JPH09162141A - Light irradiation device for dicing tape and light irradiation method - Google Patents
Light irradiation device for dicing tape and light irradiation methodInfo
- Publication number
- JPH09162141A JPH09162141A JP7338311A JP33831195A JPH09162141A JP H09162141 A JPH09162141 A JP H09162141A JP 7338311 A JP7338311 A JP 7338311A JP 33831195 A JP33831195 A JP 33831195A JP H09162141 A JPH09162141 A JP H09162141A
- Authority
- JP
- Japan
- Prior art keywords
- light
- dicing tape
- illuminance
- lamp
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ダイシングテープ
上に塗布された粘着剤を硬化させる光を照射するダイシ
ングテープ用光照射装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing tape light irradiating device for irradiating light for curing an adhesive applied on a dicing tape.
【０００２】[0002]
【従来の技術】従来より、半導体ウェハに形成されたＩ
Ｃ回路を各チップに切断（ダイシング）する際に、ウェ
ハをダイシングテープ上に張り付け固定することが行わ
れている。このダイシングテープには、ウェハを固定す
るため、光硬化性の粘着剤が塗布される（例えば、特公
平１−５６１１２号公報参照）。そして、ダイシング
後、粘着剤に光（または放射線）を当てて硬化させてそ
の粘着力を弱め、各チップをピックアップする。2. Description of the Related Art I formed on a semiconductor wafer has been conventionally used.
When the C circuit is cut (diced) into chips, a wafer is attached and fixed on a dicing tape. A photo-curable adhesive is applied to the dicing tape to fix the wafer (see, for example, Japanese Patent Publication No. 1-56112). Then, after dicing, light (or radiation) is applied to the adhesive to cure it and weaken the adhesive force, and each chip is picked up.
【０００３】ダイシングテープ用光照射装置は、上記粘
着剤に光を当てるための装置であって、光源としては、
一般に、高圧水銀ランプ、メタルハライドランプ等が使
用されている。これらの光源は、初期のランプ照度が最
大であり、その後ランプ電極の劣化に伴い、照度は徐々
に低下していく。The dicing tape light irradiating device is a device for irradiating the adhesive with light, and as a light source,
Generally, a high pressure mercury lamp, a metal halide lamp, etc. are used. These light sources have the maximum lamp illuminance in the initial stage, and then the illuminance gradually decreases as the lamp electrodes deteriorate.
【０００４】そのため、従来の照射装置にあっては、ラ
ンプの劣化を見込んで、ランプが劣化しても必要な照度
が得られるように、始めから大きい電力でランプを駆動
していた。したがって、ランプが新しいうちは、必要以
上の電力が供給され、ダイシングテープにも必要以上の
照度で光が照射されていた。Therefore, in the conventional irradiating device, in consideration of the deterioration of the lamp, the lamp is driven from the beginning with a large electric power so that the required illuminance can be obtained even if the lamp is deteriorated. Therefore, while the lamp was new, more power was supplied than necessary and the dicing tape was also illuminated with more light than necessary.
【０００５】[0005]
【発明が解決しようとする課題】しかし、ランプ照度が
強すぎぎると、ウェハやテープにダメージを与えるおそ
れがあるという問題があった。また、ランプの劣化によ
ってテープに照射される光の照度が変化（低下）する
と、それに応じて光量の制御をする必要があり、制御が
複雑になるという問題があった。However, if the illuminance of the lamp is too strong, there is a problem that the wafer or tape may be damaged. Further, when the illuminance of the light irradiated on the tape changes (decreases) due to the deterioration of the lamp, it is necessary to control the light amount accordingly, which causes a problem that the control becomes complicated.
【０００６】[0006]
【課題を解決するための手段】本発明者は、鋭意研究を
重ねた結果、ダイシングテープに照射する光の照度を一
定にすることにより、上記課題を解決できることに想到
した。As a result of intensive studies, the present inventor has realized that the above problems can be solved by keeping the illuminance of light applied to the dicing tape constant.
