TWI394014B - Peripheral exposure device - Google Patents

Description

Peripheral exposure device

The present invention relates to a peripheral exposure apparatus for exposing a specific position around an exposure target such as a glass substrate for a liquid crystal, a semiconductor wafer, or a photosensitive film.

Conventionally, a peripheral exposure device for exposing a specific position around an exposure target such as a glass substrate for a liquid crystal, a semiconductor wafer, or a photosensitive film has been provided.

When forming a wiring pattern on a substrate such as a liquid crystal display panel or a semiconductor wafer, first, a resist is entirely applied to the substrate, and a wiring pattern is formed by patterning into a desired shape by photolithography; usually, it is formed on the peripheral portion of the substrate. The manner in which the width of the strip is a few mm in width determines the exposure position of the mask pattern.

Therefore, if a positive resist is used in the photolithography step, the unexposed resist remains in a strip shape at the peripheral portion of the substrate after the development treatment. This residual resist is not only unnecessary, but also becomes fine dust in the subsequent manufacturing steps, and thus becomes a major problem as the production amount is lowered. Therefore, it is necessary to expose and develop the resist region which is not required in the peripheral portion of the substrate.

In view of the above, an apparatus disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei.

In the device described in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The mirror, the lens group, and the wavelength shielding filter expose the peripheral portion of the substrate by irradiating the light emitted from the portion to the peripheral portion of the substrate while moving the substrate or the light source. In addition, the cooling of the light source is achieved by air cooling, and the heating generated therefrom is exhausted by the blower.

In the device described in Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei.

Due to the long standby time and warm-up time of the discharge lamp, the discharge lamp must always be lit when the peripheral exposure is not performed, and the service life of the discharge lamp is shortened, and the power consumption will be increased more and more, accompanied by the exchange of the discharge lamp. It becomes frequent and the workability deteriorates.

Since the discharge lamp generates a large amount of heat, a large blower is required for cooling.

Since the inside of the discharge lamp uses mercury, the damage of the discharge lamp is very harmful to the health of the worker, or the environmental burden is very large when the discharge lamp is disposed of.

Since the discharge lamp has a large structure, the device associated with it has to be made large.

The output light of the discharge lamp has a wide wavelength distribution, and the wavelength band of the photosensitive light is also illuminated, so that the waste of power consumption is increased.

Since most of the electric energy is converted into thermal energy in the discharge lamp, the wasted power consumption is increased.

Since the output light of the discharge lamp contains infrared rays, the substrate is not only exposed but also thermally affected.

Since the life of the discharge lamp is short, it is necessary to exchange frequently.

Since the wavelength distribution of the output light of the discharge lamp is wide, the light of the wavelength band of the photosensitive light is irradiated, so that the optical load is applied to the substrate, and in order to prevent it, a filter must be provided so that the light of the unnecessary wavelength band is not Irradiation to the illuminated portion.

The present invention has been made in view of the above problems, and an object thereof is to provide a peripheral exposure apparatus which can be reduced in size and simplification, and can greatly reduce adverse effects on an object to be exposed without causing waste. The peripheral region of the object to be exposed can be exposed to electricity.

In the peripheral exposure apparatus of the present invention, a peripheral exposure light source including a light-emitting diode that emits ultraviolet rays is disposed in accordance with a specific position around the exposure target.

Herein, the peripheral exposure light source may include a plurality of light emitting diodes arranged in a state of maintaining a specific relative relationship, or a plurality of light emitting diodes arranged in a matrix. Further, the peripheral exposure light source may directly illuminate the light emitted from the light-emitting diode to a specific position around the exposure target.

Furthermore, the method further includes: a cooling water generating device that supplies cooling water for cooling the light emitting diode; a water temperature detecting device that detects a temperature of the cooling water immediately after cooling of the light emitting diode; and a water temperature control device The cooling water generating device is controlled such that the temperature of the cooling water immediately after cooling of the light-emitting diode is maintained at a specific temperature.

Furthermore, the present invention further includes an energization control device that is configured to expose a specific position around the exposure target, and to energize the light-emitting diode, and to prevent exposure of a specific position around the exposure target in response to being instructed to be exposed. The light-emitting diode is energized.

