KR100476404B1 - 반도체 장치의 제조 방법 - Google Patents
반도체 장치의 제조 방법 Download PDFInfo
- Publication number
- KR100476404B1 KR100476404B1 KR10-2002-0025716A KR20020025716A KR100476404B1 KR 100476404 B1 KR100476404 B1 KR 100476404B1 KR 20020025716 A KR20020025716 A KR 20020025716A KR 100476404 B1 KR100476404 B1 KR 100476404B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- photoresist
- silicon oxide
- semiconductor device
- forming
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 102
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 86
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 107
- 238000005530 etching Methods 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000000059 patterning Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 118
- 238000011161 development Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 114
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 114
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 37
- 229920005591 polysilicon Polymers 0.000 abstract description 37
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052710 silicon Inorganic materials 0.000 abstract description 22
- 239000010703 silicon Substances 0.000 abstract description 22
- 238000013461 design Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 17
- 238000002955 isolation Methods 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 15
- 238000001312 dry etching Methods 0.000 description 13
- 238000007796 conventional method Methods 0.000 description 10
- 238000000206 photolithography Methods 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 8
- 239000012535 impurity Substances 0.000 description 8
- 230000006870 function Effects 0.000 description 6
- 230000010354 integration Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
- H01L27/11803—Masterslice integrated circuits using field effect technology
- H01L27/11807—CMOS gate arrays
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Memories (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001177193A JP4776813B2 (ja) | 2001-06-12 | 2001-06-12 | 半導体装置の製造方法 |
| JPJP-P-2001-00177193 | 2001-06-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020095063A KR20020095063A (ko) | 2002-12-20 |
| KR100476404B1 true KR100476404B1 (ko) | 2005-03-16 |
Family
ID=19018074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2002-0025716A KR100476404B1 (ko) | 2001-06-12 | 2002-05-10 | 반도체 장치의 제조 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6670262B2 (de) |
| JP (1) | JP4776813B2 (de) |
| KR (1) | KR100476404B1 (de) |
| CN (1) | CN1201376C (de) |
| DE (1) | DE10220395A1 (de) |
| TW (1) | TW538453B (de) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4729609B2 (ja) * | 2002-07-31 | 2011-07-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP4343571B2 (ja) | 2002-07-31 | 2009-10-14 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP2004103851A (ja) * | 2002-09-10 | 2004-04-02 | Renesas Technology Corp | スタティック型半導体記憶装置 |
| CN1331212C (zh) * | 2004-10-18 | 2007-08-08 | 旺宏电子股份有限公司 | 集成电路的制造方法 |
| US7279386B2 (en) * | 2004-12-03 | 2007-10-09 | Advanced Micro Devices, Inc. | Method for forming a semiconductor arrangement with gate sidewall spacers of specific dimensions |
| US7569073B2 (en) * | 2004-12-29 | 2009-08-04 | Bausch & Lomb Incorporated | Small incision intraocular lens with anti-PCO feature |
| US7473648B2 (en) * | 2006-03-07 | 2009-01-06 | International Business Machines Corporation | Double exposure double resist layer process for forming gate patterns |
| JP2009081420A (ja) * | 2007-09-07 | 2009-04-16 | Nec Electronics Corp | 半導体装置の製造方法 |
| CN101572218B (zh) * | 2008-04-28 | 2011-03-23 | 中芯国际集成电路制造(北京)有限公司 | 半导体器件及栅极的形成方法 |
| JP5319247B2 (ja) * | 2008-11-14 | 2013-10-16 | 株式会社東芝 | 半導体装置の製造方法 |
| US7939384B2 (en) * | 2008-12-19 | 2011-05-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Eliminating poly uni-direction line-end shortening using second cut |
| JP5661524B2 (ja) * | 2011-03-22 | 2015-01-28 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| JP6085803B2 (ja) * | 2013-02-19 | 2017-03-01 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| KR20170003674A (ko) * | 2014-05-27 | 2017-01-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US20220366116A1 (en) * | 2021-05-14 | 2022-11-17 | Mediatek Inc. | Integrated circuit with compact layout arrangement |
| CN117153677B (zh) * | 2023-10-27 | 2024-03-01 | 合肥晶合集成电路股份有限公司 | 一种半导体结构的制造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629311A (ja) * | 1992-07-10 | 1994-02-04 | Yamaha Corp | 半導体装置の製法 |
| JP2001036089A (ja) * | 1999-07-15 | 2001-02-09 | Nec Corp | 薄膜半導体素子の製造方法及び薄膜半導体形成装置 |
| JP2001036086A (ja) * | 1999-07-15 | 2001-02-09 | Telecommunication Advancement Organization Of Japan | 半導体装置の製造方法 |
| KR20020037096A (ko) * | 2000-11-13 | 2002-05-18 | 윤종용 | 반도체 장치의 미세패턴 형성방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5523258A (en) * | 1994-04-29 | 1996-06-04 | Cypress Semiconductor Corp. | Method for avoiding lithographic rounding effects for semiconductor fabrication |
| JPH09186166A (ja) * | 1996-01-08 | 1997-07-15 | Toshiba Corp | 半導体装置の製造方法 |
| JPH09289153A (ja) | 1996-04-23 | 1997-11-04 | Oki Electric Ind Co Ltd | 半導体装置の製造方法及びそれに用いるマスク |
| JP3523762B2 (ja) * | 1996-12-19 | 2004-04-26 | 株式会社東芝 | 半導体記憶装置 |
| JP4214428B2 (ja) | 1998-07-17 | 2009-01-28 | ソニー株式会社 | 半導体記憶装置 |
| KR100333274B1 (ko) * | 1998-11-24 | 2002-04-24 | 구본준, 론 위라하디락사 | 액정표시장치 및 그 제조방법 |
| US6426175B2 (en) * | 1999-02-22 | 2002-07-30 | International Business Machines Corporation | Fabrication of a high density long channel DRAM gate with or without a grooved gate |
-
2001
- 2001-06-12 JP JP2001177193A patent/JP4776813B2/ja not_active Expired - Fee Related
-
2002
- 2002-03-19 TW TW091105185A patent/TW538453B/zh not_active IP Right Cessation
- 2002-04-02 US US10/112,770 patent/US6670262B2/en not_active Expired - Lifetime
- 2002-05-07 DE DE10220395A patent/DE10220395A1/de not_active Ceased
- 2002-05-10 CN CNB021200106A patent/CN1201376C/zh not_active Expired - Fee Related
- 2002-05-10 KR KR10-2002-0025716A patent/KR100476404B1/ko not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629311A (ja) * | 1992-07-10 | 1994-02-04 | Yamaha Corp | 半導体装置の製法 |
| JP2001036089A (ja) * | 1999-07-15 | 2001-02-09 | Nec Corp | 薄膜半導体素子の製造方法及び薄膜半導体形成装置 |
| JP2001036086A (ja) * | 1999-07-15 | 2001-02-09 | Telecommunication Advancement Organization Of Japan | 半導体装置の製造方法 |
| KR20020037096A (ko) * | 2000-11-13 | 2002-05-18 | 윤종용 | 반도체 장치의 미세패턴 형성방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1201376C (zh) | 2005-05-11 |
| TW538453B (en) | 2003-06-21 |
| US20020187621A1 (en) | 2002-12-12 |
| KR20020095063A (ko) | 2002-12-20 |
| CN1391258A (zh) | 2003-01-15 |
| US6670262B2 (en) | 2003-12-30 |
| JP4776813B2 (ja) | 2011-09-21 |
| DE10220395A1 (de) | 2003-01-02 |
| JP2002367925A (ja) | 2002-12-20 |
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