KR100358862B1 - 픽셀 칼라 응답도를 조절하기 위해 광 차폐층을 사용하기위한 방법 및 장치 - Google Patents
픽셀 칼라 응답도를 조절하기 위해 광 차폐층을 사용하기위한 방법 및 장치 Download PDFInfo
- Publication number
- KR100358862B1 KR100358862B1 KR1020007003246A KR20007003246A KR100358862B1 KR 100358862 B1 KR100358862 B1 KR 100358862B1 KR 1020007003246 A KR1020007003246 A KR 1020007003246A KR 20007003246 A KR20007003246 A KR 20007003246A KR 100358862 B1 KR100358862 B1 KR 100358862B1
- Authority
- KR
- South Korea
- Prior art keywords
- color
- response
- pixel
- light receiving
- determining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J40/00—Photoelectric discharge tubes not involving the ionisation of a gas
- H01J40/02—Details
- H01J40/14—Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/186—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors having arrangements for blooming suppression
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Spectrometry And Color Measurement (AREA)
- Optical Elements Other Than Lenses (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8/937,631 | 1997-09-26 | ||
| US08/937,631 | 1997-09-26 | ||
| US08/937,631 US6057586A (en) | 1997-09-26 | 1997-09-26 | Method and apparatus for employing a light shield to modulate pixel color responsivity |
| PCT/US1998/014521 WO1999017337A1 (en) | 1997-09-26 | 1998-07-13 | Method and apparatus for employing a light shield to modulate pixel color responsivity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010030728A KR20010030728A (ko) | 2001-04-16 |
| KR100358862B1 true KR100358862B1 (ko) | 2002-10-31 |
Family
ID=25470186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020007003246A Expired - Fee Related KR100358862B1 (ko) | 1997-09-26 | 1998-07-13 | 픽셀 칼라 응답도를 조절하기 위해 광 차폐층을 사용하기위한 방법 및 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US6057586A (enExample) |
| EP (1) | EP1018141A4 (enExample) |
| JP (1) | JP2001518703A (enExample) |
| KR (1) | KR100358862B1 (enExample) |
| AU (1) | AU8401598A (enExample) |
| WO (1) | WO1999017337A1 (enExample) |
Families Citing this family (82)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6211521B1 (en) * | 1998-03-13 | 2001-04-03 | Intel Corporation | Infrared pixel sensor and infrared signal correction |
| US6278169B1 (en) * | 1998-05-07 | 2001-08-21 | Analog Devices, Inc. | Image sensor shielding |
| US6512401B2 (en) | 1999-09-10 | 2003-01-28 | Intel Corporation | Output buffer for high and low voltage bus |
| EP2290952A3 (en) * | 2000-07-27 | 2011-08-17 | Canon Kabushiki Kaisha | Image sensing apparatus |
| US6958777B1 (en) * | 2000-09-29 | 2005-10-25 | Ess Technology, Inc. | Exposure control in electromechanical imaging devices |
| US6507083B1 (en) | 2000-10-05 | 2003-01-14 | Pixim, Inc. | Image sensor with light-reflecting via structures |
| WO2002075370A2 (en) * | 2001-03-19 | 2002-09-26 | Weinstein Ronald S | Miniaturized microscope array digital slide scanner |
| US6559914B1 (en) | 2001-07-05 | 2003-05-06 | International Rectifier Corp. | Conductive black matrix layer for LCD display connected to gate through two vias |
| US7116437B2 (en) * | 2001-09-14 | 2006-10-03 | Dmetrix Inc. | Inter-objective baffle system |
