KR100294145B1 - 전자부품및그제조방법 - Google Patents

전자부품및그제조방법 Download PDF

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Publication number
KR100294145B1
KR100294145B1 KR1019950004875A KR19950004875A KR100294145B1 KR 100294145 B1 KR100294145 B1 KR 100294145B1 KR 1019950004875 A KR1019950004875 A KR 1019950004875A KR 19950004875 A KR19950004875 A KR 19950004875A KR 100294145 B1 KR100294145 B1 KR 100294145B1
Authority
KR
South Korea
Prior art keywords
resin film
substrate
layer
conductive material
surface area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950004875A
Other languages
English (en)
Korean (ko)
Other versions
KR950035554A (ko
Inventor
니시무라히토시
후지하시다카시
Original Assignee
무라타 야스타까
가부시키가이샤 무라타 매뉴팩쳐링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 무라타 야스타까, 가부시키가이샤 무라타 매뉴팩쳐링 filed Critical 무라타 야스타까
Publication of KR950035554A publication Critical patent/KR950035554A/ko
Application granted granted Critical
Publication of KR100294145B1 publication Critical patent/KR100294145B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/144—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
KR1019950004875A 1994-03-10 1995-03-10 전자부품및그제조방법 Expired - Lifetime KR100294145B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1994-40051 1994-03-10
JP6040051A JPH07249877A (ja) 1994-03-10 1994-03-10 電子部品

Publications (2)

Publication Number Publication Date
KR950035554A KR950035554A (ko) 1995-12-30
KR100294145B1 true KR100294145B1 (ko) 2001-09-17

Family

ID=12570121

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950004875A Expired - Lifetime KR100294145B1 (ko) 1994-03-10 1995-03-10 전자부품및그제조방법

Country Status (5)

Country Link
JP (1) JPH07249877A (https=)
KR (1) KR100294145B1 (https=)
CN (1) CN1096744C (https=)
DE (1) DE19507124A1 (https=)
TW (1) TW274162B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19548062A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektrisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - sowie ein Verfahren zu dessen Herstellung
EP0800338B1 (de) * 1996-04-04 2001-05-30 Gunter Langer Anordnung zur Reduzierung der elektromagnetischen Abstrahlung bei Leiterkarten und anderen Trägern elektronischer Schaltungen
DE19613587C2 (de) * 1996-04-04 2000-02-17 Langer Guenter Anordnung zur Blockierung der elektromagnetischen Abstrahlung bei Leiterkarten und integrierten Schaltkreisen
DE19818824B4 (de) * 1998-04-27 2008-07-31 Epcos Ag Elektronisches Bauelement und Verfahren zu dessen Herstellung
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
DE19854396C2 (de) * 1998-11-25 2002-02-07 Freudenberg Carl Kg Sensormodul
DE10049288B4 (de) * 2000-10-04 2004-07-15 Infineon Technologies Ag Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren
DE10125744A1 (de) * 2001-05-21 2002-12-05 Siemens Ag Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung
JP3770210B2 (ja) * 2002-06-20 2006-04-26 株式会社村田製作所 圧電部品の製造方法
JP5086835B2 (ja) * 2008-02-20 2012-11-28 パナソニック株式会社 電動工具

Also Published As

Publication number Publication date
DE19507124A1 (de) 1995-09-14
CN1096744C (zh) 2002-12-18
JPH07249877A (ja) 1995-09-26
KR950035554A (ko) 1995-12-30
CN1117666A (zh) 1996-02-28
TW274162B (https=) 1996-04-11

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