KR970011216U - 반도체 장비의 다이 픽업장치 - Google Patents

반도체 장비의 다이 픽업장치

Info

Publication number
KR970011216U
KR970011216U KR2019950020433U KR19950020433U KR970011216U KR 970011216 U KR970011216 U KR 970011216U KR 2019950020433 U KR2019950020433 U KR 2019950020433U KR 19950020433 U KR19950020433 U KR 19950020433U KR 970011216 U KR970011216 U KR 970011216U
Authority
KR
South Korea
Prior art keywords
pickup device
semiconductor equipment
die pickup
die
semiconductor
Prior art date
Application number
KR2019950020433U
Other languages
English (en)
Other versions
KR0122875Y1 (ko
Inventor
박상빈
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950020433U priority Critical patent/KR0122875Y1/ko
Publication of KR970011216U publication Critical patent/KR970011216U/ko
Application granted granted Critical
Publication of KR0122875Y1 publication Critical patent/KR0122875Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019950020433U 1995-08-08 1995-08-08 반도체 장비의 다이 픽업장치 KR0122875Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950020433U KR0122875Y1 (ko) 1995-08-08 1995-08-08 반도체 장비의 다이 픽업장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950020433U KR0122875Y1 (ko) 1995-08-08 1995-08-08 반도체 장비의 다이 픽업장치

Publications (2)

Publication Number Publication Date
KR970011216U true KR970011216U (ko) 1997-03-29
KR0122875Y1 KR0122875Y1 (ko) 1999-02-18

Family

ID=19420390

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950020433U KR0122875Y1 (ko) 1995-08-08 1995-08-08 반도체 장비의 다이 픽업장치

Country Status (1)

Country Link
KR (1) KR0122875Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101483824B1 (ko) * 2012-11-07 2015-01-16 하이디스 테크놀로지 주식회사 평판표시소자 제조용 화학기상증착 장치

Also Published As

Publication number Publication date
KR0122875Y1 (ko) 1999-02-18

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Legal Events

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