【０００７】すなわち、本発明においては、ダイシング
テープ上に塗布された粘着剤を硬化させるための光を照
射する光源と、光源に電力を供給する電源手段と、基準
照度を設定する手段と、照射光の照度が基準照度になる
ように前記電源手段から供給される電力を制御する制御
手段とによって照射装置を構成した。That is, in the present invention, a light source for irradiating light for curing the adhesive applied on the dicing tape, a power source means for supplying electric power to the light source, a means for setting a reference illuminance, and an irradiation The irradiation device is configured by the control unit that controls the electric power supplied from the power supply unit so that the illuminance of light becomes the reference illuminance.
【０００８】ここで、粘着剤を硬化させるための「光」
には、可視光、紫外線等ばかりでなく、放射線、電子線
等も含まれる。また、「照度」は、可視光、紫外線、放
射線、電子線等の単位面積当りの強さを意味する。Here, "light" for curing the adhesive
Includes not only visible light and ultraviolet rays but also radiation and electron beams. The "illuminance" means the intensity of visible light, ultraviolet rays, radiation, electron beams, etc. per unit area.
【０００９】さらに、上記照射装置に、ダイシングテー
プを移動させる移動手段を設け、光を照射しながらダイ
シングテープを移動させれば、全面を均一に照射するこ
とができる。Furthermore, if the moving device for moving the dicing tape is provided in the irradiation device and the dicing tape is moved while irradiating light, the entire surface can be uniformly irradiated.
【００１０】また、上記移動手段による移動速度を可変
にしてもよく、そうすれば光量（照度×時間）の設定が
容易にできる。Further, the moving speed of the moving means may be variable, which makes it easy to set the light quantity (illuminance × time).
【００１１】[0011]
【発明の実施の形態】以下本発明について図面を参照し
て説明する。図１は本発明の一実施例の照射装置を示す
概略図であり、照射装置本体１内には、ランプケース３
が配置され、ランプケース３内に光源としての高圧水銀
ランプ（またはメタルハライドランプ）５が反射鏡７内
に配置されている。ケース３の上面には、ランプ５から
の光を照射するためのスリット３ａが形成され、スリッ
ト３ａはシャッタ９によって開閉される。スリット３ａ
の上方には、ワークＷを収容するチェンバ１１が、ガイ
ド１３に沿ってスライド自在に取り付けられている。な
おガイド１３は装置本体１に固定されている。DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing an irradiation device according to an embodiment of the present invention. In the irradiation device main body 1, a lamp case 3 is provided.
And a high pressure mercury lamp (or a metal halide lamp) 5 as a light source is arranged in the lamp case 3 in the reflecting mirror 7. A slit 3a for irradiating light from the lamp 5 is formed on the upper surface of the case 3, and the slit 3a is opened and closed by a shutter 9. Slit 3a
A chamber 11 for accommodating the work W is slidably attached along the guide 13 above the. The guide 13 is fixed to the apparatus body 1.
【００１２】ワークＷは、図２に示すように、粘着剤を
塗布したダイシングテープ１９に半導体ウェハ２１が接
着マウントされたものである。ダイシングテープ１９の
周辺部はリングフレーム２３によって補強されている。As shown in FIG. 2, the work W is a dicing tape 19 coated with an adhesive, to which a semiconductor wafer 21 is adhesively mounted. The peripheral portion of the dicing tape 19 is reinforced by the ring frame 23.
【００１３】チェンバ１１は、図１に示すように、ワー
クＷを截置する凹部を有し、この凹部は蓋体１５によっ
て密閉されて密閉容器を形成している。チェンバ１１の
底部には、紫外線透過ガラスから成る透光窓が形成され
ている。光照射時には、チェンバ１１内に窒素ガスが導
入され、酸素を排除した雰囲気内で、透光窓を通して光
が照射される。なお、チェンバ１１の一構成例につい
て、本出願人による実用新案登録出願（実公平６−４３
１４３号公報）において詳細に説明されている。As shown in FIG. 1, the chamber 11 has a recess for placing the work W therein, and the recess is sealed by a lid 15 to form a closed container. A transparent window made of ultraviolet transparent glass is formed on the bottom of the chamber 11. At the time of light irradiation, nitrogen gas is introduced into the chamber 11 and light is irradiated through the translucent window in an atmosphere in which oxygen is excluded. Regarding one configuration example of the chamber 11, a utility model registration application (actual fair 6-43) by the present applicant.