| US6806569B2 (en) * | 2001-09-28 | 2004-10-19 | Intel Corporation | Multi-frequency power delivery system |
| WO2003047273A2 (de) * | 2001-11-15 | 2003-06-05 | Stmicroelectronics Nv | Farbfiltermatrix für einen optischen bildsensor |
| US20050285956A1 (en) * | 2001-11-15 | 2005-12-29 | Stmicroelectronics N.V. | Color-filter array for an optical-image sensor |
| US7248297B2 (en) * | 2001-11-30 | 2007-07-24 | The Board Of Trustees Of The Leland Stanford Junior University | Integrated color pixel (ICP) |
| US7034957B2 (en) * | 2002-04-15 | 2006-04-25 | Shang-Yu Yang | Method for increasing signal to noise ratio |
| JP2004104203A (ja) * | 2002-09-05 | 2004-04-02 | Toshiba Corp | 固体撮像装置 |
| US7012314B2 (en) * | 2002-12-18 | 2006-03-14 | Agere Systems Inc. | Semiconductor devices with reduced active region defects and unique contacting schemes |
| EP1746638A3 (en) * | 2002-12-18 | 2011-03-23 | Noble Peak Vision Corp. | Semiconductor devices with reduced active region defectcs and unique contacting schemes |
| US7453129B2 (en) | 2002-12-18 | 2008-11-18 | Noble Peak Vision Corp. | Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry |
| US20050133879A1 (en) * | 2003-04-07 | 2005-06-23 | Takumi Yamaguti | Solid-state imaging device, signal processing device, camera, and spectral device |
| US6812539B1 (en) * | 2003-04-10 | 2004-11-02 | Micron Technology, Inc. | Imager light shield |
| JP4824542B2 (ja) * | 2003-05-08 | 2011-11-30 | ザ サイエンス アンド テクノロジー ファシリティーズ カウンシル | 電子顕微鏡 |
| US7324690B2 (en) * | 2003-09-04 | 2008-01-29 | Micron Technology, Inc. | Metal mask for light intensity determination and ADC calibration |
| JP4322166B2 (ja) * | 2003-09-19 | 2009-08-26 | 富士フイルム株式会社 | 固体撮像素子 |
| US6852562B1 (en) * | 2003-12-05 | 2005-02-08 | Eastman Kodak Company | Low-cost method of forming a color imager |
| US6943424B1 (en) * | 2004-05-06 | 2005-09-13 | Optopac, Inc. | Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof |
| EP1594321A3 (en) * | 2004-05-07 | 2006-01-25 | Dialog Semiconductor GmbH | Extended dynamic range in color imagers |
| US7385167B2 (en) * | 2004-07-19 | 2008-06-10 | Micron Technology, Inc. | CMOS front end process compatible low stress light shield |
| KR100614793B1 (ko) * | 2004-09-23 | 2006-08-22 | 삼성전자주식회사 | 이미지 센서 및 이의 제조 방법. |
| SE0402576D0 (sv) * | 2004-10-25 | 2004-10-25 | Forskarpatent I Uppsala Ab | Multispectral and hyperspectral imaging |
| US7616855B2 (en) * | 2004-11-15 | 2009-11-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Integrated waveguide and method for designing integrated waveguide |
| US7420680B2 (en) * | 2004-11-16 | 2008-09-02 | Datacolor Holding Ag | Method for designing a colorimeter having integral CIE color-matching filters |
| WO2006055682A2 (en) * | 2004-11-17 | 2006-05-26 | Datacolor Holding Ag | Tristimulus colorimeter having integral dye filters |
| US7580130B2 (en) * | 2005-03-23 | 2009-08-25 | Datacolor Holding Ag | Method for designing a colorimeter having integral illuminant-weighted CIE color-matching filters |
| US7474402B2 (en) * | 2005-03-23 | 2009-01-06 | Datacolor Holding Ag | Reflectance sensor for integral illuminant-weighted CIE color matching filters |
