CN1841204A - External exposure device - Google Patents
External exposure device Download PDFInfo
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- CN1841204A CN1841204A CNA2006100660971A CN200610066097A CN1841204A CN 1841204 A CN1841204 A CN 1841204A CN A2006100660971 A CNA2006100660971 A CN A2006100660971A CN 200610066097 A CN200610066097 A CN 200610066097A CN 1841204 A CN1841204 A CN 1841204A
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- exposure
- light emitting
- light source
- peripheral
- emitting diode
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The peripheral exposure device comprises an XY stage 2 for bearing a substrate 1, on which a resist is applied, a rotary table 3 for bearing the XY stage 2, a light source 4 for peripheral exposure which performs peripheral exposure on the substrate 1, a slider 5 for holding the light source 4 for peripheral exposure, an illumination photometer 6 for detecting the output light intensity of the light source 4, a DC power supply 7 for supplying a drive current to the light source 4, and a temperature control mechanism 8 for controlling the temperature of the light source 4. To expose the peripheral region of an object to be exposed with significantly reduces the adverse effects on the object to be exposed, without accompanying wasteful power consumption, realizing smaller size and simplicity.
Description
Technical field
The present invention relates to a kind of external exposure device that liquid crystal is exposed with the peripheral assigned position of exposure object such as glass printing circuit board, semiconductor wafer, sensitive film of being used for.
Background technology
In the past, had to be used for external exposure device that liquid crystal is exposed with the peripheral assigned position of exposure object such as glass printing circuit board, semiconductor wafer, sensitive film, and used in practice.
At display panels, perhaps form in the process of wiring figure on the printed circuit board (PCB) such as semiconductor wafer, at first on whole of printed circuit board (PCB), apply resist, form desirable figure with photoetching process, and be made into wiring figure, but, generally all to determine to cover the exposure position of figure in the banded blank of several millimeters of printed circuit board (PCB) outer part making.
Therefore,, use positive resist if in photo-mask process, then after video picture is handled, the printed circuit board (PCB) outer part residual still unexposedly be banded resist.This resist that left behind is not only unwantedly, and can become dust in the manufacturing process afterwards, and it is as a main cause that reduces productive capacity, and becomes big problem.Therefore, must expose and video picture and removing to the unwanted resist zone on the printed circuit board (PCB) outer part.
Consider this problem, all the time,, for example, the communique at Japanese kokai publication hei 11-154639 is arranged, the device of being put down in writing in the Japanese kokai publication hei 5-190448 communique as the external exposure device of known square printed circuit board (PCB).
At Japanese kokai publication hei 11-154639 communique, in the device of being put down in writing in the Japanese kokai publication hei 5-190448 communique, when exposed in a position of printed circuit board (PCB) outer part, use a discharge lamp as a light source, portion has catoptron, lens combination and cut-off filter within it, from the rayed that wherein emits on the outer part of printed circuit board (PCB), simultaneously by making printed circuit board (PCB), perhaps light source moves, and just can expose to the printed circuit board (PCB) outer part.In addition, the cooling of light source is finished by air cooling, and the hot gas of its generation is discharged by fan blower.
At Japanese kokai publication hei 11-154639 communique, in the device of being put down in writing in the Japanese kokai publication hei 5-190448 communique since with a discharge lamp as a light source, so can produce following problem.
Because the stand-by time and the warm-up period of discharge lamp are longer, therefore when not carrying out the periphery exposure, also want one heading straight for discharge lamp, so just shortened the life-span of discharge lamp, the electric power that consumes has surpassed necessary amount, also will change discharge lamp continually, so the transaction capabilities variation.
Because the thermal value of discharge lamp is very big,, just need large blower therefore in order to cool off it.
Owing to used mercury in the inside of discharge lamp, therefore in the time of the discharge lamp breakage, will damage operating personnel's health, perhaps when handling discarded discharge lamp, can increase environmental pressure again.
Discharge lamp is the bigger device of structure, thereby the device of relative part, also is compelled to do greatlyyer.
Because discharge lamp institute wavelength of light emitted distribution range is wider, also to launch the light of the wave band that has nothing to do with sensitization, therefore to consume many electric power meaninglessly.