No. 143).
【００１４】図１において、１７は開閉自在な蓋であ
り、この蓋１７を開閉してワークＷの出し入れを行う。
また、ケース３の下方には、冷却ファンを装備した冷却
ダクト２５が取り付けられ、冷却ダクト２５は排気口２
７へ接続されている。In FIG. 1, reference numeral 17 denotes a lid that can be opened and closed. The lid 17 is opened and closed to insert and remove the work W.
Further, below the case 3, a cooling duct 25 equipped with a cooling fan is attached, and the cooling duct 25 is connected to the exhaust port 2
7 is connected.
【００１５】図２は照射装置の回路構成の概略を示すブ
ロック図であり、電源部２９はインバータを備えランプ
５に矩形波交流を供給する。反射鏡７の底部には小孔７
ａが形成され、ランプ５の光は、小孔７ａから光ファイ
バ３１を通って光検出センサ３３で受光される。光検出
センサ３３としては、例えばシリコンフォトダイオード
等を使用する。駆動部３５は、チェンバ１１をガイド１
３に沿って（図２の矢印Ａ方向に）移動させるもので、
例えば、モータの回転力を、ボールネジ、ラックとピニ
オン、またはプーリとベルトを介して、直線運動に変換
する機構によって構成される。制御部３７は、光検出セ
ンサ３３からの信号を入力して、その信号値に応じて電
源部２９や駆動部３５を制御するもので、例えばマイク
ロコンピュータ等によって構成される。FIG. 2 is a block diagram showing a schematic circuit configuration of the irradiation device, and the power supply unit 29 is provided with an inverter and supplies a rectangular wave AC to the lamp 5. A small hole 7 is formed at the bottom of the reflecting mirror 7.
a is formed, and the light of the lamp 5 is received by the photodetection sensor 33 from the small hole 7a through the optical fiber 31. As the light detection sensor 33, for example, a silicon photodiode or the like is used. The drive unit 35 guides the chamber 11 to the guide 1.
To move along 3 (in the direction of arrow A in FIG. 2),
For example, it is configured by a mechanism that converts the rotational force of the motor into a linear motion via a ball screw, a rack and a pinion, or a pulley and a belt. The control unit 37 inputs a signal from the light detection sensor 33 and controls the power supply unit 29 and the drive unit 35 according to the signal value, and is configured by, for example, a microcomputer or the like.
【００１６】操作部３９は、基準照度を設定する基準照
度設定部４１と、チェンバ１１の移動速度を設定する速
度設定部４３とを備え、各設定部４１，４３は例えばポ
テンショメータ等によって構成され、ここで設定された
値は制御部３７へ出力される。操作部３９には、その他
にも、電源スイッチ、スタートスイッチ等のスイッチ類
が設けられている。The operation unit 39 includes a reference illuminance setting unit 41 for setting the reference illuminance and a speed setting unit 43 for setting the moving speed of the chamber 11. Each of the setting units 41, 43 is composed of, for example, a potentiometer or the like. The value set here is output to the control unit 37. In addition to this, the operation unit 39 is provided with switches such as a power switch and a start switch.