| US7432491B2 (en) * | 2005-05-06 | 2008-10-07 | Micron Technology, Inc. | Pixel with spatially varying sensor positions |
| US7214920B2 (en) | 2005-05-06 | 2007-05-08 | Micron Technology, Inc. | Pixel with spatially varying metal route positions |
| US7534982B2 (en) * | 2005-06-09 | 2009-05-19 | Micron Technology, Inc. | Reduced imager crosstalk and pixel noise using extended buried contacts |
| US7684794B1 (en) * | 2005-07-01 | 2010-03-23 | Cisco Technologies, Inc. | Managing endpoint addresses separately from managing endpoint mobility |
| US8306362B2 (en) * | 2005-07-20 | 2012-11-06 | Omnivision Technologies, Inc. | Selective pixel binning and averaging based on scene illuminant |
| US7683407B2 (en) * | 2005-08-01 | 2010-03-23 | Aptina Imaging Corporation | Structure and method for building a light tunnel for use with imaging devices |
| US7633106B2 (en) * | 2005-11-09 | 2009-12-15 | International Business Machines Corporation | Light shield for CMOS imager |
| JP2007220832A (ja) * | 2006-02-15 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 固体撮像装置及びカメラ |
| KR100746458B1 (ko) * | 2006-10-11 | 2007-08-03 | 매그나칩 반도체 유한회사 | 고해상도 cmos 이미지 센서를 위한 스택형 픽셀 |
| KR100881200B1 (ko) * | 2007-07-30 | 2009-02-05 | 삼성전자주식회사 | 씨모스 이미지 센서 및 그 제조방법 |
| KR101411301B1 (ko) * | 2007-08-24 | 2014-06-25 | 삼성전자주식회사 | 이미지 센서 및 이미지 센서의 블랙 레벨 안정화 방법 |
| US7745779B2 (en) * | 2008-02-08 | 2010-06-29 | Aptina Imaging Corporation | Color pixel arrays having common color filters for multiple adjacent pixels for use in CMOS imagers |
| US7675024B2 (en) * | 2008-04-23 | 2010-03-09 | Aptina Imaging Corporation | Method and apparatus providing color filter array with non-uniform color filter sizes |
| US20090294244A1 (en) * | 2008-05-30 | 2009-12-03 | Harold Charych | Currency Validator with Rejected Bill Image Storage |
| US20090302323A1 (en) * | 2008-06-04 | 2009-12-10 | Micron Technology, Inc. | Method and apparatus for providing a low-level interconnect section in an imager device |
| DE102008027188A1 (de) * | 2008-06-06 | 2009-12-10 | Volkswagen Ag | Bildaufnahmevorrichtung |
| FR2935809B1 (fr) * | 2008-09-11 | 2011-08-05 | Commissariat Energie Atomique | Filtre spectral nanostructure et capteur d'images |
| KR101024728B1 (ko) * | 2008-09-30 | 2011-03-24 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
| US20100208266A1 (en) * | 2009-02-17 | 2010-08-19 | Colman Shannon | Tristimulus colorimeter having integral dye filters |
| US8531565B2 (en) | 2009-02-24 | 2013-09-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Front side implanted guard ring structure for backside illuminated image sensor |
| US9142586B2 (en) | 2009-02-24 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad design for backside illuminated image sensor |
| US8264377B2 (en) | 2009-03-02 | 2012-09-11 | Griffith Gregory M | Aircraft collision avoidance system |
| JP5476745B2 (ja) * | 2009-03-05 | 2014-04-23 | ソニー株式会社 | 固体撮像装置とその製造方法、及び電子機器 |
| JP2011138942A (ja) * | 2009-12-28 | 2011-07-14 | Oki Semiconductor Co Ltd | 半導体素子及び半導体素子の製造方法 |
| US8467061B2 (en) | 2010-02-19 | 2013-06-18 | Pacific Biosciences Of California, Inc. | Integrated analytical system and method |
