KR100309932B1 - 웨이퍼 운반 장치 및 방법 - Google Patents

웨이퍼 운반 장치 및 방법 Download PDF

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Publication number
KR100309932B1
KR100309932B1 KR1019870004071A KR870004071A KR100309932B1 KR 100309932 B1 KR100309932 B1 KR 100309932B1 KR 1019870004071 A KR1019870004071 A KR 1019870004071A KR 870004071 A KR870004071 A KR 870004071A KR 100309932 B1 KR100309932 B1 KR 100309932B1
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South Korea
Prior art keywords
wafer
station
orientation
input station
cassette holder
Prior art date
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Expired - Fee Related
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KR1019870004071A
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English (en)
Korean (ko)
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KR870010617A (ko
Inventor
리챠드제이허텔
아드리안디델포지
에릭엘미어즈
에드워드디먀킨토시
로버트이제닝즈
아킬바르가바
윌리암에이취바튜라
Original Assignee
제임스 엠. 윌리암스
배리언 어소시에이츠 인코포레이티드
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Application filed by 제임스 엠. 윌리암스, 배리언 어소시에이츠 인코포레이티드 filed Critical 제임스 엠. 윌리암스
Publication of KR870010617A publication Critical patent/KR870010617A/ko
Application granted granted Critical
Publication of KR100309932B1 publication Critical patent/KR100309932B1/ko
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019870004071A 1986-04-28 1987-04-28 웨이퍼 운반 장치 및 방법 Expired - Fee Related KR100309932B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85681486A 1986-04-28 1986-04-28
US856814 1986-04-28

Publications (2)

Publication Number Publication Date
KR870010617A KR870010617A (ko) 1987-11-30
KR100309932B1 true KR100309932B1 (ko) 2001-12-15

Family

ID=25324567

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870004071A Expired - Fee Related KR100309932B1 (ko) 1986-04-28 1987-04-28 웨이퍼 운반 장치 및 방법

Country Status (4)

Country Link
EP (2) EP0244202B1 (enExample)
JP (1) JPS6323332A (enExample)
KR (1) KR100309932B1 (enExample)
DE (2) DE3750558T2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100753290B1 (ko) * 1999-12-23 2007-08-29 어플라이드 머티어리얼스, 인코포레이티드 로봇을 사용하여 기판을 정렬시키는 장치 및 방법
KR100989930B1 (ko) 2008-06-16 2010-10-29 김은환 웨이퍼 홀딩장치 및 웨이퍼 검사를 위한 구동장치 그리고이의 구동방법
CN110867407A (zh) * 2019-11-20 2020-03-06 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 扩散工艺篮具内成组硅片托起机构的梳齿状托架制作方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
DE3827343A1 (de) * 1988-08-12 1990-02-15 Leybold Ag Vorrichtung nach dem karussel-prinzip zum beschichten von substraten
JP2926213B2 (ja) * 1988-02-12 1999-07-28 東京エレクトロン株式会社 基板処理装置
JPH0210727A (ja) * 1988-06-28 1990-01-16 Naoetsu Denshi Kogyo Kk 半導体ウエハの分割方法および装置
DE68927146T2 (de) * 1988-09-30 1997-02-06 Canon Kk Transportvorrichtung für Substrate
US5277539A (en) * 1988-09-30 1994-01-11 Canon Kabushiki Kaisha Substrate conveying apparatus
DE4310149C2 (de) * 1993-03-29 1996-05-02 Jenoptik Jena Gmbh Einrichtung zur Handhabung von scheibenförmigen Objekten in einer Handhabungsebene eines lokalen Reinraumes
US5902088A (en) * 1996-11-18 1999-05-11 Applied Materials, Inc. Single loadlock chamber with wafer cooling function
US6152070A (en) 1996-11-18 2000-11-28 Applied Materials, Inc. Tandem process chamber
US6491491B1 (en) 1997-10-30 2002-12-10 Sankyo Seiki Mfg. Co., Ltd. Articulated robot
US6257827B1 (en) * 1997-12-01 2001-07-10 Brooks Automation Inc. Apparatus and method for transporting substrates
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
GB2347784B (en) 1999-03-11 2004-02-11 Applied Materials Inc Scanning wheel for ion implantation process chamber
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
JP5132904B2 (ja) * 2006-09-05 2013-01-30 東京エレクトロン株式会社 基板位置決め方法，基板位置検出方法，基板回収方法及び基板位置ずれ補正装置
JP2011161629A (ja) * 2011-06-03 2011-08-25 Kawasaki Heavy Ind Ltd 基板搬送ロボット
JP2012035408A (ja) * 2011-11-09 2012-02-23 Kawasaki Heavy Ind Ltd 基板搬送ロボット