【００１７】基準照度を設定する際は、例えば、シャッ
タ１１を開いたときにワークＷが截置された位置の照度
を実際に測定し、そのときの照度が希望する照度（例え
ば１２０ｍＷ／ｃｍ2）になるように基準照度設定部４
３を調整する。こうして調整された照度が基準照度とし
て設定される。あるいは、基準照度設定部４３の設定値
をダイシングテープの種類に応じて複数設定しておき、
オペレータがそのうちの１つを選択するようにしてもよ
い。なお、図２の例では、センサ３３の受光部をランプ
直下の反射鏡７に設置したが（図２の７ａ）、センサ３
３による光検出位置はそれに限らず、他の位置（チェン
バ１１の直下等）でもよい。When setting the reference illuminance, for example, the illuminance at the position where the work W is placed when the shutter 11 is opened is actually measured, and the illuminance at that time is the desired illuminance (for example, 120 mW / cm 2). ) Reference illuminance setting unit 4
Adjust 3. The illuminance thus adjusted is set as the reference illuminance. Alternatively, a plurality of setting values of the reference illuminance setting unit 43 are set according to the type of dicing tape,
The operator may select one of them. In the example of FIG. 2, the light receiving portion of the sensor 33 is installed on the reflecting mirror 7 directly below the lamp (7a in FIG. 2).
The light detection position by 3 is not limited to that, and may be another position (eg, directly below the chamber 11).
【００１８】速度設定部４３は、チェンバ１１の移動速
度を設定する。これにより、ダイシングテープに照射さ
れる光の光量（照度×時間）を調整することができる。
例えば、ウェハの大きさや種類、あるいはダイシングテ
ープの種類に応じてチェンバ１１の移動速度を可変設定
する。The speed setting unit 43 sets the moving speed of the chamber 11. Thereby, the amount of light (illuminance × time) applied to the dicing tape can be adjusted.
For example, the moving speed of the chamber 11 is variably set according to the size and type of wafer or the type of dicing tape.
【００１９】次に図３のフローチャートを用いて実施例
の動作を説明する。まず操作部３９の電源スイッチを入
れると、電源部２９から矩形波交流が供給され、ランプ
５が点灯する（ステップ３０１）。このときの電力は、
待機状態の値、例えば電源部２９の最大出力の２分の１
の値に設定しておく。次にワークＷをチェンバ１１にセ
ットし（ステップ３０２）、操作部３９のスタートスイ
ッチをオンにすると（ステップ３０３）、チェンバ１１
内に窒素ガスが供給され、チェンバ１１が定位置（スタ
ート位置）に移動する（ステップ３０４）。チェンバ１
１内に窒素ガスを導入する理由は、上記公報にも説明し
てあるとおり、チェンバ１１内の酸素を排除することに
よりダイシングテープの硬化を早めるためである。Next, the operation of the embodiment will be described with reference to the flow chart of FIG. First, when the power switch of the operation unit 39 is turned on, the rectangular wave AC is supplied from the power supply unit 29, and the lamp 5 is turned on (step 301). The power at this time is
The value of the standby state, for example, one half of the maximum output of the power supply unit 29
Set to the value of. Next, the work W is set in the chamber 11 (step 302), and the start switch of the operation unit 39 is turned on (step 303).
Nitrogen gas is supplied into the chamber, and the chamber 11 moves to a fixed position (start position) (step 304). Chamber 1
The reason for introducing the nitrogen gas into the chamber 1 is to expedite the curing of the dicing tape by eliminating oxygen in the chamber 11 as described in the above publication.
【００２０】その後、シャッタ９が開かれ（ステップ３
０５）、ダイシングテープに対する光照射が開始され
る。このときの光検出センサ３３の値に基づいて出力電
力（電圧および／または電流）を制御する（ステップ３
０６）。すなわち、センサ３３の値が基準照度以下であ
れば、基準照度になるように出力電圧を上昇し、基準照
度以上であれば、出力電力を下げて、センサ３３の値が
基準照度になるようにする。したがって、ランプ５が新
しいうちは、ランプに供給する電力を低く抑えることが
でき、ランプの劣化に伴って、供給電力を上げていけば
よいから、消費電力は全体として低減し省エネルギーを
実現できる。Thereafter, the shutter 9 is opened (step 3
05), light irradiation to the dicing tape is started. The output power (voltage and / or current) is controlled based on the value of the light detection sensor 33 at this time (step 3).