| JP5643555B2 (ja) * | 2010-07-07 | 2014-12-17 | キヤノン株式会社 | 固体撮像装置及び撮像システム |
| JP5656484B2 (ja) | 2010-07-07 | 2015-01-21 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP5697371B2 (ja) | 2010-07-07 | 2015-04-08 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP5751766B2 (ja) | 2010-07-07 | 2015-07-22 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP5885401B2 (ja) | 2010-07-07 | 2016-03-15 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| GB201020024D0 (en) * | 2010-11-25 | 2011-01-12 | St Microelectronics Ltd | Radiation sensor |
| CN103314281B (zh) * | 2010-11-25 | 2016-03-30 | 意法半导体(R&D)有限公司 | 辐射传感器 |
| GB201020023D0 (en) | 2010-11-25 | 2011-01-12 | St Microelectronics Ltd | Radiation sensor |
| GB2485998A (en) | 2010-11-30 | 2012-06-06 | St Microelectronics Res & Dev | A single-package optical proximity detector with an internal light baffle |
| GB2486000A (en) | 2010-11-30 | 2012-06-06 | St Microelectronics Res & Dev | Optical proximity detectors with arrangements for reducing internal light propagation from emitter to detector |
| GB2485996A (en) | 2010-11-30 | 2012-06-06 | St Microelectronics Res & Dev | A combined proximity and ambient light sensor |
| FR3007534A1 (fr) * | 2013-06-20 | 2014-12-26 | St Microelectronics Crolles 2 | Realisation d'un filtre spectral nanostructure |
| WO2016098912A1 (ko) * | 2014-12-15 | 2016-06-23 | 재단법인 다차원 스마트 아이티 융합시스템 연구단 | 멀티 애퍼처 카메라의 센서 어레이 및 그 동작 방법 |
| TWI565323B (zh) * | 2015-09-02 | 2017-01-01 | 原相科技股份有限公司 | 分辨前景的成像裝置及其運作方法、以及影像感測器 |
| CN109426766A (zh) * | 2017-08-23 | 2019-03-05 | 上海箩箕技术有限公司 | 指纹成像模组和电子设备 |
| SG11202000647WA (en) | 2018-02-20 | 2020-02-27 | Intelligent Cleaning Equipment Holdings Co Ltd | Tracking device, system for tracking objects, and associated method of use |
| US11463636B2 (en) | 2018-06-27 | 2022-10-04 | Facebook Technologies, Llc | Pixel sensor having multiple photodiodes |
| US10931884B2 (en) * | 2018-08-20 | 2021-02-23 | Facebook Technologies, Llc | Pixel sensor having adaptive exposure time |
| US11956413B2 (en) | 2018-08-27 | 2024-04-09 | Meta Platforms Technologies, Llc | Pixel sensor having multiple photodiodes and shared comparator |
| US11172142B2 (en) * | 2018-09-25 | 2021-11-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Image sensor for sensing LED light with reduced flickering |
| US11218660B1 (en) | 2019-03-26 | 2022-01-04 | Facebook Technologies, Llc | Pixel sensor having shared readout structure |
| US11910114B2 (en) | 2020-07-17 | 2024-02-20 | Meta Platforms Technologies, Llc | Multi-mode image sensor |
| US11682313B2 (en) | 2021-03-17 | 2023-06-20 | Gregory M. Griffith | Sensor assembly for use in association with aircraft collision avoidance system and method of using the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4789888A (en) * | 1980-04-02 | 1988-12-06 | Matsushita Electric Industrial Co., Ltd. | Solid-state image sensor |
| JPH01152663A (ja) * | 1987-12-09 | 1989-06-15 | Oki Electric Ind Co Ltd | 固体撮像素子 |
| JPH06224403A (ja) * | 1993-01-26 | 1994-08-12 | Matsushita Electron Corp | 固体撮像装置およびその製造方法 |
| KR950034823A (ko) * | 1994-05-21 | 1995-12-28 | 문정환 | 씨씨디(ccd) 영상소자 및 제조방법 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3832034A (en) * | 1973-04-06 | 1974-08-27 | Ibm | Liquid crystal display assembly |
