KR970052125A - Irradiation apparatus for irradiating dicing tape and its investigation method - Google Patents

Irradiation apparatus for irradiating dicing tape and its investigation method Download PDF

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Publication number
KR970052125A
KR970052125A KR1019960060273A KR19960060273A KR970052125A KR 970052125 A KR970052125 A KR 970052125A KR 1019960060273 A KR1019960060273 A KR 1019960060273A KR 19960060273 A KR19960060273 A KR 19960060273A KR 970052125 A KR970052125 A KR 970052125A
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South Korea
Prior art keywords
chamber
light source
dicing tape
irradiating
light
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KR1019960060273A
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Korean (ko)
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KR100479893B1 (en
Inventor
에이이찌 이리에
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쇼지 고오메이
린텍 가부시끼가이샤
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Publication of KR970052125A publication Critical patent/KR970052125A/en
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Publication of KR100479893B1 publication Critical patent/KR100479893B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation

Abstract

반도체 웨이퍼를 다이싱 테이프에 접합시키기 위해 사용된 광경화성 접착제의 접착 강도를 약화시키기 위해 소재를 조사하는 조사 장치는 소재를 고정시키는 챔버, 소재를 조사하는 고압 수은 램프, 램프에 단형파(rectangular waveform) 교류전류를 공급하는 인버터가 설치된 전원, 램프에 의해 방출된 광을 반사하는 반사거울, 챔버가 이동할 수 있게 하는 유도 레일, 유로 레일을 따르는 챔버의 이동 속도를 설정하는 조작부, 램프에 의해 방출된 광의 조도를 검출하기 위한 광검출 센서, 기준 조도를 설정하는 기준 조도 설정부, 램프가 설정된 기준 조도로 광을 방출하도록 하기 위해 전원으로부터 램프로 출력된 전력을 제어하는 마이크로컴퓨터가 설치된 제어부, 및 챔버를 조작부에 의해 설정된 속도로 이동시키기 위한 구동부를 포함한다.Irradiation devices for irradiating the material to weaken the adhesive strength of the photocurable adhesive used to bond the semiconductor wafer to the dicing tape include a chamber for fixing the material, a high pressure mercury lamp for irradiating the material, and a rectangular waveform in the lamp. ) Power supply with an inverter supplying alternating current, reflection mirror reflecting light emitted by the lamp, induction rail allowing the chamber to move, control panel for setting the moving speed of the chamber along the flow path rail, emitted by the lamp A chamber equipped with a light detection sensor for detecting illuminance of light, a reference illuminance setting unit for setting a reference illuminance, a microcomputer for controlling the power output from the power supply to the lamp so that the lamp emits light at a set reference illuminance, and a chamber It includes a drive unit for moving the at a speed set by the operation unit.

Description

다이싱 테이프를 조사하는 조사 장치 및 그 조사 방법Irradiation apparatus for irradiating dicing tape and its investigation method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 제1도에 도시된 장치의 회로 구조를 도시하는 블럭 다이어그램.2 is a block diagram showing the circuit structure of the apparatus shown in FIG.

Claims (13)

