KR970003272U - 다이픽업장치 - Google Patents

다이픽업장치

Info

Publication number
KR970003272U
KR970003272U KR2019950015749U KR19950015749U KR970003272U KR 970003272 U KR970003272 U KR 970003272U KR 2019950015749 U KR2019950015749 U KR 2019950015749U KR 19950015749 U KR19950015749 U KR 19950015749U KR 970003272 U KR970003272 U KR 970003272U
Authority
KR
South Korea
Prior art keywords
die pick
pick
die
Prior art date
Application number
KR2019950015749U
Other languages
English (en)
Other versions
KR200171665Y1 (ko
Inventor
문영일
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950015749U priority Critical patent/KR200171665Y1/ko
Publication of KR970003272U publication Critical patent/KR970003272U/ko
Application granted granted Critical
Publication of KR200171665Y1 publication Critical patent/KR200171665Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
KR2019950015749U 1995-06-30 1995-06-30 다이픽업장치 KR200171665Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950015749U KR200171665Y1 (ko) 1995-06-30 1995-06-30 다이픽업장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950015749U KR200171665Y1 (ko) 1995-06-30 1995-06-30 다이픽업장치

Publications (2)

Publication Number Publication Date
KR970003272U true KR970003272U (ko) 1997-01-24
KR200171665Y1 KR200171665Y1 (ko) 2000-03-02

Family

ID=19417116

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950015749U KR200171665Y1 (ko) 1995-06-30 1995-06-30 다이픽업장치

Country Status (1)

Country Link
KR (1) KR200171665Y1 (ko)

Also Published As

Publication number Publication date
KR200171665Y1 (ko) 2000-03-02

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Legal Events

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Year of fee payment: 10

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