| US3963925A (en) * | 1975-02-26 | 1976-06-15 | Texas Instruments Incorporated | Photoconductive detector and method of fabrication |
| JPS5689176A (en) * | 1979-12-20 | 1981-07-20 | Matsushita Electric Ind Co Ltd | Solid image pickup device |
| US4355456A (en) * | 1980-03-07 | 1982-10-26 | General Dynamics, Pomona Division | Process of fabricating a Schottky barrier photovoltaic detector |
| DE3120849A1 (de) * | 1981-05-26 | 1982-12-23 | Agfa-Gevaert Ag, 5090 Leverkusen | Farbfilteranordnung fuer eine optoelektronische wandlervorrichtung |
| DE3686184T2 (de) * | 1985-03-21 | 1993-02-25 | Abbott Lab | Spektralfotometer. |
| JPS6242449A (ja) * | 1985-08-19 | 1987-02-24 | Toshiba Corp | カラ−固体撮像装置 |
| US4870483A (en) * | 1985-10-02 | 1989-09-26 | Canon Kabushiki Kaisha | Color image sensor including a plurality of photocells and a plurality of colored filters provided on the plurality of photocells |
| JPS62289087A (ja) * | 1986-06-09 | 1987-12-15 | Seiko Epson Corp | 固体撮像素子 |
| JPS6434050A (en) * | 1987-07-29 | 1989-02-03 | Canon Kk | Line sensor for reading color |
| JPS6467960A (en) * | 1987-09-09 | 1989-03-14 | Toshiba Corp | Color solid-state image sensing element |
| US4882490A (en) * | 1987-09-22 | 1989-11-21 | Fuji Photo Film Co., Ltd. | Light beam scanning apparatus having two detectors whose signal ratio indicates main scanning position |
| US4985760A (en) * | 1987-10-09 | 1991-01-15 | Canon Kabushiki Kaisha | Color imager having varying filter aperture sizes to compensate for luminance differences between colors |
| US5352920A (en) * | 1988-06-06 | 1994-10-04 | Canon Kabushiki Kaisha | Photoelectric converter with light shielding sections |
| US4908518A (en) * | 1989-02-10 | 1990-03-13 | Eastman Kodak Company | Interline transfer CCD image sensing device with electrode structure for each pixel |
| GB8927915D0 (en) * | 1989-12-11 | 1990-02-14 | Hoffmann La Roche | Novel alcohols |
| US5119181A (en) * | 1990-03-30 | 1992-06-02 | Xerox Corporation | Color array for use in fabricating full width arrays |
| JPH07112053B2 (ja) * | 1990-04-13 | 1995-11-29 | 富士ゼロックス株式会社 | 薄膜スイッチング素子アレイ |
| JPH04334056A (ja) * | 1991-05-09 | 1992-11-20 | Toshiba Corp | 固体撮像装置の製造方法 |
| JPH05183141A (ja) * | 1991-07-12 | 1993-07-23 | Fuji Xerox Co Ltd | カラーイメージセンサ |
| JP2768453B2 (ja) * | 1992-03-03 | 1998-06-25 | キヤノン株式会社 | 固体撮像装置及びそれを用いた装置 |
| DE69320113T2 (de) * | 1992-05-22 | 1999-03-11 | Matsushita Electronics Corp., Kadoma, Osaka | Festkörper-Bildsensor und Verfahren zu seiner Herstellung |
| JPH06123654A (ja) * | 1992-08-25 | 1994-05-06 | Nippondenso Co Ltd | 日射センサ |
| EP0625692B2 (en) * | 1992-11-06 | 2004-05-19 | Denso Corporation | Pyrheliometric sensor |
| JPH06151797A (ja) * | 1992-11-11 | 1994-05-31 | Sony Corp | 固体撮像素子 |
| DE4329838B4 (de) * | 1993-09-03 | 2005-09-22 | Hynix Semiconductor Inc., Ichon | Festkörper-Bildsensor |
| US5537232A (en) * | 1993-10-05 | 1996-07-16 | In Focus Systems, Inc. | Reflection hologram multiple-color filter array formed by sequential exposure to a light source |
| JP3303482B2 (ja) * | 1993-12-07 | 2002-07-22 | 株式会社デンソー | 光位置検出装置 |