According to the peripheral exposure apparatus of the present invention, since the peripheral exposure light source including the light-emitting diode that emits ultraviolet rays is disposed corresponding to a specific position around the exposure target object, it is possible to achieve downsizing and simplification, and to greatly reduce the The peripheral object of the object to be exposed can be exposed without being adversely affected by the exposure of the object.

In the case where the peripheral light source includes a plurality of light-emitting diodes arranged in a state in which a specific relative relationship is maintained, the leveling of the light intensity can be achieved without using a special mechanism. In the case where the peripheral light source includes a plurality of light-emitting diodes arranged in a matrix, the light energy applied to the object to be exposed can be increased while the exposure target is irradiated with light. In the peripheral exposure light source, the light emitted from the light-emitting diode is directly irradiated to a specific position around the exposure target, thereby achieving downsizing and simplification.

Further, in the case where the cooling water generating device, the water temperature detecting device, and the water temperature control device are further included, the temperature of the light emitting diode can be kept substantially constant, and the exposure quality can be stabilized; wherein the cooling water generating device is supplied a cooling water cooled by the light-emitting diode, wherein the water temperature detecting device detects the temperature of the cooling water immediately after cooling of the light-emitting diode, and the water temperature control device maintains the temperature of the cooling water immediately after cooling the light-emitting diode The cooling water generating device is controlled in a manner of a specific temperature.

Moreover, in the case of further including the power-on control device, unnecessary power consumption can be prevented, and the life of the light-emitting diode can be prolonged; wherein the power-on control device is in response to being instructed to expose a specific position around the exposure object, and The light-emitting diode is energized, and the light-emitting diode is prevented from being energized in response to being instructed not to expose a specific position around the exposure object.

The present invention can achieve a special effect of miniaturization and simplification, and greatly reducing the adverse effects on the object to be exposed, and exposing the peripheral region of the object to be exposed without wasted power consumption.

In addition, by lighting only during exposure, the service life of the light-emitting diode can be extended, power consumption can be maintained to a minimum necessary, and workability such as light-emitting diode exchange can be improved.

Since the amount of heat generated by the light-emitting diode can be reduced, it can be cooled by a small cooler.

Since the light-emitting diode does not use mercury, it can eliminate the health hazard and environmental burden of the workers.

Since the light-emitting diode is small and lightweight, the device can be miniaturized.

Since the wavelength distribution band of the light-emitting diode is narrow, it is possible to irradiate only with a wavelength band relating to light exposure (exposure), thereby preventing wasted power consumption.

Since the light-emitting diode has high luminous efficiency, it is possible to suppress generation of thermal energy and further suppress power consumption.

Since the output light of the light-emitting diode does not contain infrared rays, no heat load is applied to the object to be processed.

Due to the long service life of the LED, the exchange period can be extended and the number of exchange operations can be reduced.

Since the wavelength distribution of the output light of the light-emitting diode is narrow, only the wavelength band for the photosensitive (exposure) can be irradiated, the optical stress on the object to be processed can be eliminated, and the filter of unnecessary wavelength band is not required to be shielded. The composition can be simplified.

Hereinafter, an embodiment of the peripheral exposure apparatus of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a perspective view schematically showing an embodiment of a peripheral exposure apparatus of the present invention.

This peripheral exposure device is suitable for peripheral exposure of a liquid crystal panel.

The peripheral exposure device has an XY stage 2 supporting a substrate 1 coated with a resist, a rotating table 3 supporting the XY stage 2, and a peripheral exposure light source 4 for performing exposure to the periphery of the substrate 1; a slider 5 for holding a peripheral light source 4; an illuminometer 6 for detecting an output light intensity of the peripheral exposure light source 4; a DC power source 7 for supplying a driving current to the peripheral exposure light source 4; and a temperature control mechanism 8. It controls the temperature of the peripheral exposure light source 4.

As the substrate 1 , a glass substrate, a substrate made of another material, a semiconductor wafer, a film, or the like can be exemplified. In addition, various shapes can be employed.

The XY stage 2 moves the substrate 1 twice. The turntable 3 rotates the substrate 1 together with the XY stage 2.

