GB2307759B - Illumination apparatus for irradiating dicing tape and method of illumniation thereof - Google Patents

Illumination apparatus for irradiating dicing tape and method of illumniation thereof

Info

Publication number
GB2307759B
GB2307759B GB9623114A GB9623114A GB2307759B GB 2307759 B GB2307759 B GB 2307759B GB 9623114 A GB9623114 A GB 9623114A GB 9623114 A GB9623114 A GB 9623114A GB 2307759 B GB2307759 B GB 2307759B
Authority
GB
United Kingdom
Prior art keywords
illumniation
irradiating
dicing tape
illumination apparatus
illumination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9623114A
Other versions
GB2307759A (en
GB9623114D0 (en
Inventor
Eiichi Irie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of GB9623114D0 publication Critical patent/GB9623114D0/en
Publication of GB2307759A publication Critical patent/GB2307759A/en
Application granted granted Critical
Publication of GB2307759B publication Critical patent/GB2307759B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
GB9623114A 1995-12-02 1996-11-06 Illumination apparatus for irradiating dicing tape and method of illumniation thereof Expired - Fee Related GB2307759B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33831195A JP3518786B2 (en) 1995-12-02 1995-12-02 Light irradiation device and light irradiation method for dicing tape

Publications (3)

Publication Number Publication Date
GB9623114D0 GB9623114D0 (en) 1997-01-08
GB2307759A GB2307759A (en) 1997-06-04
GB2307759B true GB2307759B (en) 2000-02-09

Family

ID=18316946

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9623114A Expired - Fee Related GB2307759B (en) 1995-12-02 1996-11-06 Illumination apparatus for irradiating dicing tape and method of illumniation thereof

Country Status (6)

Country Link
JP (1) JP3518786B2 (en)
KR (1) KR100479893B1 (en)
DE (1) DE19648062B4 (en)
GB (1) GB2307759B (en)
MY (1) MY116683A (en)
SG (1) SG60026A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3928372B2 (en) * 2001-05-22 2007-06-13 ウシオ電機株式会社 Light irradiation device
JP2004072040A (en) * 2002-08-09 2004-03-04 Lintec Corp Dicing tape with attribute indication and method for manufacturing same
JP4488686B2 (en) * 2003-03-12 2010-06-23 日東電工株式会社 Ultraviolet irradiation method and apparatus using the same
JP4578165B2 (en) * 2003-07-15 2010-11-10 株式会社東京精密 Light quantity calculation device and light quantity calculation method
EP1498935B1 (en) * 2003-07-15 2006-04-26 Tokyo Seimitsu Co.,Ltd. Device for calculating the quantity of light and method thereof
JP4638172B2 (en) * 2004-03-31 2011-02-23 積水化学工業株式会社 IC chip manufacturing method and IC chip manufacturing apparatus
JP2006324373A (en) * 2005-05-18 2006-11-30 Matsushita Electric Ind Co Ltd Method and device of pickup of chip
JP5117709B2 (en) 2006-12-04 2013-01-16 リンテック株式会社 Ultraviolet irradiation apparatus and ultraviolet irradiation method
JP5356842B2 (en) * 2009-01-28 2013-12-04 リンテック株式会社 Light irradiation apparatus and light irradiation method
JP2011040476A (en) 2009-08-07 2011-02-24 Lintec Corp Device and method for applying energy
KR101372394B1 (en) * 2012-11-23 2014-03-12 주식회사 대성엔지니어링 Led ultraviolet irradiation apparatus
KR102633533B1 (en) 2018-11-09 2024-02-06 주식회사 엘지화학 Method for plasma etching process using faraday box
KR102426261B1 (en) 2019-09-26 2022-07-29 주식회사 엘지화학 Adhesive composition for dicing tape and dicing tape comprising the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2004090A (en) * 1977-09-09 1979-03-21 Coberly & Ass Power apparatus for driving a lamp at constant intensity
US4718967A (en) * 1985-12-12 1988-01-12 Efuesukei Kabushiki Kaisha Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0431637B1 (en) * 1989-12-08 1993-06-02 Sumitomo Electric Industries, Ltd. Pickup method and the pickup apparatus for a chip-type part
JP3232575B2 (en) * 1990-10-16 2001-11-26 ソニー株式会社 Semiconductor processing equipment
JPH0636984A (en) * 1992-07-13 1994-02-10 Canon Inc Aligner
JPH06196554A (en) * 1992-12-24 1994-07-15 Nitto Denko Corp Ultraviolet ray irradiation system
JPH06196555A (en) * 1992-12-24 1994-07-15 Nitto Denko Corp Ultraviolet ray irradiation system
CA2115947A1 (en) * 1993-03-03 1994-09-04 Gregory C. Smith Wafer-like processing after sawing dmds
KR950001831A (en) * 1993-06-23 1995-01-04 박경팔 Light amount automatic control exposure device
KR200177254Y1 (en) * 1994-11-05 2000-04-15 김영환 Die pickup apparatus of die bond device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2004090A (en) * 1977-09-09 1979-03-21 Coberly & Ass Power apparatus for driving a lamp at constant intensity
US4718967A (en) * 1985-12-12 1988-01-12 Efuesukei Kabushiki Kaisha Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP6196555 A,Nitto Denko Corpn,Japanese abstract & Derwent abstract *

Also Published As

Publication number Publication date
KR970052125A (en) 1997-07-29
DE19648062B4 (en) 2009-01-29
KR100479893B1 (en) 2005-06-27
JP3518786B2 (en) 2004-04-12
MY116683A (en) 2004-03-31
SG60026A1 (en) 1999-02-22
JPH09162141A (en) 1997-06-20
DE19648062A1 (en) 1997-06-05
GB2307759A (en) 1997-06-04
GB9623114D0 (en) 1997-01-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20111106