Because in discharge lamp, electric energy nearly all has been transformed into heat energy, therefore to consume many electric power meaninglessly.
Owing to include infrared ray in the light that discharge lamp is launched,, also can produce the influence of heat to it therefore not only to printed circuit board to explosure.
Because the life-span of discharge lamp is shorter, therefore must change continually.
Because discharge lamp wavelength of light emitted distribution range is wider, also shine the light of the wave band that has nothing to do with sensitization, therefore printed circuit board (PCB) has been increased the optics burden, for preventing this phenomenon, wave filter must be set, with the rayed of blocking unwanted wave band on illuminated portion.
Summary of the invention
The present invention puts forward in view of the above problems, its objective is provides a kind of like this external exposure device, promptly this device is when realizing miniaturization, simplification, can reduce the harmful effect that exposure object is produced significantly, and can not consume electric power meaninglessly, can expose to the outer peripheral areas of exposure object.
External exposure device of the present invention, corresponding to the assigned position of exposure object periphery, configuration contains the peripheral exposure light source of the light emitting diode of launching ultraviolet light.
The peripheral exposure light source here can be the light source that comprises a plurality of light emitting diodes of arranging with the state of the relativeness that keeps regulation, also can be the light source that comprises a plurality of light emitting diodes that are rectangular arrangement.In addition, peripheral exposure light source also can be the light source of light direct irradiation on the peripheral assigned position of exposure object that light emitting diode is launched.
In addition, this external exposure device can also comprise down array apparatus: the chilled water generation device is provided for cooling off the chilled water of light emitting diode; Temperature detector detects the temperature of cooling off light emitting diode chilled water afterwards; Water temperature control device, control chilled water generation device remains on set point of temperature so that just cooled off the temperature of the chilled water behind the light emitting diode.
And then, can also comprise such power control apparatus, that is, the response of this device is switched on to light emitting diode to the indication that the assigned position of exposure object periphery exposes; And the indication that response does not expose to the assigned position of exposure object periphery stops and switches on to light emitting diode.
In external exposure device of the present invention, because corresponding to the peripheral assigned position of exposure object, disposed the peripheral exposure light source that contains the light emitting diode of launching ultraviolet light, therefore when can realizing miniaturization and simplification, can also reduce the harmful effect that brings to exposure object significantly, and, can not cause meaningless power consumption thereupon, just can expose to the outer peripheral areas of exposure object.
Contain at peripheral exposure light source under the situation of a plurality of light emitting diodes of arranging with the state of the relative position relation that keeps regulation, needn't use special mechanism, just can realize the homogenising of light intensity.Contain at peripheral exposure light source under the situation of a plurality of light emitting diodes that are rectangular arrangement, prolong the time of rayed on exposure object, can increase the luminous energy that offers exposure object.Under the situation on the peripheral assigned position of exposure object, just can realize miniaturization and simplification at light direct irradiation that peripheral exposure light source is launched light emitting diode.
In addition, have under the situation of following several means, just can make the temperature of light emitting diode roughly keep necessarily making the steady quality of exposure, described device comprises: the chilled water generation device is provided for cooling off the chilled water of light emitting diode; Temperature detector detects the temperature of cooling off light emitting diode chilled water afterwards; Water temperature control device, control chilled water generation device remains on set point of temperature so that just cooled off the temperature of the chilled water behind the light emitting diode.
Also have,, when preventing unnecessary power consumption, can prolong the life-span of light emitting diode having under the situation of power control apparatus.The response of above-mentioned power control apparatus is switched on to light emitting diode to the indication that the assigned position of exposure object periphery exposes; And the indication that response does not expose to the assigned position of exposure object periphery stops and switches on to light emitting diode.
The present invention has following distinctive effect: when realizing miniaturization, simplification, can reduce the harmful effect that brings to exposure object significantly, and, needn't unnecessary consumption electric power, just can expose to the outer peripheral areas of exposure object.
In addition,, therefore prolonged the life-span of light emitting diode, power consumption has been limited in necessary Min., and can also improve the operating performance of changing light emitting diode etc. owing to only when exposure, light a lamp.
Because the thermal value of light emitting diode is less, therefore can use small-sized refrigeratory to cool off.
Because light emitting diode does not use mercury, therefore can not damage operating personnel's health, also can not increase the burden of environment.