The peripheral exposure light source 4 includes a light-emitting diode (UV-LED) 4a that emits ultraviolet rays as a light-emitting source, and includes a bracket 4b, a light shield 4c (refer to FIG. 2), and the like. The hood 4c has a rectangular window opening as shown in FIG. 2, and the irradiation area of the substrate 1 of the UV-LED 4a is rectangular, and the dimensional accuracy of the exposure area can be improved. Fig. 3 shows the case where the exposure area is circular when the hood is not used. Therefore, by comparing with FIG. 3, it can be seen that the dimensional accuracy of the exposure region can be improved in the case of FIG.

The slider 5 moves the peripheral exposure light source 4 back and forth in a direction orthogonal to the moving direction of the substrate 1 caused by the XY stage 2 in a specific direction.

The illuminance meter 6 receives the output light of the peripheral exposure light source 4 at the position of the movement limit of the peripheral exposure light source 4 caused by the slider 5, and supplies the intensity detection signal to the DC power supply 7.

The DC power source 7 supplies a driving voltage or current to the peripheral exposure light source 4 in such a manner as to obtain a specific output light intensity. It is preferable to control the driving voltage or current so that the UV-LED 4a emits light only upon exposure, or changes in exposure conditions as needed. Further, in order to perform such control, it is preferable to have a control device (a computer, a programmable logic array, or the like) having an input function, a memory function, a comparison operation function, an operation command function, and the like, and register a drive voltage or a current as a type of data in advance.

Further, it is preferable that the output light intensity is periodically measured by the illuminometer 6, and the output light intensity measurement value is supplied to the control device to calculate the irradiation state of the appropriate UV-LED 4a, and the UV-LED 4a is deteriorated over time. Achieve stable exposure quality.

The temperature control mechanism 8 has a cooler 8a for generating cooling water, and a cooling water flow path 8b for supplying cooling water to the bracket 4b to cool the UV-LED 4a and return it to the cooler 8a again. The valve 8c, the flow meter 8d, the water pressure gauge 8e, and the like are disposed at a specific position of the cooling water flow path 8b; and the water temperature sensor 8f. Further, the water temperature sensor 8f is disposed on the downstream side of the bracket 4b, and supplies a temperature detection signal to the cooler 8a to control the operation of the cooler 8a.

In addition, the loading and unloading of the substrate 1 is performed by a substrate transfer loading robot (not shown), a shuttle transfer mechanism, a roller conveyor, or the like, or by manual operation by an operator.

Further, it is preferable to provide an L-shaped positioning guide rail (not shown) or a pin-shaped guide rail that contacts only three points on the L-shape, and the substrate 1 can be pressed against the position of the substrate 1 supplied to the XY stage 2. Positioned by the rails.

The peripheral exposure device of the above configuration functions as follows.

When the substrate 1 coated with the resist is carried, the XY stage 2 and the rotating table 3 are driven to be positioned, and the slider 5 is positioned to correspond to the peripheral position of the exposure, and the peripheral exposure device 4 is positioned to end the peripheral exposure. Preparation.

Thereafter, the substrate 1 is moved in one direction by the XY stage 2, and the peripheral exposure light source 4 is operated by the DC power source 7, whereby the resist which is unnecessary in the peripheral portion can be exposed along one side of the substrate 1.

Next, by operating the XY stage 2 and the rotating table 3 and operating the slider 5, the peripheral exposure light source 4 can be positioned adjacent to the peripheral position where the other side should be exposed, and along the side of the substrate 1. The exposed resist is exposed at the periphery.

Similarly, the unnecessary resist of the peripheral portion can be exposed along all sides of the substrate 1.

By performing the above processing, all of the four sides of the rectangular substrate 1 can be exposed, and only one side can be exposed; in addition to the exposure of the peripheral portion, the inside of the substrate can be exposed. In the case where other devices are incorporated into this function, there are cases where all sides are not exposed.

It is also possible to arrange the peripheral exposure light source 4 in a shape that is intended to be exposed in advance or to divide the shape, and to irradiate and expose the necessary time in a state where the stage is stationary.

Further, in the exposure of the unnecessary resist portion, the XY stage 2, the rotary table 3, and the slider 5 may be operated, and the exposure end surface may be formed in a shape having irregularities to perform peripheral exposure.

Fig. 4 is a perspective view schematically showing another embodiment of the peripheral exposure apparatus of the present invention.