06). That is, when the value of the sensor 33 is equal to or lower than the reference illuminance, the output voltage is increased so as to be the reference illuminance, and when the value is equal to or higher than the reference illuminance, the output power is decreased so that the value of the sensor 33 is equal to the reference illuminance. To do. Therefore, while the lamp 5 is new, the power supplied to the lamp can be suppressed to a low level, and the power supplied can be increased in accordance with the deterioration of the lamp, so that the power consumption as a whole can be reduced and energy saving can be realized.
【００２１】次いで、駆動部３５は、速度設定部４３で
設定された速度でチェンバ１１を移動させて（ステップ
３０７）、ダイシングテープ全体に均一に光を照射す
る。その後シャッタを閉じる（ステップ３０８）。この
際、電源部の２９の出力電力は待機状態の値（最大値の
１／２の値）に戻す。最後に、ワークＷを取り出して
（ステップ３０９）終了する。Next, the drive unit 35 moves the chamber 11 at the speed set by the speed setting unit 43 (step 307) to uniformly irradiate the entire dicing tape with light. After that, the shutter is closed (step 308). At this time, the output power of 29 of the power supply unit is returned to the value in the standby state (1/2 of the maximum value). Finally, the work W is taken out (step 309) and the process is completed.
【００２２】以上のように、実施例の装置によれば、光
の照度が一定になるように制御されるので、従来の装置
のように必要以上の照度の光が照射されないため、ウェ
ハやテープを痛めることなく、また電力消費も低減させ
ることができる。As described above, according to the apparatus of the embodiment, since the illuminance of light is controlled to be constant, light having an illuminance more than necessary is not emitted unlike the conventional apparatus, so that a wafer or a tape is used. The power consumption can be reduced without damaging the battery.
【００２３】また、照度が一定であるから光量の調整も
簡単である。すなわち、チェンバの速度を一定にすれ
ば、常に同じ光量の照射を行うことができ、光量制御が
極めて簡単になる。さらに、チェンバの速度を可変にす
ることにより、ウェハの大きさや種類に応じた光量調節
を容易に行うことができる。Further, since the illuminance is constant, it is easy to adjust the light quantity. That is, if the speed of the chamber is kept constant, the same amount of light can always be emitted, and the amount of light control becomes extremely simple. Furthermore, by changing the speed of the chamber, it is possible to easily adjust the light amount according to the size and type of the wafer.
【００２４】上記実施例においては、ウェハを移動させ
ながら光を照射するタイプの装置を例に取ったが、本発
明にそれに限らず、ウェハを移動させることなく光を照
射させるタイプの装置にも適用可能である。その場合の
光量の調整はシャッタ速度の調整によって行う。したが
って、本発明を利用すれば、ランプのシャッタ速度を一
定にすれば常に同じ光量の照射を行うことができ、シャ
ッタ速度の制御だけを行えば光量調整ができるという利
点がある。In the above-mentioned embodiment, the device of the type that irradiates the light while moving the wafer is taken as an example, but the invention is not limited to this, and the device of the type that irradiates the light without moving the wafer is also used. Applicable. In that case, the light amount is adjusted by adjusting the shutter speed. Therefore, according to the present invention, there is an advantage that the same amount of light can be always emitted if the shutter speed of the lamp is constant, and the amount of light can be adjusted only by controlling the shutter speed.
【００２５】[0025]
【発明の効果】以上説明したように、本発明によれば、
常に一定の照度でダイシングテープに光を照射すること
ができる。これによってテープやウェハに必要以上の強
さの光を照射することがなくダメージを与えることがな
くなる。また、照度が一定になるから、光量の制御が簡
単になり、ウェハはダイシングテープの種類に応じた最
適な光量調整ができるという効果が得られる。As described above, according to the present invention,
It is possible to irradiate the dicing tape with light with a constant illuminance. As a result, the tape or wafer is not irradiated with light having an intensity higher than necessary and is not damaged. Further, since the illuminance is constant, the control of the light quantity is simplified, and the wafer can be adjusted to the optimum light quantity according to the type of dicing tape.