Because the light-emitting diodes pipe volume is little, and is in light weight, thus the miniaturization of energy implement device.
Because the wave spread of light emitting diode is narrower, only therefore can shines and the relevant wave band of sensitization (exposure), thereby can prevent meaningless power consumption.
Because therefore the luminescence efficiency height of light emitting diode can suppress to produce heat energy, and then can reduce power consumption.
Because the light of light emitting diode emission does not contain infrared ray, therefore can not give the object to be processed thermal load.
Because the life-span of light emitting diode is long, therefore can prolongs the cycle of changing, and can reduce the number of times of changing operation.
Because light emitting diode wavelength of light emitted distribution range is narrower, and only can shine and the relevant wave band of sensitization (exposure), can eliminate optical stresses object to be processed, and, do not need to block the light filter that does not need wave band, so can make simple in structure.
Description of drawings
Fig. 1 is a stereographic map of schematically representing an embodiment of external exposure device of the present invention;
Fig. 2 is the schematic isometric of the relation of expression light shield and irradiation area;
Fig. 3 is the schematic isometric that is illustrated in the irradiation area under the situation that does not have light shield;
Fig. 4 is a stereographic map of schematically representing other embodiment of external exposure device of the present invention;
Fig. 5 is a stereographic map of schematically representing an example of intermittent exposure;
Fig. 6 is the synoptic diagram that UV-LED is arranged in the peripheral exposure light source of checkerboard of 4 rows, 4 row;
Fig. 7 is the synoptic diagram that UV-LED is arranged in staggered peripheral exposure light source;
Fig. 8 is the synoptic diagram of Illumination Distribution that UV-LED is arranged in the peripheral exposure light source of 3 rows, 2 row checkerboard;
Fig. 9 is the synoptic diagram of expression with the Illumination Distribution of two UV-LED;
Figure 10 is the synoptic diagram that is illustrated in the Illumination Distribution under the state that the outer most edge portion of the range of exposures of two UV-LED is piled up;
Figure 11 is illustrated under the state at the interval of setting two UV-LED, makes the illumination between two UV-LED become the Illumination Distribution synoptic diagram of the illumination that can carry out sensitization.
Embodiment
Below, with reference to accompanying drawing, describe the embodiment of external exposure device of the present invention in detail.
Fig. 1 is a stereographic map of schematically representing an embodiment of external exposure device of the present invention.
This external exposure device is the external exposure device that is applicable to liquid crystal panel.
This external exposure device has following parts: XY supporting station 2, the printed circuit board (PCB) 1 of supporting coating resist; The rotary table 3 of supporting XY supporting station 2; Printed circuit board (PCB) 1 is carried out the peripheral exposure light source 4 of peripheral exposure; The sliding part 5 that keeps peripheral exposure light source 4; Detect the illuminometer 6 of the light intensity of peripheral exposure light source 4 emissions; Exposure light source 4 provides the direct supply 7 of drive current to the periphery; Control the temperature control device 8 of the temperature of peripheral exposure light source 4.
As printed circuit board (PCB) 1, can adopt the glass printing circuit board, with the printed circuit board (PCB) that other material is made, semiconductor wafer, film or the like.In addition, can adopt various difform printed circuit board (PCB)s.
XY supporting station 2 is to make printed circuit board (PCB) 1 carry out the parts that two dimension moves, and rotary table 3 is the parts that make printed circuit board (PCB) 1 rotation with XY supporting station 2.
Peripheral exposure light source 4 is launched ultraviolet light emitting diode (UV-LED) 4a except having as light emitting source, also comprises carriage 4b, light shield 4c or the like (referring to Fig. 2).As shown in Figure 2, light shield 4c for example has the window of rectangle, so that UV-LED 4a is radiated at regional rectangular on the printed circuit board (PCB) 1, can improve the dimensional accuracy of exposure area.Fig. 3 represents, under the situation of not using light shield, and the situation that the exposure area is rounded.Therefore,, just can understand, under the situation of Fig. 2, can improve the dimensional accuracy of exposure area by contrasting with Fig. 3.
Sliding part 5 is for making the reciprocating device of peripheral exposure light source 4, the direction quadrature that direction that described peripheral exposure light source 4 is reciprocating and printed circuit board (PCB) 1 move to prescribed direction by means of XY supporting station 2.