This peripheral exposure device is suitable for peripheral exposure of semiconductor wafers.

The peripheral exposure device differs from the peripheral exposure device of FIG. 1 only in that: the point of the XY stage 2 is omitted; instead of the L-shaped positioning guide or the pin-shaped guide rail with only 3 points of contact on the L-shape, the end surface detecting device 9 is provided. Point; and the shape of the window of the hood 4c is set to a slit shape instead of the rectangle.

Therefore, in this embodiment, by irradiating the circular substrate 1 while rotating the light from the peripheral exposure light source 4, peripheral exposure can be achieved.

In the above embodiments, the peripheral exposure is achieved by causing the peripheral exposure light source 4 to be stationary and moving the substrate 1. However, by moving the peripheral exposure light source 4 while the substrate 1 is stationary, peripheral exposure can be achieved.

Further, a plurality of peripheral light sources 4 may be employed.

In each of the above embodiments, the surface of the support substrate 1 is a flat surface. However, the substrate 1 may be supported by protruding a plurality of support pins. Further, when the substrate 1 is square, the substrate 1 may be held. One of the sides holds the substrate 1 in a horizontal state or a vertical state.

Further, in each of the above embodiments, the DC power source 7 can be controlled to turn the UV-LED 4a ON/OFF. In this case, the ON time and the OFF time can be intermittently shown in FIG. Achieve exposure.

In each of the above embodiments, the three UV-LEDs 4a are arranged in a straight line, but a different number of UV-LEDs 4a may be arranged. Further, the UV-LEDs 4a may be arranged in a plurality of columns and a plurality of rows (refer to FIGS. 6 and 7). The peripheral exposure light source 4 shown in Fig. 6 arranges the UV-LEDs 4a in a checkerboard pattern, and the peripheral exposure light source 4 shown in Fig. 7 arranges the UV-LEDs 4a in a crossed lattice shape.

In such a case, the time at which the light is irradiated onto the substrate 1 can be increased, and the light energy imparted to the substrate 1 is increased (refer to FIG. 8, wherein FIG. 8 shows the illuminance in the case where the UV-LEDs 4a are arranged in a checkerboard pattern of three columns and two rows. distributed).

Further, the exposure area can be enlarged by appropriately setting the interval between adjacent UV-LEDs 4a.

Further explain this point.

The resist applied on the substrate 1 is completely sensitized to achieve resist sensitivity (mJ/cm ² ), UV-LED illuminance (mW/cm ² ), and exposure speed (mm/sec) when peripheral exposure is achieved. The four parameters of the width of the irradiation zone (mm) are related.

Here, the resist sensitivity (mJ/cm ² ) is a value indicating how much light energy is applied to the resist applied to the substrate 1 .

The illuminance of the UV-LED (mW/cm ² ) is the amount of light energy per unit area on the surface of the substrate from the light irradiated by the UV-LED (the light of the wavelength band in which the resist is photosensitive).

The exposure speed (mm/sec) is the speed at which the UV-LED passes through the substrate.

The width (mm) of the irradiation zone is the width (the size of the passing direction) of the region on the substrate irradiated by the irradiation light.

Further, in order to accurately expose the peripheral portion of the substrate 1 to achieve peripheral exposure, the following conditions must be met.

Irradiation zone width (mm) / {resist sensitivity (mJ / cm ² ) / UV-LED illuminance (mW / cm ² )} ≧ exposure speed (mm / sec).

However, it is usually determined from the conditions of use that the parameters other than the "illuminance of the UV-LED" are determined first. Therefore, the illuminance of the UV-LED can be determined in a manner consistent with the above conditional expression. As shown in Fig. 9, the light system radiated from the UV-LED has a normal distribution with the highest central illumination. Further, in Fig. 9 and the following figures, numerals 1 to 5 indicate illuminance, and the illuminance of the resist which is correctly photosensitive is set to 3 or more.

Therefore, in the case where the irradiation of the respective UV-LEDs does not overlap, as shown in FIG. 9, the illuminance distribution of all the UV-LEDs is completely unchanged.

If the relative positions of the UV-LEDs are set in such a manner that the illuminances 1 overlap, the minimum illuminance between the two UV-LEDs becomes 2 (refer to FIG. 10). However, with this illuminance 2, the resist cannot be properly sensitized.