【図１】本発明の一実施例の概略構成図。FIG. 1 is a schematic configuration diagram of an embodiment of the present invention.
【図２】図１の実施例の回路構成を示すブロック図。FIG. 2 is a block diagram showing a circuit configuration of the embodiment of FIG.
【図３】実施例の動作を説明するフローチャート。FIG. 3 is a flowchart illustrating the operation of the embodiment.
５ 高圧水銀ランプ １９ ダイシングテープ ２９ 電源部 ３３ 光検出センサ ３７ 制御部 5 High-pressure mercury lamp 19 Dicing tape 29 Power supply section 33 Optical detection sensor 37 Control section
Claims (4)
を硬化させるための光を照射する光源と、前記光源に電
力を供給する電源手段と、基準照度を設定する手段と、
前記光の照度が基準照度になるように前記電源手段から
供給される電力を制御する制御手段とを設けたことを特
徴とするダイシングテープ用光照射装置。1. A light source for irradiating light for curing an adhesive applied on a dicing tape, a power supply means for supplying electric power to the light source, and a means for setting a reference illuminance,
A dicing tape light irradiation device comprising: a control unit that controls the electric power supplied from the power supply unit so that the illuminance of the light becomes a reference illuminance.
て移動させる移動手段を設けた請求項１に記載の照射装
置。2. The irradiation device according to claim 1, further comprising moving means for moving the dicing tape with respect to the light source.
手段を設けた請求項２に記載の照射装置。3. The irradiation device according to claim 2, further comprising adjusting means for adjusting a moving speed of the moving means.
イシングテープ上に塗布された粘着剤を硬化させるダイ
シングテープ用光照射方法において、前記光の照度を検
出し、検出した照度が一定になるように前記光の出力を
制御することを特徴とするダイシングテープ用光照射方
法。4. A dicing tape light irradiation method for irradiating a dicing tape with light to cure an adhesive applied on the dicing tape, wherein the illuminance of the light is detected so that the detected illuminance becomes constant. A light irradiation method for a dicing tape, characterized in that the output of the light is controlled.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33831195A JP3518786B2 (en) | 1995-12-02 | 1995-12-02 | Light irradiation device and light irradiation method for dicing tape |
| MYPI96004484A MY116683A (en) | 1995-12-02 | 1996-10-29 | Illumination apparatus for irradiating dicing tape and method of illumination thereof |
| GB9623114A GB2307759B (en) | 1995-12-02 | 1996-11-06 | Illumination apparatus for irradiating dicing tape and method of illumniation thereof |
| DE19648062A DE19648062B4 (en) | 1995-12-02 | 1996-11-20 | Exposure device for irradiating dice tape and method for its exposure |
| SG1996011464A SG60026A1 (en) | 1995-12-02 | 1996-11-29 | Illumination apparatus for irradiating dicing tape and method of illumination thereof |
| KR1019960060273A KR100479893B1 (en) | 1995-12-02 | 1996-11-30 | Irradiation apparatus for irradiating dicing tape and its irradiation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33831195A JP3518786B2 (en) | 1995-12-02 | 1995-12-02 | Light irradiation device and light irradiation method for dicing tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09162141A true JPH09162141A (en) | 1997-06-20 |
| JP3518786B2 JP3518786B2 (en) | 2004-04-12 |
Family
ID=18316946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33831195A Expired - Lifetime JP3518786B2 (en) | 1995-12-02 | 1995-12-02 | Light irradiation device and light irradiation method for dicing tape |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP3518786B2 (en) |
| KR (1) | KR100479893B1 (en) |
| DE (1) | DE19648062B4 (en) |
| GB (1) | GB2307759B (en) |
| MY (1) | MY116683A (en) |
| SG (1) | SG60026A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004072040A (en) * | 2002-08-09 | 2004-03-04 | Lintec Corp | Dicing tape with attribute indication and method for manufacturing same |