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4457664A (en) * 1982-03-22 1984-07-03 Ade Corporation Wafer alignment station
EP0152555A2 (en) * 1984-02-21 1985-08-28 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
US4553069A (en) * 1984-01-05 1985-11-12 General Ionex Corporation Wafer holding apparatus for ion implantation
JPS61263123A (ja) * 1985-05-16 1986-11-21 Canon Inc ステップアンドリピート露光方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3401568A (en) * 1966-08-17 1968-09-17 Leland F. Blatt Carriage drive mechanism
US4208159A (en) * 1977-07-18 1980-06-17 Tokyo Ohka Kogyo Kabushiki Kaisha Apparatus for the treatment of a wafer by plasma reaction
JPS57145326A (en) * 1980-12-29 1982-09-08 Censor Patent Versuch Method and device for forming pattern on wafer by photosensing semiconductor wafer
US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
JPS5864043A (ja) * 1981-10-13 1983-04-16 Nippon Telegr & Teleph Corp <Ntt> 円板形状体の位置決め装置
US4458152A (en) * 1982-05-10 1984-07-03 Siltec Corporation Precision specular proximity detector and article handing apparatus employing same
DE3219502C2 (de) * 1982-05-25 1990-04-19 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Vorrichtung zum automatischen Transport scheibenförmiger Objekte
JPS59124589A (ja) * 1982-12-28 1984-07-18 株式会社東芝 産業用ロボツト
JPS59125627A (ja) * 1983-01-07 1984-07-20 Toshiba Corp ウエハ外周座標測定装置
DE3465405D1 (en) * 1983-02-14 1987-09-17 Aeronca Electronics Inc Articulated arm transfer device
EP0129731A1 (en) * 1983-06-15 1985-01-02 The Perkin-Elmer Corporation Wafer handling system
JPS60109242A (ja) * 1983-11-18 1985-06-14 Hitachi Ltd 半導体ウエハの搬送、位置決め方法および装置
JPS60163742U (ja) * 1983-12-22 1985-10-30 東京エレクトロン株式会社 半導体ウエハプロ−バ
GB2157078B (en) * 1984-03-30 1987-09-30 Perkin Elmer Corp Wafer alignment apparatus
JPS6122642A (ja) * 1984-07-10 1986-01-31 Ulvac Corp ウエハ搬送装置
US4657618A (en) * 1984-10-22 1987-04-14 Texas Instruments Incorporated Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate
JPS61226287A (ja) * 1985-03-07 1986-10-08 エプシロン　テクノロジー　インコーポレーテツド 加工品を取扱うたぬの装置および方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4457664A (en) * 1982-03-22 1984-07-03 Ade Corporation Wafer alignment station
US4457664B1 (enExample) * 1982-03-22 1993-08-24 Ade Corp
US4553069A (en) * 1984-01-05 1985-11-12 General Ionex Corporation Wafer holding apparatus for ion implantation
EP0152555A2 (en) * 1984-02-21 1985-08-28 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
JPS61263123A (ja) * 1985-05-16 1986-11-21 Canon Inc ステップアンドリピート露光方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100753290B1 (ko) * 1999-12-23 2007-08-29 어플라이드 머티어리얼스, 인코포레이티드 로봇을 사용하여 기판을 정렬시키는 장치 및 방법
KR100989930B1 (ko) 2008-06-16 2010-10-29 김은환 웨이퍼 홀딩장치 및 웨이퍼 검사를 위한 구동장치 그리고이의 구동방법
CN110867407A (zh) * 2019-11-20 2020-03-06 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 扩散工艺篮具内成组硅片托起机构的梳齿状托架制作方法
CN110867407B (zh) * 2019-11-20 2023-04-18 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 扩散工艺篮具内成组硅片托起机构的梳齿状托架制作方法

Also Published As

Publication number Publication date
KR870010617A (ko) 1987-11-30
JPH0458184B2 (enExample) 1992-09-16
EP0244202B1 (en) 1994-09-21
DE3750558D1 (de) 1994-10-27
EP0244202A2 (en) 1987-11-04
EP0556865A1 (en) 1993-08-25
JPS6323332A (ja) 1988-01-30
EP0556865B1 (en) 1998-11-18
DE3750558T2 (de) 1995-02-02
DE3752234D1 (de) 1998-12-24
DE3752234T2 (de) 1999-05-12
EP0244202A3 (en) 1990-09-05

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