접착제가 도포된 다이싱 테이프를 조사하는 조사 장치에 있어서; 상기 접착제의 접착 강도를 약화시키기 위해 상기 다이싱 테이프를 광으로 조사하기 위한 광원; 상기 광원에 전력을 공급하기 위한 전원; 기준 조도를 설정하는 수단; 및 상기 광원이 상기 기준 조도 설정 수단에 의해 설정된 기준 조도로 광을 방출하도록 하게 하기 위해 상기 전원으로부터 상기 광원에 공급된 전력을 제어하는 제어수단을 포함하는 것을 특징으로 하는 조사장치.An irradiation apparatus for irradiating a dicing tape coated with an adhesive; A light source for irradiating the dicing tape with light to weaken the adhesive strength of the adhesive; A power supply for supplying power to the light source; Means for setting a reference illuminance; And control means for controlling the power supplied from the power source to the light source to cause the light source to emit light at the reference illuminance set by the reference illuminance setting means. 제1항에 있어서, 상기 다이싱 테이프와 상기 광원 사이에 상대적이 이동을 발생시키기 위한 이동 수단을 더 포함하는 것을 특징으로 하는 조사장치.The irradiating apparatus according to claim 1, further comprising moving means for generating a relative movement between the dicing tape and the light source. 제2항에 있어서, 상기 이동 수단에 의해 발생된 이동 속도를 조정하는 속도 조정 수단을 더 포함하는 것을 특징으로 하는 조사장치.The irradiation apparatus according to claim 2, further comprising speed adjusting means for adjusting a moving speed generated by said moving means. 제2항에 있어서, 상기 이동 수단은 상기 다이싱 테이프를 수용하는 챔버 및 상기 챔버를 밀봉하는 커버를 포함하는 것을 특징으로 하는 조사장치.The irradiating apparatus according to claim 2, wherein said moving means comprises a chamber for receiving said dicing tape and a cover for sealing said chamber. 제3항에 있어서, 상기 이동 수단은 상기 다이싱 테이프를 수용하는 챔버 및 상기 챔버를 밀봉하는 커버를 포함하는 것을 특징으로 하는 조사장치.4. An irradiation apparatus according to claim 3, wherein said moving means comprises a chamber for receiving said dicing tape and a cover for sealing said chamber. 제4항에 있어서, 상기 챔버의 내부로부터 산소를 제거하는 탈산소화 수단을 더 포함하는 것을 특징으로 하는 조사 장치.5. The irradiation apparatus of claim 4, further comprising deoxygenation means for removing oxygen from the interior of the chamber. 제5항에 있어서, 상기 챔버의 내부로부터 산소를 제거하는 탈산소화 수단을 더 포함하는 것을 특징으로 하는 조사 장치.6. The irradiation apparatus of claim 5, further comprising deoxygenation means for removing oxygen from the interior of the chamber. 제1항에 있어서, 상기 제어 수단은 상기 광원에 의해 방출된 광의 조도를 검출하기 위한 광검출 수단을 포함하는 것을 특징으로 하는 조사 장치.2. An irradiation apparatus according to claim 1, wherein said control means includes light detecting means for detecting illuminance of light emitted by said light source. 제4항에 있어서, 상기 이동 수단은 상기 챔버의 이동을 유도하기 위한 적어도 하나의 유도 레일, 상기 챔버에 접속된 벨트, 상기 벨트를 걸기 위한 제1 및 제2풀리, 및 상기 제1 및 제2풀리 중 적어노 하나에 접속되 모터를 더 포함하는 것을 특징으로 하는 조사 장치.5. The apparatus of claim 4, wherein said moving means comprises at least one guide rail for guiding movement of said chamber, a belt connected to said chamber, first and second pulleys for fastening said belt, and said first and second Irradiation apparatus further comprises a motor connected to at least one of the pulleys. 제5항에 있어서, 상기 이동 수단은 상기 챔버의 이동을 유도하기 위한 적어도 하나의 유도 레일, 상기 챔버에 접속된 벨트, 상기 벨트를 걸기 위한 제1 및 제2풀리, 및 상기 제1 및 제2풀리 중 적어도 하나에 접속된 모터를 더 포함하는 것을 특징으로 하는 조사 장치.The method of claim 5, wherein the moving means comprises at least one guide rail for guiding movement of the chamber, a belt connected to the chamber, first and second pulleys for fastening the belt, and the first and second And a motor connected to at least one of the pulleys. 접착제가 도포된 다이싱 테이프를 조사하는 방법에 있어서: 상기 다이싱 테이프를 광원으로부터 방출된 광으로 조사하는 단계; 및 상기 광원이 소정의 조도로 광으 방출하도록 하게 하기 위해 상기 전원으로부터 상기 광원에 공급된 전력을 제어하는 단계를 포함하는 것을 특징으로 하는 조사 방법.A method of irradiating an adhesive applied dicing tape, comprising: irradiating the dicing tape with light emitted from a light source; And controlling the power supplied from the power source to the light source to cause the light source to emit light at a predetermined illuminance. 제11항에 있어서, 상기 다이싱 테이프와 상기 광원 사이에 상대적인 이동을 발생시키는 단계를 더 포함하는 것을 특징으로 하는 조사 방법.12. The method of claim 11, further comprising generating relative movement between the dicing tape and the light source. 제12항에 있어서, 광원에 공급된 전력을 제어하는 상기 단계는 상기 광원에 의해 방출된 광의 조도를 검출하는 단계를 포함하는 것을 특징으로 하는 조사 방법.13. The method of claim 12, wherein controlling the power supplied to the light source comprises detecting illuminance of light emitted by the light source. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019960060273A 1995-12-02 1996-11-30 Irradiation apparatus for irradiating dicing tape and its irradiation method KR100479893B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-338311 1995-12-02
JP33831195A JP3518786B2 (en) 1995-12-02 1995-12-02 Light irradiation device and light irradiation method for dicing tape

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KR970052125A true KR970052125A (en) 1997-07-29
KR100479893B1 KR100479893B1 (en) 2005-06-27

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JP (1) JP3518786B2 (en)
KR (1) KR100479893B1 (en)
DE (1) DE19648062B4 (en)
GB (1) GB2307759B (en)
MY (1) MY116683A (en)
SG (1) SG60026A1 (en)

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JP2006324373A (en) * 2005-05-18 2006-11-30 Matsushita Electric Ind Co Ltd Method and device of pickup of chip
JP5117709B2 (en) 2006-12-04 2013-01-16 リンテック株式会社 Ultraviolet irradiation apparatus and ultraviolet irradiation method
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Publication number Publication date
GB2307759B (en) 2000-02-09
DE19648062B4 (en) 2009-01-29
KR100479893B1 (en) 2005-06-27
JP3518786B2 (en) 2004-04-12
MY116683A (en) 2004-03-31
SG60026A1 (en) 1999-02-22
JPH09162141A (en) 1997-06-20
DE19648062A1 (en) 1997-06-05
GB2307759A (en) 1997-06-04
GB9623114D0 (en) 1997-01-08

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