| US5471515A (en) * | 1994-01-28 | 1995-11-28 | California Institute Of Technology | Active pixel sensor with intra-pixel charge transfer |
| JP2571018B2 (ja) * | 1994-05-31 | 1997-01-16 | 日本電気株式会社 | 固体撮像装置の製造方法 |
| JPH08271880A (ja) * | 1995-04-03 | 1996-10-18 | Toshiba Corp | 遮光膜,液晶表示装置および遮光膜形成用材料 |
| JP3405620B2 (ja) * | 1995-05-22 | 2003-05-12 | 松下電器産業株式会社 | 固体撮像装置 |
| US5719075A (en) * | 1995-07-31 | 1998-02-17 | Eastman Kodak Company | Method of making a planar charge coupled device with edge aligned implants and electrodes connected with overlying metal |
| JPH0992809A (ja) * | 1995-09-27 | 1997-04-04 | Nikon Corp | 固体撮像装置 |
| US5708264A (en) * | 1995-11-07 | 1998-01-13 | Eastman Kodak Company | Planar color filter array for CCDs from dyed and mordant layers |
| US5986297A (en) * | 1996-05-22 | 1999-11-16 | Eastman Kodak Company | Color active pixel sensor with electronic shuttering, anti-blooming and low cross-talk |
| KR100215878B1 (ko) * | 1996-12-28 | 1999-08-16 | 구본준 | 컬러 고체 촬상 소자의 제조 방법 |
| JP3547280B2 (ja) * | 1997-02-25 | 2004-07-28 | 松下電器産業株式会社 | 固体撮像装置 |
| KR100223805B1 (ko) * | 1997-06-13 | 1999-10-15 | 구본준 | 고체 촬상소자의 제조방법 |
| TW377517B (en) * | 1998-03-19 | 1999-12-21 | United Microelectronics Corp | Color sensing apparatus of diode and the method of manufacturing the same |
| US5914749A (en) * | 1998-03-31 | 1999-06-22 | Intel Corporation | Magenta-white-yellow (MWY) color system for digital image sensor applications |
| US6137100A (en) * | 1998-06-08 | 2000-10-24 | Photobit Corporation | CMOS image sensor with different pixel sizes for different colors |
| US6137634A (en) * | 1999-02-01 | 2000-10-24 | Intel Corporation | Microlens array |
-
1997
- 1997-09-26 US US08/937,631 patent/US6057586A/en not_active Expired - Lifetime
-
1998
- 1998-07-13 EP EP98934508A patent/EP1018141A4/en not_active Withdrawn
- 1998-07-13 JP JP2000514306A patent/JP2001518703A/ja active Pending
- 1998-07-13 KR KR1020007003246A patent/KR100358862B1/ko not_active Expired - Fee Related
- 1998-07-13 WO PCT/US1998/014521 patent/WO1999017337A1/en not_active Ceased
- 1998-07-13 AU AU84015/98A patent/AU8401598A/en not_active Abandoned
-
2000
- 2000-03-13 US US09/524,081 patent/US6235549B1/en not_active Expired - Lifetime
-
2001
- 2001-03-09 US US09/802,464 patent/US6933168B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4789888A (en) * | 1980-04-02 | 1988-12-06 | Matsushita Electric Industrial Co., Ltd. | Solid-state image sensor |
| JPH01152663A (ja) * | 1987-12-09 | 1989-06-15 | Oki Electric Ind Co Ltd | 固体撮像素子 |
| JPH06224403A (ja) * | 1993-01-26 | 1994-08-12 | Matsushita Electron Corp | 固体撮像装置およびその製造方法 |
| KR950034823A (ko) * | 1994-05-21 | 1995-12-28 | 문정환 | 씨씨디(ccd) 영상소자 및 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6235549B1 (en) | 2001-05-22 |
| US6057586A (en) | 2000-05-02 |
| EP1018141A4 (en) | 2000-11-29 |
| US20040012029A1 (en) | 2004-01-22 |
| US6933168B2 (en) | 2005-08-23 |
| KR20010030728A (ko) | 2001-04-16 |
| JP2001518703A (ja) | 2001-10-16 |
| EP1018141A1 (en) | 2000-07-12 |
| WO1999017337A1 (en) | 1999-04-08 |
| AU8401598A (en) | 1999-04-23 |
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