| JP2005051229A (en) * | 2003-07-15 | 2005-02-24 | Tokyo Seimitsu Co Ltd | Device and method for light volume calculation |
| JP2005294536A (en) * | 2004-03-31 | 2005-10-20 | Sekisui Chem Co Ltd | Method and device for manufacturing ic chip |
| KR100530153B1 (en) * | 2001-05-22 | 2005-11-21 | 우시오덴키 가부시키가이샤 | Light irradiation device |
| JP2006324373A (en) * | 2005-05-18 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Method and device of pickup of chip |
| US7158910B2 (en) | 2003-07-15 | 2007-01-02 | Tokyo Seimitsu Co., Ltd. | Device for calculating the quantity of light and method thereof |
| DE112007002751T5 (en) | 2006-12-04 | 2009-10-15 | Lintec Corp. | UV irradiation device and UV irradiation method |
| JP2010177322A (en) * | 2009-01-28 | 2010-08-12 | Lintec Corp | Light irradiation apparatus and method |
| US8748850B2 (en) | 2009-08-07 | 2014-06-10 | Lintec Corporation | Energy application device and energy application method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4488686B2 (en) * | 2003-03-12 | 2010-06-23 | 日東電工株式会社 | Ultraviolet irradiation method and apparatus using the same |
| KR101372394B1 (en) * | 2012-11-23 | 2014-03-12 | 주식회사 대성엔지니어링 | Led ultraviolet irradiation apparatus |
| KR102633533B1 (en) | 2018-11-09 | 2024-02-06 | 주식회사 엘지화학 | Method for plasma etching process using faraday box |
| KR102426261B1 (en) | 2019-09-26 | 2022-07-29 | 주식회사 엘지화학 | Adhesive composition for dicing tape and dicing tape comprising the same |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4190795A (en) * | 1977-09-09 | 1980-02-26 | Coberly & Associates | Constant intensity light source |
| PH25206A (en) * | 1985-12-12 | 1991-03-27 | Lintec K K | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| EP0431637B1 (en) * | 1989-12-08 | 1993-06-02 | Sumitomo Electric Industries, Ltd. | Pickup method and the pickup apparatus for a chip-type part |
| JP3232575B2 (en) * | 1990-10-16 | 2001-11-26 | ソニー株式会社 | Semiconductor processing equipment |
| JPH0636984A (en) * | 1992-07-13 | 1994-02-10 | Canon Inc | Aligner |
| JPH06196554A (en) * | 1992-12-24 | 1994-07-15 | Nitto Denko Corp | Ultraviolet ray irradiation system |
| JPH06196555A (en) * | 1992-12-24 | 1994-07-15 | Nitto Denko Corp | Ultraviolet ray irradiation system |
| CA2115947A1 (en) * | 1993-03-03 | 1994-09-04 | Gregory C. Smith | Wafer-like processing after sawing dmds |
| KR950001831A (en) * | 1993-06-23 | 1995-01-04 | 박경팔 | Light amount automatic control exposure device |
| KR200177254Y1 (en) * | 1994-11-05 | 2000-04-15 | 김영환 | Die pickup apparatus of die bond device |
-
1995
- 1995-12-02 JP JP33831195A patent/JP3518786B2/en not_active Expired - Lifetime
-
1996
- 1996-10-29 MY MYPI96004484A patent/MY116683A/en unknown
- 1996-11-06 GB GB9623114A patent/GB2307759B/en not_active Expired - Fee Related
- 1996-11-20 DE DE19648062A patent/DE19648062B4/en not_active Expired - Fee Related
- 1996-11-29 SG SG1996011464A patent/SG60026A1/en unknown
- 1996-11-30 KR KR1019960060273A patent/KR100479893B1/en not_active IP Right Cessation
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100530153B1 (en) * | 2001-05-22 | 2005-11-21 | 우시오덴키 가부시키가이샤 | Light irradiation device |
| JP2004072040A (en) * | 2002-08-09 | 2004-03-04 | Lintec Corp | Dicing tape with attribute indication and method for manufacturing same |
| JP2005051229A (en) * | 2003-07-15 | 2005-02-24 | Tokyo Seimitsu Co Ltd | Device and method for light volume calculation |