If the relative positions of the UV-LEDs are set such that the illuminance 1 and the illuminance 2 overlap, the minimum illuminance between the two UV-LEDs is 3 (refer to FIG. 11). Therefore, the resist is correctly sensitized over the entire range between the two UV-LEDs. That is, a large level of illuminance can be achieved as compared with FIG.

1. . . Substrate

2. . . XY platform

3. . . Rotary table

4. . . Peripheral exposure light source

4a. . . Light-emitting diode (UV-LED)

4b. . . bracket

4c. . . Hood

5. . . Slider

6. . . Illuminometer

7. . . DC power supply

8. . . Temperature control mechanism

8a. . . Cooler

8b. . . Cooling water flow path

8c. . . valve

8d. . . Flow meter

8e. . . Water pressure gauge

8f. . . Water temperature sensor

Fig. 1 is a perspective view schematically showing an embodiment of a peripheral exposure apparatus of the present invention.

Fig. 2 is a schematic perspective view showing the relationship between the hood and the irradiation zone.

Fig. 3 is a schematic perspective view showing an irradiation area in a case where the hood is not present.

Fig. 4 is a perspective view schematically showing another embodiment of the peripheral exposure apparatus of the present invention.

Fig. 5 is a perspective view schematically showing an example of intermittent exposure.

Fig. 6 is a schematic view showing a light source for peripheral exposure in which a UV-LED is arranged in a checkerboard pattern of four columns and four rows.

Fig. 7 is a schematic view showing a light source for peripheral exposure in which UV-LEDs are arranged in a crossed lattice shape.

Fig. 8 is a schematic view showing an illuminance distribution of a peripheral exposure light source in which a UV-LED is arranged in a checkerboard pattern of three columns and two rows.

Fig. 9 is a schematic view showing an illuminance distribution formed by two UV-LEDs.

Fig. 10 is a schematic view showing an illuminance distribution in a state in which the outermost edge portion of the irradiation range of two UV-LEDs is superimposed.

Fig. 11 is a schematic view showing an illuminance index in a state in which the interval between the two UV-LEDs is set such that the illuminance between the two UV-LEDs becomes sensible.

1. . . Substrate

2. . . XY platform

3. . . Rotary table

4. . . Peripheral exposure light source

4a. . . Light-emitting diode (UV-LED)

4b. . . bracket

5. . . Slider

6. . . Illuminometer

7. . . DC power supply

8. . . Temperature control mechanism

8a. . . Cooler

8b. . . Cooling water flow path

8c. . . valve

8d. . . Flow meter

8e. . . Water pressure gauge

8f. . . Water temperature sensor

Claims (5)

A peripheral exposure apparatus characterized in that a peripheral exposure light source (4) is correspondingly disposed via a hood (4c) of a predetermined irradiation area at a specific position around the exposure target (1); wherein the peripheral exposure light source ( 4) comprising a plurality of light-emitting diodes (4a) which overlap with each other in a low-illuminance portion in an irradiation region toward the surface of the object to be exposed to maintain an illuminance which satisfies the correct sensitivity of the resist In a state of a specific relative relationship, it is arranged on one side of the bracket (4b). The peripheral exposure device of claim 1, wherein the peripheral exposure light source (4) comprises: a plurality of light-emitting diodes (4a) arranged in a matrix. The peripheral exposure apparatus of claim 1 or 2, further comprising: a cooling water generating device (8a) for supplying cooling water for cooling the light emitting diode (4a); and a water temperature detecting device (8f) for detecting The temperature of the cooling water immediately after cooling of the light-emitting diode; and the water temperature control device control the cooling water generating device (8a) such that the temperature of the cooling water immediately after cooling of the light-emitting diode is maintained at a specific temperature. The peripheral exposure device according to claim 1 or 2, wherein the peripheral exposure light source (4) directly illuminates the light emitted from the light-emitting diode (4a) through the rectangular aperture of the hood (4c) to the exposure object Specific location around. A peripheral exposure apparatus according to claim 1 or 2, further comprising: an energization control means responsive to being instructed to expose a specific position around the exposure target (1), and energizing the light-emitting diode (4a) to respond It is instructed not to expose a specific position around the exposure target (1), and to prevent energization of the light-emitting diode (4a).