KR100317756B1 - 플립칩디바이스의볼접촉부 - Google Patents

플립칩디바이스의볼접촉부 Download PDF

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Publication number
KR100317756B1
KR100317756B1 KR1019930024606A KR930024606A KR100317756B1 KR 100317756 B1 KR100317756 B1 KR 100317756B1 KR 1019930024606 A KR1019930024606 A KR 1019930024606A KR 930024606 A KR930024606 A KR 930024606A KR 100317756 B1 KR100317756 B1 KR 100317756B1
Authority
KR
South Korea
Prior art keywords
contact
ball
semiconductor device
array
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930024606A
Other languages
English (en)
Korean (ko)
Other versions
KR940012484A (ko
Inventor
앤소니엠.치우
Original Assignee
윌리엄 비. 켐플러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 비. 켐플러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 비. 켐플러
Publication of KR940012484A publication Critical patent/KR940012484A/ko
Application granted granted Critical
Publication of KR100317756B1 publication Critical patent/KR100317756B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W70/093—
    • H10P95/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W72/0112—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W72/01225—
    • H10W72/01251—
    • H10W72/07236—
    • H10W72/223—
    • H10W72/224—
    • H10W72/253—
    • H10W72/255—
    • H10W72/29—
    • H10W72/5522—
    • H10W72/9415—
    • H10W72/9445—
    • H10W72/952—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49224—Contact or terminal manufacturing with coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
KR1019930024606A 1992-09-15 1993-11-18 플립칩디바이스의볼접촉부 Expired - Fee Related KR100317756B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94518592A 1992-09-15 1992-09-15
US07/945,185 1992-11-19

Publications (2)

Publication Number Publication Date
KR940012484A KR940012484A (ko) 1994-06-23
KR100317756B1 true KR100317756B1 (ko) 2002-03-20

Family

ID=25482756

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930024606A Expired - Fee Related KR100317756B1 (ko) 1992-09-15 1993-11-18 플립칩디바이스의볼접촉부

Country Status (7)

Country Link
US (2) US5955784A (cg-RX-API-DMAC10.html)
EP (1) EP0588609B1 (cg-RX-API-DMAC10.html)
JP (1) JPH06224198A (cg-RX-API-DMAC10.html)
KR (1) KR100317756B1 (cg-RX-API-DMAC10.html)
DE (1) DE69312411T2 (cg-RX-API-DMAC10.html)
SG (1) SG54297A1 (cg-RX-API-DMAC10.html)
TW (1) TW239899B (cg-RX-API-DMAC10.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19533171A1 (de) * 1994-09-13 1996-03-14 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Applikation von Verbindungsmaterial auf einer Substratanschlußfläche
US5786635A (en) * 1996-12-16 1998-07-28 International Business Machines Corporation Electronic package with compressible heatsink structure
US6131795A (en) * 1997-11-10 2000-10-17 Matsushita Electric Industrial Co., Ltd. Thermal compression bonding method of electronic part with solder bump
FR2785140B1 (fr) 1998-10-27 2007-04-20 Novatec Sa Soc Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes
FR2791046B1 (fr) * 1999-03-17 2001-05-11 Novatec Sa Soc Procede et dispositif de distribution unitaire de billes solides et identiques sur un substrat par serigraphie
HK1043081B (en) * 1999-03-17 2005-10-07 Novatec S.A. Filling device and method for filling balls in the apertures of a ball-receiving element
JP4341187B2 (ja) * 2001-02-13 2009-10-07 日本電気株式会社 半導体装置
US6802918B1 (en) * 2001-05-09 2004-10-12 Raytheon Company Fabrication method for adhesive pressure bonding two components together with closed-loop control
US6830463B2 (en) 2002-01-29 2004-12-14 Fci Americas Technology, Inc. Ball grid array connection device
NL1024688C2 (nl) * 2003-11-03 2005-05-04 Meco Equip Eng Werkwijze en inrichting voor het met een elektronische component verbinden van tot elektrische contactorganen te vormen objecten.
JP4427411B2 (ja) * 2004-07-28 2010-03-10 日立ソフトウエアエンジニアリング株式会社 ビーズ配列装置及びビーズ配列方法
US7550846B2 (en) * 2005-12-21 2009-06-23 Palo Alto Research Center Conductive bump with a plurality of contact elements
CN101125406B (zh) * 2006-08-16 2010-09-29 比亚迪股份有限公司 球体固定块及其制造装置
US7910838B2 (en) * 2008-04-03 2011-03-22 Advanced Interconnections Corp. Solder ball interface
KR20150139190A (ko) * 2014-06-03 2015-12-11 삼성전기주식회사 소자 및 소자 패키지

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0372880A2 (en) * 1988-12-05 1990-06-13 Hitachi Chemical Co., Ltd. Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US2842831A (en) * 1956-08-30 1958-07-15 Bell Telephone Labor Inc Manufacture of semiconductor devices
US2934685A (en) * 1957-01-09 1960-04-26 Texas Instruments Inc Transistors and method of fabricating same
NL255865A (cg-RX-API-DMAC10.html) * 1960-09-13 1900-01-01
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
US3809625A (en) * 1972-08-15 1974-05-07 Gen Motors Corp Method of making contact bumps on flip-chips
US4369458A (en) * 1980-07-01 1983-01-18 Westinghouse Electric Corp. Self-aligned, flip-chip focal plane array configuration
DE3343362A1 (de) * 1983-11-30 1985-06-05 Siemens AG, 1000 Berlin und 8000 München Verfahren zur galvanischen herstellung metallischer, hoeckerartiger anschlusskontakte
US4838347A (en) * 1987-07-02 1989-06-13 American Telephone And Telegraph Company At&T Bell Laboratories Thermal conductor assembly
JP2528910B2 (ja) * 1987-11-16 1996-08-28 富士通株式会社 ハンダバンプの形成方法
JPH0740496B2 (ja) * 1989-03-01 1995-05-01 シャープ株式会社 電極上への導電性粒子の配置方法
JPH02246235A (ja) * 1989-03-20 1990-10-02 Fujitsu Ltd 集積回路装置
US5135890A (en) * 1989-06-16 1992-08-04 General Electric Company Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
US5010038A (en) * 1989-06-29 1991-04-23 Digital Equipment Corp. Method of cooling and powering an integrated circuit chip using a compliant interposing pad
EP0447170B1 (en) * 1990-03-14 2002-01-09 Nippon Steel Corporation Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same
JP2843658B2 (ja) * 1990-08-02 1999-01-06 東レ・ダウコーニング・シリコーン株式会社 フリップチップ型半導体装置
US5207585A (en) * 1990-10-31 1993-05-04 International Business Machines Corporation Thin interface pellicle for dense arrays of electrical interconnects
JPH0563029A (ja) * 1991-09-02 1993-03-12 Fujitsu Ltd 半導体素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0372880A2 (en) * 1988-12-05 1990-06-13 Hitachi Chemical Co., Ltd. Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips

Also Published As

Publication number Publication date
EP0588609B1 (en) 1997-07-23
US5849132A (en) 1998-12-15
KR940012484A (ko) 1994-06-23
DE69312411D1 (de) 1997-09-04
US5955784A (en) 1999-09-21
JPH06224198A (ja) 1994-08-12
SG54297A1 (en) 1998-11-16
TW239899B (cg-RX-API-DMAC10.html) 1995-02-01
DE69312411T2 (de) 1997-11-27
EP0588609A1 (en) 1994-03-23

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