JPH0458184B2 - - Google Patents

Info

Publication number
JPH0458184B2
JPH0458184B2 JP62103468A JP10346887A JPH0458184B2 JP H0458184 B2 JPH0458184 B2 JP H0458184B2 JP 62103468 A JP62103468 A JP 62103468A JP 10346887 A JP10346887 A JP 10346887A JP H0458184 B2 JPH0458184 B2 JP H0458184B2
Authority
JP
Japan
Prior art keywords
wafer
station
transfer arm
sensing
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62103468A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6323332A (ja
Inventor
Jei Haateru Richaado
Dee Derufuooji Adorian
Eru Meaazu Eritsuku
Dee Matsukintotsushu Edowaado
Ii Jeningusu Robaato
Baagyaba Akuhiru
Eichi Baachura Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of JPS6323332A publication Critical patent/JPS6323332A/ja
Publication of JPH0458184B2 publication Critical patent/JPH0458184B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62103468A 1986-04-28 1987-04-28 ウエーハ移送方法及び装置 Granted JPS6323332A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85681486A 1986-04-28 1986-04-28
US856814 1986-04-28

Publications (2)

Publication Number Publication Date
JPS6323332A JPS6323332A (ja) 1988-01-30
JPH0458184B2 true JPH0458184B2 (enExample) 1992-09-16

Family

ID=25324567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62103468A Granted JPS6323332A (ja) 1986-04-28 1987-04-28 ウエーハ移送方法及び装置

Country Status (4)

Country Link
EP (2) EP0244202B1 (enExample)
JP (1) JPS6323332A (enExample)
KR (1) KR100309932B1 (enExample)
DE (2) DE3750558T2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011161629A (ja) * 2011-06-03 2011-08-25 Kawasaki Heavy Ind Ltd 基板搬送ロボット
JP2012035408A (ja) * 2011-11-09 2012-02-23 Kawasaki Heavy Ind Ltd 基板搬送ロボット

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
DE3827343A1 (de) * 1988-08-12 1990-02-15 Leybold Ag Vorrichtung nach dem karussel-prinzip zum beschichten von substraten
JP2926213B2 (ja) * 1988-02-12 1999-07-28 東京エレクトロン株式会社 基板処理装置
JPH0210727A (ja) * 1988-06-28 1990-01-16 Naoetsu Denshi Kogyo Kk 半導体ウエハの分割方法および装置
DE68927146T2 (de) * 1988-09-30 1997-02-06 Canon Kk Transportvorrichtung für Substrate
US5277539A (en) * 1988-09-30 1994-01-11 Canon Kabushiki Kaisha Substrate conveying apparatus
DE4310149C2 (de) * 1993-03-29 1996-05-02 Jenoptik Jena Gmbh Einrichtung zur Handhabung von scheibenförmigen Objekten in einer Handhabungsebene eines lokalen Reinraumes
US5902088A (en) * 1996-11-18 1999-05-11 Applied Materials, Inc. Single loadlock chamber with wafer cooling function
US6152070A (en) 1996-11-18 2000-11-28 Applied Materials, Inc. Tandem process chamber
US6491491B1 (en) 1997-10-30 2002-12-10 Sankyo Seiki Mfg. Co., Ltd. Articulated robot
US6257827B1 (en) * 1997-12-01 2001-07-10 Brooks Automation Inc. Apparatus and method for transporting substrates
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
GB2347784B (en) 1999-03-11 2004-02-11 Applied Materials Inc Scanning wheel for ion implantation process chamber
US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
JP5132904B2 (ja) * 2006-09-05 2013-01-30 東京エレクトロン株式会社 基板位置決め方法，基板位置検出方法，基板回収方法及び基板位置ずれ補正装置
KR100989930B1 (ko) 2008-06-16 2010-10-29 김은환 웨이퍼 홀딩장치 및 웨이퍼 검사를 위한 구동장치 그리고이의 구동방법
CN110867407B (zh) * 2019-11-20 2023-04-18 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 扩散工艺篮具内成组硅片托起机构的梳齿状托架制作方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3401568A (en) * 1966-08-17 1968-09-17 Leland F. Blatt Carriage drive mechanism
US4208159A (en) * 1977-07-18 1980-06-17 Tokyo Ohka Kogyo Kabushiki Kaisha Apparatus for the treatment of a wafer by plasma reaction
JPS57145326A (en) * 1980-12-29 1982-09-08 Censor Patent Versuch Method and device for forming pattern on wafer by photosensing semiconductor wafer
US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
JPS5864043A (ja) * 1981-10-13 1983-04-16 Nippon Telegr & Teleph Corp <Ntt> 円板形状体の位置決め装置
US4457664A (en) * 1982-03-22 1984-07-03 Ade Corporation Wafer alignment station
US4458152A (en) * 1982-05-10 1984-07-03 Siltec Corporation Precision specular proximity detector and article handing apparatus employing same
DE3219502C2 (de) * 1982-05-25 1990-04-19 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Vorrichtung zum automatischen Transport scheibenförmiger Objekte
JPS59124589A (ja) * 1982-12-28 1984-07-18 株式会社東芝 産業用ロボツト
JPS59125627A (ja) * 1983-01-07 1984-07-20 Toshiba Corp ウエハ外周座標測定装置
DE3465405D1 (en) * 1983-02-14 1987-09-17 Aeronca Electronics Inc Articulated arm transfer device
EP0129731A1 (en) * 1983-06-15 1985-01-02 The Perkin-Elmer Corporation Wafer handling system
JPS60109242A (ja) * 1983-11-18 1985-06-14 Hitachi Ltd 半導体ウエハの搬送、位置決め方法および装置
JPS60163742U (ja) * 1983-12-22 1985-10-30 東京エレクトロン株式会社 半導体ウエハプロ−バ
US4553069A (en) * 1984-01-05 1985-11-12 General Ionex Corporation Wafer holding apparatus for ion implantation
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
GB2157078B (en) * 1984-03-30 1987-09-30 Perkin Elmer Corp Wafer alignment apparatus
JPS6122642A (ja) * 1984-07-10 1986-01-31 Ulvac Corp ウエハ搬送装置
US4657618A (en) * 1984-10-22 1987-04-14 Texas Instruments Incorporated Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate
JPS61226287A (ja) * 1985-03-07 1986-10-08 エプシロン　テクノロジー　インコーポレーテツド 加工品を取扱うたぬの装置および方法
JPS61263123A (ja) * 1985-05-16 1986-11-21 Canon Inc ステップアンドリピート露光方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011161629A (ja) * 2011-06-03 2011-08-25 Kawasaki Heavy Ind Ltd 基板搬送ロボット
JP2012035408A (ja) * 2011-11-09 2012-02-23 Kawasaki Heavy Ind Ltd 基板搬送ロボット

Also Published As

Publication number Publication date
KR870010617A (ko) 1987-11-30
KR100309932B1 (ko) 2001-12-15
EP0244202B1 (en) 1994-09-21
DE3750558D1 (de) 1994-10-27
EP0244202A2 (en) 1987-11-04
EP0556865A1 (en) 1993-08-25
JPS6323332A (ja) 1988-01-30
EP0556865B1 (en) 1998-11-18
DE3750558T2 (de) 1995-02-02
DE3752234D1 (de) 1998-12-24
DE3752234T2 (de) 1999-05-12
EP0244202A3 (en) 1990-09-05

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