KR960019124U - 다이 본드 장비의 다이 픽업장치 - Google Patents

다이 본드 장비의 다이 픽업장치

Info

Publication number
KR960019124U
KR960019124U KR2019940029349U KR19940029349U KR960019124U KR 960019124 U KR960019124 U KR 960019124U KR 2019940029349 U KR2019940029349 U KR 2019940029349U KR 19940029349 U KR19940029349 U KR 19940029349U KR 960019124 U KR960019124 U KR 960019124U
Authority
KR
South Korea
Prior art keywords
die
pick
bond equipment
die bond
equipment
Prior art date
Application number
KR2019940029349U
Other languages
English (en)
Other versions
KR200177254Y1 (ko
Inventor
권선후
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019940029349U priority Critical patent/KR200177254Y1/ko
Publication of KR960019124U publication Critical patent/KR960019124U/ko
Application granted granted Critical
Publication of KR200177254Y1 publication Critical patent/KR200177254Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
KR2019940029349U 1994-11-05 1994-11-05 다이 본드 장비의 다이 픽업장치 KR200177254Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940029349U KR200177254Y1 (ko) 1994-11-05 1994-11-05 다이 본드 장비의 다이 픽업장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940029349U KR200177254Y1 (ko) 1994-11-05 1994-11-05 다이 본드 장비의 다이 픽업장치

Publications (2)

Publication Number Publication Date
KR960019124U true KR960019124U (ko) 1996-06-19
KR200177254Y1 KR200177254Y1 (ko) 2000-04-15

Family

ID=19397488

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940029349U KR200177254Y1 (ko) 1994-11-05 1994-11-05 다이 본드 장비의 다이 픽업장치

Country Status (1)

Country Link
KR (1) KR200177254Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100479893B1 (ko) * 1995-12-02 2005-06-27 린텍 가부시키가이샤 다이싱테이프를조사하는조사장치및그조사방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100479893B1 (ko) * 1995-12-02 2005-06-27 린텍 가부시키가이샤 다이싱테이프를조사하는조사장치및그조사방법

Also Published As

Publication number Publication date
KR200177254Y1 (ko) 2000-04-15

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Legal Events

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