Illuminometer 6 is accepted the light of peripheral exposure light source 4 emissions on the limit positions that peripheral exposure light source 4 moves by sliding part 5, and the intensity detection signal is offered direct supply 7.
Direct supply 7 offers peripheral exposure light source 4 to driving voltage and electric current, to obtain the emitted luminescence intensity of regulation.It is desirable to, only allow UV-LED 4a luminous when exposure, and controlling and driving voltage or electric current are so that change conditions of exposure as required.And, in order to carry out this control, preferably driving voltage or electric current as various types of data, be recorded in advance in this control device (computing machine, programmable logic array) with input function, memory function, comparison calculation function, action command function etc.
In addition, the most handy illuminometer 6 results of regular determination emitted luminescence intensities, and the emitted luminescence intensity measured value offered control device, calculate out the irradiating state of correct UV-LED 4a, even under the situation of deterioration, also can realize stable exposure quality through segment length's period at UV-LED 4a.
In addition, moving into, taking out of of printed circuit board (PCB) 1 can wait by printed circuit board (PCB) mobile robot, shuttle-type carrying mechanism, the roller path of not representing among the figure and carry out, and also can be undertaken by operating personnel's manual operation.
Also have, the L font contraposition guides of not representing among the figure preferably is set, the pin type guides that perhaps has only three some contacts on the L font, like this, under the situation about staggering in the position that is provided to the printed circuit board (PCB) 1 on the XY supporting station 2, just can carry out contraposition this printed circuit board 1 by being pressed on this guides.
The effect of external exposure device with said structure is as follows.
Moving into the printed circuit board (PCB) 1 that has applied resist, drive XY supporting station 2 and rotary table 3, after positioning, position by means of 5 pairs of peripheral exposure light sources 4 of sliding part, so that the peripheral position that its aligning will expose, just finished the preliminary work of peripheral exposure.
Then, utilizing XY supporting station 2 to make printed circuit board (PCB) 1 when a direction moves, driving peripheral exposure light source 4 work, just can the unwanted resist of outer part exposed along a limit of printed circuit board (PCB) 1 by direct supply 7.
Then, when making XY supporting station 2, rotary table 3 work, make sliding part 5 work by son, peripheral exposure light source 4 is positioned, make it face the peripheral position that expose on other limit, along this limit of printed circuit board (PCB) 1, the unwanted resist of outer part is exposed.
In the same way, along all limits of printed circuit board (PCB) 1, can expose to the unwanted resist of outer part.
If carry out above processing, then can all carry out the periphery exposure to the four edges of the printed circuit board (PCB) 1 of rectangle, also can only expose to any limit, in addition, can also except the outer part exposure, expose to the P.e.c. intralamellar part.When also this function combinations of handlebar is on other device, not to any situation of exposing in the limit.
Also can be at the global shape of wanting in advance to expose, perhaps the peripheral exposure light source 4 of the separated configuration in shape of this shape, under the state of locking supporting station, shining the needed time exposes.
In addition, also can XY supporting station 2 and rotary table 3 and sliding part 5 be moved,, be exposed in the periphery according to some the concavo-convex shapes on the exposure end face when not needing resist partly to expose.
Fig. 4 is the schematic isometric of other embodiment of external exposure device of the present invention.
This external exposure device is applicable to the periphery exposure of semiconductor wafer.
External exposure device difference among this external exposure device and Fig. 1 has only this three place: omitted XY supporting station 2; Be provided with end face pick-up unit 9, to replace the contraposition guides of L font, the perhaps pin type guides of three somes contacts on the L font; And the shape set of light shield 4c window become the narrow slit shape, replace the shape of rectangle.
Therefore, in this embodiment, Yi Bian,, just can finish peripheral exposure Yi Bian shine with the light of peripheral exposure light source 4 emissions by means of circular printed circuit board 1 is rotated.
In above-mentioned various embodiment, be to make peripheral exposure light source 4 slack, and printed circuit board (PCB) 1 is moved, finish peripheral exposure with this, but, also can allow printed circuit board (PCB) 1 slack, finish peripheral exposure and move peripheral exposure light source 4.