| US7158910B2 (en) | 2003-07-15 | 2007-01-02 | Tokyo Seimitsu Co., Ltd. | Device for calculating the quantity of light and method thereof |
| JP4578165B2 (en) * | 2003-07-15 | 2010-11-10 | 株式会社東京精密 | Light quantity calculation device and light quantity calculation method |
| JP2005294536A (en) * | 2004-03-31 | 2005-10-20 | Sekisui Chem Co Ltd | Method and device for manufacturing ic chip |
| JP4638172B2 (en) * | 2004-03-31 | 2011-02-23 | 積水化学工業株式会社 | IC chip manufacturing method and IC chip manufacturing apparatus |
| JP2006324373A (en) * | 2005-05-18 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Method and device of pickup of chip |
| DE112007002751T5 (en) | 2006-12-04 | 2009-10-15 | Lintec Corp. | UV irradiation device and UV irradiation method |
| JP2010177322A (en) * | 2009-01-28 | 2010-08-12 | Lintec Corp | Light irradiation apparatus and method |
| US8748850B2 (en) | 2009-08-07 | 2014-06-10 | Lintec Corporation | Energy application device and energy application method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970052125A (en) | 1997-07-29 |
| GB2307759B (en) | 2000-02-09 |
| DE19648062B4 (en) | 2009-01-29 |
| KR100479893B1 (en) | 2005-06-27 |
| JP3518786B2 (en) | 2004-04-12 |
| MY116683A (en) | 2004-03-31 |
| SG60026A1 (en) | 1999-02-22 |
| DE19648062A1 (en) | 1997-06-05 |
| GB2307759A (en) | 1997-06-04 |
| GB9623114D0 (en) | 1997-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3518786B2 (en) | Light irradiation device and light irradiation method for dicing tape | |
| US20180110890A1 (en) | Ultraviolet light sterilizer | |
| US5677113A (en) | Method for ashing a photoresist resin film on a semiconductor wafer and an asher | |
| CN1841204A (en) | External exposure device | |
| US20030235972A1 (en) | Thermal processing method and thermal processing apparatus for substrated employing photoirradiation | |
| KR102103632B1 (en) | Exposure device, substrate processing apparatus, exposure method of substrate and substrate processing method | |
| JP3742986B2 (en) | Substrate processing equipment | |
| JP3377320B2 (en) | Substrate peripheral exposure equipment | |
| WO2018159006A1 (en) | Exposure device, substrate treatment device, substrate exposure method, and substrate treatment method | |
| JP2018146616A (en) | Exposure apparatus, substrate processing apparatus, substrate exposure method and substrate processing method | |
| WO2018159005A1 (en) | Exposure device, substrate treatment device, substrate exposure method, and substrate treatment method | |
| JPH0548190A (en) | Laser annealing device | |
| US6843967B2 (en) | Curing unit | |
| JP4311857B2 (en) | UV irradiation equipment | |
| JP2001079387A (en) | Ultraviolet ray irradiation device and method thereof | |
| JP2005026354A (en) | Heat treatment apparatus, heat treatment method, and method for manufacturing semiconductor device | |
| JP2717855B2 (en) | Ashing method | |
| JP5313778B2 (en) | Light irradiation apparatus and light irradiation method | |
| KR20190132728A (en) | Uv-led lamp apparatus and method of tuning the same | |
| JP3878470B2 (en) | Processing equipment | |
| JPH0936077A (en) | Substrate treating device | |
| JPS6297787A (en) | Laser beam machine | |
| JPS6253190B2 (en) | ||
| JP2656232B2 (en) | Processing equipment | |
| JPS5793532A (en) | Treating method for semiconductor wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20040121 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040123 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |