KR20140128718A - Cure unit and apparatus for manufacturing printend electronics adopting the same - Google Patents

Abstract

The present invention relates to a curing unit and an apparatus for manufacturing an electronic circuit pattern adopting the same. The curing unit comprises: a supporting frame on which an object to be printed having an electronic circuit pattern printed thereon is placed; a light emitting module which performs a photo-hardening process by emitting light toward the object to be printed on the supporting frame; and a case which includes an intake hole into which inert gas is introduced and a discharging hole discharging harmful gas generated in the photo-hardening process to the outside so that the object to be printed is not oxidized.

Description

Technical Field [0001] The present invention relates to a curing unit and an electronic circuit pattern manufacturing apparatus using the same,

The present invention relates to a curing unit and an apparatus for manufacturing an electronic circuit pattern using the same. More particularly, the present invention relates to a curing unit for curing an electronic circuit pattern using an LED lamp, And it is an object of the present invention to provide a curing unit and an electronic circuit pattern manufacturing apparatus using the curing unit, which are capable of easily removing harmful gas generated during electronic circuit pattern curing and securing the safety of an operator.

Generally, printing electronic technology is a general term for a technique of printing various electronic circuit patterns using graphic art printing of functional ink materials capable of solution processing.

Such ink electronic technology can be roughly divided into ink as a material, a printing technique for printing ink, and a curing method for curing a printed ink.

Here, the ink may be in the form of an oxidation polymerization type ink, an evaporation drying type ink, a penetration type ink, a precipitation type ink, an ultraviolet curing type ink, an infrared ray type ink, an infrared ray type ink, Drying ink, and thermosetting ink. Depending on the type of printing, it is possible to use various types of printing ink such as a flat ink, a transparent ink, a gravure ink, a screen ink, a special ink, And the like.

The printing technique refers to a type of a practical printing job, which can be subdivided into an offset printing method, a gravure printing method, a gravure offset printing method, a flexo printing method, a screen printing method, an inkjet printing method, and the like.

Finally, the curing method can be subdivided into ultraviolet drying, infrared drying, thermal drying, electron beam drying, laser drying and the like.

Of these printing electronic techniques, in particular, the curing method is a step of curing the ink printed on various electronic circuit patterns (hereinafter referred to as a substrate), and it is common that the curing is carried out successively after the printing step.

Conventional curing units use a method of curing an electronic circuit pattern using a xenon lamp or a halogen lamp.

However, in a method of applying a pulse voltage to a xenon lamp or a halogen lamp, the amplitude of the applied pulse is not uniform, so that the print quality is deteriorated and the power consumption is severe.

Further, there is a problem that the function of the electronic circuit pattern may be deteriorated by being exposed to oxygen in the air and oxidized.

In addition, there is a problem that it is not possible to block the harmful gas generated when the electronic circuit pattern is cured, and thus the worker can not be protected from harmful gas.

Korean Patent No. 10-1083320 (November 14, 2011)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a curing unit capable of improving the print quality of an electronic circuit pattern and preventing waste of power consumption, and an electronic circuit pattern manufacturing apparatus using the same.

Another object of the present invention is to provide a curing unit capable of preventing an electronic circuit pattern from being oxidized by contact with oxygen in the air and an apparatus for manufacturing an electronic circuit pattern using the same.

Another object of the present invention is to provide a curing unit capable of protecting a worker from noxious gas by blocking noxious gas generated during curing of an electronic circuit pattern and an apparatus for manufacturing an electronic circuit pattern using the same.

According to an aspect of the present invention, there is provided a light emitting module including a support frame on which a printed substrate on which an electronic circuit pattern is printed is placed, a light emitting module that irradiates light toward the substrate placed on the support frame, And a case having an inlet hole into which an inert gas flows and a discharge hole through which the noxious gas generated during the photo-curing process is discharged to the outside so that the substrate is not oxidized.

 The light emitting module includes a light emitting portion including an LED lamp and a light emitting substrate coupled to the LED lamp to supply power, a heat dissipating portion closely adhering to the light emitting portion to dissipate heat generated from the light emitting portion to the outside, And a diffusion unit for diffusing light of the LED lamp.

At this time, the LED lamp may include at least one of a UV LED, an RGB LED, and a white LED.

In addition, a fixing pin for fixing the print body may be provided on the upper portion of the support frame.

According to another aspect of the present invention, there is provided a printing apparatus including a printing unit for printing an electronic circuit pattern on a substrate, a photocuring process for curing the electronic circuit pattern printed on the substrate by irradiating light toward the substrate And a transfer unit for transferring the print medium from the printing unit to the curing unit. The present invention also provides an electronic circuit pattern manufacturing apparatus comprising: a curing unit for performing a curing process;

The image forming apparatus may further include a housing that intercepts the inner space in which the photo-curing process is performed from the outside, and the printing unit and the curing unit are installed in the inner space.

At this time, the housing may have an inlet hole through which an inert gas flows to prevent the electronic circuit pattern from being oxidized, and a discharge hole through which harmful gas generated in the photo-curing process is discharged.

In addition,

A support frame provided at a lower portion of the print body; a supply roller provided at one side of the support frame and wound around the print body; and a plurality of rollers provided on the other side of the support frame, And a recovery roller for moving the printing unit and the curing unit to wind the printed body subjected to the photo-curing process, wherein the printing unit and the curing unit are installed on the support frame.

In addition,

A support frame provided at a lower portion of the substrate, a supply roller provided at one side of the support frame and wound with the substrate,

And a conveying unit that is provided at one side of the support frame and at a lower portion of the feed roller and moves the print body wound around the feed roller by rotation so as to pass through the print unit and the curing unit, And an intermediate roller which is provided on the other side of the support frame and rotates as the substrate is moved by the collection roller, wherein the printing unit includes a plurality of intermediate rollers, And the curing unit is installed in the lower portion of the body to be printed which moves from the intermediate roller to the collection roller.

The support frame may include an upper frame on which the supplying roller is installed, a lower frame located below the upper frame and on which the collection roller is installed, and a lower frame disposed between the upper frame and the lower frame, And the direction in which the supply roller and the collection roller are installed and the direction in which the intermediate roller is installed are opposite to each other.

Effects of the curing unit and the electronic circuit pattern manufacturing apparatus using the curing unit according to the present invention are as follows.

First, there is an advantage that not only the print quality of the electronic circuit pattern can be improved but also waste of power consumption can be prevented.

Second, there is an advantage that the oxidation of the electronic circuit pattern can be prevented by using an inert gas.

Third, there is an advantage that the operator can be protected from noxious gas by cutting off noxious gas generated during hardening of the electronic circuit pattern.

1 is an exploded perspective view of a curing unit according to a first embodiment of the present invention.
2 is a perspective view of an electronic circuit pattern manufacturing apparatus according to a second embodiment of the present invention;
3 is a cross-sectional view of an electronic circuit pattern manufacturing apparatus according to a second embodiment of the present invention.
4 is a perspective view of an electronic circuit pattern manufacturing apparatus according to a third embodiment of the present invention;
5 is a cross-sectional view of an electronic circuit pattern manufacturing apparatus according to a third embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, embodiments of a curing unit and an electronic circuit pattern manufacturing apparatus using the same according to the present invention will be described with reference to the accompanying drawings.

Referring to Fig. 1, a curing unit 200 according to a first embodiment of the present invention will be described. The curing unit 200 according to the present embodiment includes a light emitting module 210, a case 220, and a support frame 226.

The light emitting module 210 is for generating light for curing the electronic circuit pattern 20 printed on the substrate 10 and includes a heat dissipation unit 212, a light emitting unit 214, and a diffusion unit 216 .

The heat dissipation unit 212 is closely attached to the light emitting unit 214 to discharge the heat generated from the light emitting unit 214 to the outside. Here, the heat dissipation unit 212 may include a heat dissipation fin 213 to increase the heat dissipation area to improve the heat dissipation performance.

The light emitting unit 214 includes an LED lamp 215 and a light emitting substrate 217 for supplying power to the LED lamp 215.

The LED lamp 215 irradiates and hardens the electronic circuit pattern 20 and includes at least one of an ultraviolet (UV) LED lamp, an RGB LED lamp, and an infrared (IR) LED lamp.

The light emitting unit 214 may further include a control unit (not shown) for controlling the ultraviolet (UV) LED lamp, the RGB LED lamp, and the infrared LED lamp to selectively emit light.

Specifically, infrared printing type ink, ultraviolet drying type ink, visible light drying type ink, or the like is used to print the electronic circuit pattern 20 on the substrate 10. Depending on the type of the ink, an infrared LED lamp, By selectively emitting ultraviolet LED lamps or RGB LED lamps, the photocuring process can be performed more efficiently, and power consumption can be reduced.

The diffusion part 216 diffuses the light emitted from the light emitting part 214 so that light can be uniformly irradiated onto the electronic circuit pattern 20 and the light emitting part 214 is formed by impurities such as dust Avoid contamination. At this time, it is preferable that the diffuser 216 is made of a transmissive material.

The case 220 has a polyhedral structure in which a lower portion is opened and an opening 222 is formed in an upper portion. The light emitting module 210 is coupled to the opening 222.

An inlet hole 244 through which an inert gas can flow is formed on one side of the case 220 and a process in which the electronic circuit pattern 20 is cured by light on the other side (Hereinafter referred to as " discharge hole 245 "). Here, an inlet pipe 246 may be connected to the inlet hole 244 so that an inert gas may be introduced from the outside, and a discharge pipe 247 may be connected to the outlet hole 245 to discharge the noxious gas. .

Specifically, the case 220 includes a case body 221 and side walls 224 and 225.

The case body 221 has a "C" shape with both sides open, and an opening 222 is formed at the center of the case body 221 to be coupled to the light emitting module 210. At this time, the side walls 224 and 225 are coupled to both sides.

An inlet hole 244 through which an inert gas can flow is formed in the side wall 224 and a discharge hole 245 through which the harmful gas generated in the photocuring process is formed is formed in the side wall 225 do. Here, an inlet pipe 246 may be connected to the inlet hole 244 so that an inert gas may be introduced from the outside, and a discharge pipe 247 may be connected to the outlet hole 245 to discharge the noxious gas. .

He gas, Ne gas, Ar gas, or the like is used as the inert gas because it has high stability and does not bond to other elements. More preferably, nitrogen gas (N 2) can be used.

As a result, as the inert gas is introduced into the inflow hole 244, the pressure inside the case 220 increases and the noxious gas generated in the photo-curing process due to the increased pressure is introduced into the discharge hole 245, .

Although the case 220 has been described as having a structure in which the case body 221 and the side walls 224 and 225 are coupled to each other, the case body 221 and the side wall 224 may be integrally formed It will be possible.

The supporting frame 226 is placed on the lower portion of the case 220 to form a closed structure. The printed circuit board 10 is printed with the electronic circuit pattern 20 thereon.

The printed circuit board 10 on which the electronic circuit pattern 20 is printed is placed on the support frame 226 and the electronic circuit pattern 20 is cured by light emitted from the light emitting module 210 . At this time, a fixing pin 230 for fixing the electronic circuit pattern 20 may be installed to prevent the electronic circuit pattern 20 from moving.

As a result, the case body 221 is coupled with the light emitting module 210 and the support frame 226 to have a closed structure in which a space is formed. Thus, the light emitted from the light emitting part 214 is prevented from being emitted to the outside, thereby preventing the light amount of the light irradiated on the electronic circuit pattern 20 from decreasing.

The function and effect of the curing unit 200 will be described below.

First, the light emitting module 210 starts to irradiate light toward the printed body 10 on which the electronic circuit pattern 20 placed on the support frame 226 is printed.

Next, the electronic circuit pattern 20 is cured by reacting with the light, and noxious gas is generated.

At the same time, an inert gas is introduced into the inlet hole 244 of the case 220, and the pressure inside the case 200 increases.

Next, as the inner pressure of the case 220 is increased, the air inside the case 220 is discharged, so that the noxious gas contained in the case 220 is also discharged through the discharge hole 245.

As a result, by using an LED lamp 215 including an infrared LED lamp, an ultraviolet LED lamp, or an RGB LED lamp as a light source of the light emitting module 210, light of a wavelength For example, infrared rays, ultraviolet rays, visible rays, etc.) to improve the print quality and reduce power consumption.

In addition, by introducing the inert gas into the case 220, it is possible to prevent the electronic circuit pattern 20 from being oxidized by contact with oxygen, and also to prevent the harmful gas generated during the curing of the electronic circuit pattern 20 So that the operator can be protected from harmful gases.

An electronic circuit pattern manufacturing apparatus according to a second embodiment of the present invention will be described with reference to Figs. 2 and 3. Fig. The electronic circuit pattern production apparatus according to the present embodiment includes a printing unit 100, a hardening unit 200, and a transfer unit 300.

The printing unit 100 prints the electronic circuit pattern 20 on the substrate 10.

The configuration and operation of the curing unit 200 are the same as those of the curing unit 200 according to the first embodiment of the present invention described above, and therefore, the same reference numerals are assigned to those in FIG.

The transfer unit 300 moves the substrate 10 from the printing unit 100 to the curing unit 200 and includes a supply roller 310, a collection roller 320, and a support frame 330 do.

The feed roller 310 is installed on one side of the support frame 330 and the print body 10 is wound.

The recovery roller 320 is installed on the other side of the support frame 330 and the print body 10 wound around the supply roller 310 by the rotation of the collection roller 320 is rotated by the printing unit 100 ) And the curing unit (200), and winds the substrate to which the photocuring process has been performed. At this time, a driving device (not shown) for applying a rotational force to the collection roller 320 may be connected to the collection roller 320.

The printing unit 100 and the curing unit 200 are connected to the feeding roller 310 and the collecting roller 320 so that they can be cured after the electronic circuit pattern 20 is printed on the substrate 10, The support frame 330 may be disposed on the upper side of the support frame 330 in order.

As a result, the substrate 10 is moved from the feeding roller 310 to the collecting roller 310 as the collecting roller 320 rotates. During the movement of the collecting roller 310, The electronic circuit pattern 20 is printed by the printing unit 100 provided on the support frame 330 between the paper feed roller 310 and the collection roller 310 and the printed body 10 on which the electronic circuit pattern 20 is printed And is cured by the curing unit (200).

The electronic circuit pattern manufacturing apparatus according to the second embodiment may further include a housing 400 in which a space for receiving the printing unit 100 and the curing unit 200 is formed.

The housing 400 is provided with an inlet hole 410 through which an inert gas flows and an outlet hole 420 through which the noxious gas inside the housing 400 is discharged during the process of curing the electronic circuit pattern 20 May be formed. An inlet pipe 415 through which the inert gas flows is connected to the inlet hole 410 and a discharge pipe 425 through which the noxious gas inside the housing 400 can be discharged is connected to the outlet hole 425. [ .

An electronic circuit pattern manufacturing apparatus according to a third embodiment of the present invention will be described with reference to FIGS. 4 and 5. FIG. The electronic circuit pattern production apparatus according to the present embodiment includes a printing unit 100, a hardening unit 200, and a transfer unit 300.

The printing unit 100 prints the electronic circuit pattern 20 on the substrate 10.

The configuration and operation of the curing unit 200 are the same as those of the curing unit 200 according to the first embodiment of the present invention described above, and therefore, the same reference numerals are assigned to those in FIG.

The transfer unit 300 moves the substrate 10 from the printing unit 100 to the curing unit 200 and includes a feeding roller 310, a collecting roller 320, an intermediate roller 340, Frame 380. < / RTI >

The feed roller 310 is installed on one side of the support frame 380 and the printed body 10 is wound.

The collecting roller 320 is installed on one side of the supporting frame 380 and the lower part of the feeding roller 310 and rotates around the feeding roller 310 by the rotation of the collecting roller 320, (10) is passed through the printing unit (100) and the curing unit (200), and the substrate (10) on which the photocuring process is performed is wound.

The intermediate roller 340 is installed on the other side of the support frame 380 and rotates as the substrate 10 is moved by the collection roller 320.

The support frame 380 is installed at a lower portion of the print body 10.

Specifically, the support frame 380 includes an upper frame 350, a lower frame 360, and an intermediate frame 370.

The feeding roller 310 is installed on one side of the upper frame 350.

The lower frame 360 is installed at a lower portion of the upper frame 350 and the collecting roller 320 is installed at one side of the lower frame 360.

The upper frame 350 and the lower frame 360 may each have a separate stand-alone structure or may have an integral structure that can not be separated.

The intermediate frame 370 is installed between the upper frame 350 and the lower frame 360 and the intermediate roller 340 is installed at one side of the intermediate frame 370.

Here, the direction in which the supply roller 310 and the collection roller 310 are installed and the direction in which the intermediate roller 340 is installed are opposite to each other.

The feed roller 310 is wound around the substrate 10 and the feed roller 310 and the intermediate roller 340 are also rotated by the rotation of the collection roller 320, Is moved to the collection roller 320 via the printing unit 100, the intermediate roller 340, and the curing unit 200.

In other words, the intermediate roller 340 is installed on the opposite side of the feed roller 310 and the collecting roller 320, so that the printed body 10 moved by the feed roller 310 is separated from the intermediate roller 340, So that it can be recovered by the recovery roller 310. That is, the direction of movement of the substrate 10 is reversed.

The printing unit 100 is installed on an upper part of the upper frame 350 between the feeding roller 310 and the intermediate roller 340 and the curing unit 200 is disposed between the intermediate roller 340 and the collection roller 340. [ (320) between the lower frame (360) and the lower frame (360).

By doing so, it is possible to secure the physical distance between the printing unit 100 and the curing unit 200, thereby securing the time required for the electronic circuit pattern 20 to be placed on the printed body 10, 100 and the curing unit 200 are disposed vertically, it is possible to save space.

