1990-10-16 1992-08-04 Sony Corp 半導体処理装置
JPH0636984A (ja) * 1992-07-13 1994-02-10 Canon Inc 露光装置
JPH06196554A (ja) * 1992-12-24 1994-07-15 Nitto Denko Corp 紫外線照射装置
KR940022799A (ko) * 1993-03-03 1994-10-21 윌리엄 이. 힐러 디엠디(dmd)를 절단한 후의 웨이퍼 처리방법
KR950001831A (ko) * 1993-06-23 1995-01-04 박경팔 광량 자동제어 노광장치
KR960019124U (ko) * 1994-11-05 1996-06-19 현대반도체주식회사 다이 본드 장비의 다이 픽업장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190795A (en) * 1977-09-09 1980-02-26 Coberly & Associates Constant intensity light source
PH25206A (en) * 1985-12-12 1991-03-27 Lintec K K Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate
JPH06196555A (ja) * 1992-12-24 1994-07-15 Nitto Denko Corp 紫外線照射装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5098501A (en) * 1989-12-08 1992-03-24 Sumitomo Electric Industries, Ltd. Pickup method and the pickup apparatus for chip-type part
JPH04212422A (ja) * 1990-10-16 1992-08-04 Sony Corp 半導体処理装置
JPH0636984A (ja) * 1992-07-13 1994-02-10 Canon Inc 露光装置
JPH06196554A (ja) * 1992-12-24 1994-07-15 Nitto Denko Corp 紫外線照射装置
KR940022799A (ko) * 1993-03-03 1994-10-21 윌리엄 이. 힐러 디엠디(dmd)를 절단한 후의 웨이퍼 처리방법
KR950001831A (ko) * 1993-06-23 1995-01-04 박경팔 광량 자동제어 노광장치
KR960019124U (ko) * 1994-11-05 1996-06-19 현대반도체주식회사 다이 본드 장비의 다이 픽업장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101372394B1 (ko) * 2012-11-23 2014-03-12 주식회사 대성엔지니어링 엘이디 자외선 조사장치
US11567247B2 (en) 2018-11-09 2023-01-31 Lg Chem, Ltd. Plasma etching method using faraday cage
US11932784B2 (en) 2019-09-26 2024-03-19 Lg Chem, Ltd. Adhesive composition for dicing tape and dicing tape comprising the same

Also Published As

Publication number Publication date
DE19648062A1 (de) 1997-06-05
GB2307759B (en) 2000-02-09
JPH09162141A (ja) 1997-06-20
GB9623114D0 (en) 1997-01-08
DE19648062B4 (de) 2009-01-29
KR970052125A (ko) 1997-07-29
MY116683A (en) 2004-03-31
GB2307759A (en) 1997-06-04
SG60026A1 (en) 1999-02-22
JP3518786B2 (ja) 2004-04-12

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