MY116683A - Illumination apparatus for irradiating dicing tape and method of illumination thereof - Google Patents

Illumination apparatus for irradiating dicing tape and method of illumination thereof

Info

Publication number
MY116683A
MY116683A MYPI96004484A MYPI9604484A MY116683A MY 116683 A MY116683 A MY 116683A MY PI96004484 A MYPI96004484 A MY PI96004484A MY PI9604484 A MYPI9604484 A MY PI9604484A MY 116683 A MY116683 A MY 116683A
Authority
MY
Malaysia
Prior art keywords
lamp
chamber
setting
illumination intensity
irradiating
Prior art date
Application number
MYPI96004484A
Inventor
Eiichi Irie
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY116683A publication Critical patent/MY116683A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Abstract

AN ILLUMINATION APPARATUS FOR IRRADIATING A WORKPIECE (W) IN ORDER TO WEAKEN THE ADHESIVE STRENGTH OF A PHOTO-SETTING ADHESIVE USED TO BOND A SEMICONDUCTOR WAFER (21) TO DICING TAPE (19) INCLUDES A CHAMBER (11) FORHOLDING THE WORKPIECE (W), A HIGH PRESSURE MERCURY LAMP (5) FOR IRRADIATING THE WORKPIECE (W), A POWER SOURCE (29) EQUIPPED WITH AN INVERTER TO SUPPLY A RECTANGULAR WAVEFORM ALTERNATING CURRENT TO THE LAMP (5), A REFLECTING MIRROR (7) FOR REFLECTING LIGHT EMITTED BY THE LAMP (5), GUIDE RAILS (13) WHICH ENABLE THE CHAMBER (11) TO BE MOVED, AN OPERATION PORTION (39) FOR SETTING THE SPEED OF MOTION OF THE CHAMBER (11) ALONG THE GUIDE RAILS (13), A LIGHT DETECTING SENSOR (33) TO DETECT THE ILLUMINATION INTENSITY OF THE LIGHT EMITTED BY THE LAMP (5), A BASE ILLUMINATION INTENSITY SETTING PORTION (41) FOR SETTING A BASE ILLUMINATION INTENSITY, A CONTROL PORTION (37) EQUIPPED WITH A MICROCOMPUTER FOR CONTROLLING THE POWER OUTPUTTED FROM THE POWER SOURCE (29) TO THE LAMP (5) TO CAUSE THE LAMP (5) TO EMIT LIGHT AT THE SET BASE ILLUMINATION INTENSITY, AND A DRIVE PORTION (35) TO MOVE THE CHAMBER (11) AT THE SPEED SET BY THE OPERATION PORTION (39).
MYPI96004484A 1995-12-02 1996-10-29 Illumination apparatus for irradiating dicing tape and method of illumination thereof MY116683A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33831195A JP3518786B2 (en) 1995-12-02 1995-12-02 Light irradiation device and light irradiation method for dicing tape

Publications (1)

Publication Number Publication Date
MY116683A true MY116683A (en) 2004-03-31

Family

ID=18316946

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96004484A MY116683A (en) 1995-12-02 1996-10-29 Illumination apparatus for irradiating dicing tape and method of illumination thereof

Country Status (6)

Country Link
JP (1) JP3518786B2 (en)
KR (1) KR100479893B1 (en)
DE (1) DE19648062B4 (en)
GB (1) GB2307759B (en)
MY (1) MY116683A (en)
SG (1) SG60026A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3928372B2 (en) * 2001-05-22 2007-06-13 ウシオ電機株式会社 Light irradiation device
JP2004072040A (en) * 2002-08-09 2004-03-04 Lintec Corp Dicing tape with attribute indication and method for manufacturing same
JP4488686B2 (en) * 2003-03-12 2010-06-23 日東電工株式会社 Ultraviolet irradiation method and apparatus using the same
JP4578165B2 (en) * 2003-07-15 2010-11-10 株式会社東京精密 Light quantity calculation device and light quantity calculation method
EP1498935B1 (en) * 2003-07-15 2006-04-26 Tokyo Seimitsu Co.,Ltd. Device for calculating the quantity of light and method thereof
JP4638172B2 (en) * 2004-03-31 2011-02-23 積水化学工業株式会社 IC chip manufacturing method and IC chip manufacturing apparatus
JP2006324373A (en) * 2005-05-18 2006-11-30 Matsushita Electric Ind Co Ltd Method and device of pickup of chip
JP5117709B2 (en) 2006-12-04 2013-01-16 リンテック株式会社 Ultraviolet irradiation apparatus and ultraviolet irradiation method
JP5356842B2 (en) * 2009-01-28 2013-12-04 リンテック株式会社 Light irradiation apparatus and light irradiation method
JP2011040476A (en) 2009-08-07 2011-02-24 Lintec Corp Device and method for applying energy
KR101372394B1 (en) * 2012-11-23 2014-03-12 주식회사 대성엔지니어링 Led ultraviolet irradiation apparatus
KR102633533B1 (en) 2018-11-09 2024-02-06 주식회사 엘지화학 Method for plasma etching process using faraday box
KR102426261B1 (en) 2019-09-26 2022-07-29 주식회사 엘지화학 Adhesive composition for dicing tape and dicing tape comprising the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190795A (en) * 1977-09-09 1980-02-26 Coberly & Associates Constant intensity light source
PH25206A (en) * 1985-12-12 1991-03-27 Lintec K K Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate
EP0431637B1 (en) * 1989-12-08 1993-06-02 Sumitomo Electric Industries, Ltd. Pickup method and the pickup apparatus for a chip-type part
JP3232575B2 (en) * 1990-10-16 2001-11-26 ソニー株式会社 Semiconductor processing equipment
JPH0636984A (en) * 1992-07-13 1994-02-10 Canon Inc Aligner
JPH06196554A (en) * 1992-12-24 1994-07-15 Nitto Denko Corp Ultraviolet ray irradiation system
JPH06196555A (en) * 1992-12-24 1994-07-15 Nitto Denko Corp Ultraviolet ray irradiation system
CA2115947A1 (en) * 1993-03-03 1994-09-04 Gregory C. Smith Wafer-like processing after sawing dmds
KR950001831A (en) * 1993-06-23 1995-01-04 박경팔 Light amount automatic control exposure device
KR200177254Y1 (en) * 1994-11-05 2000-04-15 김영환 Die pickup apparatus of die bond device

Also Published As

Publication number Publication date
KR970052125A (en) 1997-07-29
GB2307759B (en) 2000-02-09
DE19648062B4 (en) 2009-01-29
KR100479893B1 (en) 2005-06-27
JP3518786B2 (en) 2004-04-12
SG60026A1 (en) 1999-02-22
JPH09162141A (en) 1997-06-20
DE19648062A1 (en) 1997-06-05
GB2307759A (en) 1997-06-04
GB9623114D0 (en) 1997-01-08

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