As a result, the printed body 10 wound on the feed roller 310 is moved to the intermediate roller 340 by the rotation of the collection roller 320, The printing unit 10 is moved to the collection roller 320 and the printing unit 100 installed on the upper frame 350 between the feeding roller 310 and the intermediate roller 340 The electronic circuit pattern 20 is printed on the printing medium 10 by the fixing roller 200 and the curing unit 200 located below the lower frame 360 between the intermediate roller 340 and the collection roller 320 The printed substrate 10 on which the electronic circuit pattern 20 is printed is cured.

The electronic circuit pattern manufacturing apparatus may further include a housing 400 in which a space for receiving the printing unit 100 and the curing unit 200 is formed.

The housing 400 may have an inlet hole 410 through which an inert gas flows and an outlet hole 420 through which the air inside the housing 400 can be discharged. An inlet pipe 415 through which an inert gas flows is connected to the inlet hole 410 and a discharge pipe 425 is connected to the outlet hole 425 to discharge noxious gas generated from the inside of the housing 400. [ ) Are preferably connected.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims and their equivalents. Of course, such modifications are within the scope of the claims.

10: Printed object 20: Electronic circuit pattern
100: printing unit 200: curing unit
210: light emitting module 212:
213: radiating fin 214:
215: LED lamp 216:
217: light emitting substrate 220: case
221: Case body 222:
224, 225: side wall 226: support frame
244: inlet hole 245: outlet hole
246: inlet pipe 247: outlet pipe
300: feed unit 310: feed roller
320: collection roller 330: support frame
340: intermediate roller 350: upper frame
360: lower frame 370: intermediate frame
400: housing 500: support unit

Claims (10)

A support frame on which a printed substrate on which an electronic circuit pattern is printed is placed;
A light emitting module for irradiating light toward a substrate placed on the support frame to perform a photo-curing process;
And a case having an inlet hole into which an inert gas flows to prevent the substrate from being oxidized, and a discharge hole for discharging noxious gas generated during the photo-curing process to the outside. The method according to claim 1,
The light-
A light emitting unit including an LED lamp and a light emitting substrate coupled to the LED lamp to supply power;
A heat dissipation unit which is in close contact with the light emitting unit and dissipates heat generated from the light emitting unit to the outside;
And a diffusion part for diffusing light of the LED lamp. The method of claim 2,
Wherein the LED lamp comprises at least one of UV LED, RGB LED, and White LED. The method according to claim 1,
And a fixing pin for fixing the object to be printed on the upper portion of the support frame. A printing unit that prints an electronic circuit pattern on the substrate;
A curing unit that performs a photo-curing step of curing the electronic circuit pattern printed on the substrate by irradiating light toward the substrate, and removing noxious gas generated in the photo-curing step;
And a transfer unit for transferring the object to be printed from the printing unit to the curing unit. The method of claim 5,
The electronic circuit pattern manufacturing apparatus
And a housing in which the inner space where the photocuring process is performed is cut off from the outside and the printing unit and the curing unit are installed in the inner space. The method of claim 6,
The housing
An inflow hole through which an inert gas flows so that the electronic circuit pattern is not oxidized;
And an exhaust hole through which noxious gas generated in the photocuring process is discharged. The method according to any one of claims 5 to 7,
The transfer unit
A support frame installed at a lower portion of the substrate;
A feed roller installed at one side of the support frame and wound around the substrate;
And a recovery roller provided on the other side of the support frame for moving the print body wound around the feed roller by rotation so as to pass through the printing unit and the curing unit and winding the substrate to which the photo- In addition,
Wherein the printing unit and the curing unit are installed on an upper portion of the support frame. The method according to any one of claims 5 to 7,
The transfer unit
A support frame installed at a lower portion of the substrate;
A feed roller installed at one side of the support frame and wound around the substrate;
And a control unit which is provided at one side of the support frame and at a lower portion of the feed roller and moves the print body wound around the feed roller by rotation so as to pass through the print unit and the curing unit, A collecting roller for winding the sheet; And
And an intermediate roller provided on the other side of the support frame and rotating as the workpiece is moved by the collection roller,
Wherein the printing unit is provided on an upper portion of the print body that moves from the feeding roller to the intermediate roller,
Wherein the curing unit is provided at a lower portion of the body to be printed which moves from the intermediate roller to the collection roller. The method of claim 9,
The support frame includes:
And an intermediate frame provided between the upper frame and the lower frame and provided with the intermediate roller, wherein the upper frame and the lower frame are disposed at a lower portion of the upper frame, ,
Wherein the direction in which the feed roller and the collection roller are installed and the direction in which the intermediate roller is installed are opposite to each other.

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