In addition, also can adopt several peripheral exposure light sources 4.
In above-mentioned each embodiment, be that the surface of supporting printed circuit board (PCB) 1 is set at smooth surface, but, also can adopt outstanding printed circuit board (PCB) 1 is supported in a plurality of supportings with pin the structure that is provided with, in addition, under printed circuit board (PCB) 1 was square situation, a sidepiece that also can clamping printed circuit board 1 can make printed circuit board (PCB) 1 remain under horizontality or the plumbness.
Also have, in the various embodiments described above, the open/close direct supply 7 of UV-LED 4a can be controlled, in this case, as shown in Figure 5,, just can finish intermittent exposure according to the time of time of opening and pass.
In the various embodiments described above, three UV-LED 4a shape that is arranged in a straight line, but, also can line up the UV-LED 4a of varying number.In addition, also can line up several rows, some row (referring to Fig. 6, Fig. 7) to UV-LED 4a.External exposure device 4 shown in Fig. 6 be that UV-LED 4a is arranged in checkerboard, and the external exposure device 4 shown in Fig. 7 then is arranged in staggered shape to UV-LED 4a.
Under above various situations, can be elongated the time of rayed on printed circuit board (PCB) 1, thereby can increase to the luminous energy that printed circuit board (PCB) 1 provides (see also Fig. 8, but, Fig. 8 represents is that UV-LED 4a is arranged in Illumination Distribution under 3 row, 2 rows' the situation of checkerboard).
In addition, by the interval between the adjacent UV-LED 4a of suitable setting, just can enlarge the area that can expose.
About this point, further specify as follows.
Make the complete sensitization of the resist that is coated on the printed circuit board (PCB) 1 and when finishing peripheral exposure, and following four relating to parameters: the light sensitivity (mJ/cm of resist
2); Illumination (the mW/cm of UV-LED
2); The width (mm) of film speed (mm/sec) and irradiation area.
Light sensitivity (the mJ/cm of the resist here
2) what represent is to be coated in the value of the resist sensitization when being applied in how much luminous energy on the printed circuit board (PCB) 1.
Illumination (the mW/cm of UV-LED
2), be that light (light of the wave band of resist sensitization) from UV-LED irradiation is radiated at the luminous energy on the per unit area of printed circuit board surface.
Film speed (mm/sec) is the speed that UV-LED passes through the printed circuit board (PCB) top.
The width of irradiation area (mm) is the peak width (size of direction of passage) on the printed circuit board (PCB) of illuminated irradiates light.
In addition, finish peripheral exposure, need satisfy following condition for the outer part of exposing printed circuit boards 1 correctly.
Irradiation area width (mm)/{ resist light sensitivity (mJ/cm
2Illumination (the mW/cm of)/UV-LED
2) 〉=film speed (mm/sec).
But, all be by the parameter of service condition elder generation decision except that " illumination of UV-LED " usually.Therefore, satisfying under the situation of above-mentioned condition, determining that the illumination of UV-LED is just passable.As shown in Figure 9, the highest regular distribution shape of illumination that is the center from the light of UV-LED emission.In addition, in Fig. 9 and later figure, 1～5 numeral is an expression illumination, and the illuminance setting of the correct sensitization of resist more than 3.
Therefore, as shown in Figure 9, under situation the about irradiation of each UV-LED not being piled up, the distribution of UV-LED illumination does not whichsoever all have to change.
If set the relative position between several UV-LED, so that the part of illumination overlaps each other, the minimal illumination between two UV-LED is exactly 2 (referring to Figure 10) so.But, can not make the correct sensitization of resist with this illumination 2.
If the relative position of each UV-LED is set at, make that illumination is 1 part and illumination is 2 overlap, the minimal illumination between two UV-LED is exactly 3 (referring to Figure 11) so.Therefore, in the four corner between two UV-LED, can both make the correct sensitization of resist.That is, compare, can make illumination reach equalization significantly with Fig. 9.
Claims (6)
1. an external exposure device is characterized in that, corresponding to the peripheral assigned position of exposure object (1), has disposed the peripheral exposure light source (4) that contains the light emitting diode (4a) of launching ultraviolet light.
2. external exposure device as claimed in claim 1 is characterized in that, peripheral exposure light source (4) contains a plurality of light emitting diodes (4a) of arranging with the state of the relativeness that keeps regulation.
3. external exposure device as claimed in claim 1 is characterized in that, peripheral exposure light source (4) comprises a plurality of rectangular light emitting diodes (4a) that are arranged in.
4. as each described external exposure device of claim 1～3, it is characterized in that, also comprise down array apparatus: chilled water generation device (8a) is provided for cooling off the chilled water of light emitting diode (4a); Temperature detector (8f) detects the temperature of cooling off light emitting diode chilled water afterwards; Water temperature control device, control chilled water generation device (8a) remains on set point of temperature so that just cooled off the temperature of the chilled water behind the light emitting diode.
5. as each described external exposure device of claim 1～4, it is characterized in that, peripheral exposure light source (4), the light direct irradiation that light emitting diode (4a) is launched is on the assigned position of exposure object periphery.
6. as each described external exposure device of claim 1～5, it is characterized in that, also has power control apparatus, during indication that the response of this power control apparatus exposes to the peripheral assigned position of exposure object (1), switch on to light emitting diode (4a), when the indication that response does not expose to the peripheral assigned position of exposure object (1), stop and switch on to light emitting diode (4a).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005090736A JP4495019B2 (en) | 2005-03-28 | 2005-03-28 | Peripheral exposure equipment |
| JP2005090736 | 2005-03-28 | ||
| JP2005-090736 | 2005-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1841204A true CN1841204A (en) | 2006-10-04 |
| CN1841204B CN1841204B (en) | 2011-12-28 |
Family
ID=37030280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100660971A Active CN1841204B (en) | 2005-03-28 | 2006-03-28 | External exposure device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4495019B2 (en) |
| KR (1) | KR101217290B1 (en) |
| CN (1) | CN1841204B (en) |
| TW (1) | TWI394014B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4491445B2 (en) * | 2005-11-04 | 2010-06-30 | 株式会社オーク製作所 | Peripheral exposure apparatus and method |
| JP2008129558A (en) * | 2006-11-27 | 2008-06-05 | Keio Gijuku | Curved surface manufacturing method using light source array as exposure light source |
| KR101037466B1 (en) * | 2008-11-21 | 2011-05-26 | 삼성전기주식회사 | Simplified exposure apparatus |
| JP5485570B2 (en) * | 2009-03-23 | 2014-05-07 | リンテック株式会社 | Light irradiation apparatus and light irradiation method |
| JP2013122470A (en) * | 2010-03-31 | 2013-06-20 | Toray Eng Co Ltd | Peripheral exposure device and peripheral exposure method |
| JP5470236B2 (en) * | 2010-12-22 | 2014-04-16 | 東京エレクトロン株式会社 | Local exposure method and local exposure apparatus |
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| JP2004274011A (en) * | 2003-01-16 | 2004-09-30 | Nikon Corp | Illumination light source device, illuminating device, exposure device and exposure method |
| JP2004342633A (en) * | 2003-05-13 | 2004-12-02 | Nikon Corp | Aligner, lighting device, and aligning method |
| JP2005303033A (en) * | 2004-04-13 | 2005-10-27 | Y E Data Inc | Light source of exposure device |
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2005
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- 2006-03-10 TW TW095108061A patent/TWI394014B/en active
- 2006-03-28 KR KR1020060027863A patent/KR101217290B1/en active IP Right Grant
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| CN102681356A (en) * | 2011-03-15 | 2012-09-19 | 东京毅力科创株式会社 | Local exposure method and local exposure device |
| CN103615704A (en) * | 2013-12-17 | 2014-03-05 | 四川聚能核技术工程有限公司 | Matrix type LED light source of exposure machine |
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| CN107544165A (en) * | 2017-09-25 | 2018-01-05 | 京东方科技集团股份有限公司 | A kind of vacuum aligns abutted equipment and its to cassette method |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101217290B1 (en) | 2012-12-31 |
| JP4495019B2 (en) | 2010-06-30 |
| KR20060104925A (en) | 2006-10-09 |
| CN1841204B (en) | 2011-12-28 |
| TWI394014B (en) | 2013-04-21 |
| TW200643652A (en) | 2006-12-16 |
| JP2006278389A (en) | 2006-10-12 |
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