JPWO2024117183A5 - - Google Patents

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Publication number
JPWO2024117183A5
JPWO2024117183A5 JP2024519637A JP2024519637A JPWO2024117183A5 JP WO2024117183 A5 JPWO2024117183 A5 JP WO2024117183A5 JP 2024519637 A JP2024519637 A JP 2024519637A JP 2024519637 A JP2024519637 A JP 2024519637A JP WO2024117183 A5 JPWO2024117183 A5 JP WO2024117183A5
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JP
Japan
Prior art keywords
conductive paste
test
cured product
substrate
paste according
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Application number
JP2024519637A
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English (en)
Japanese (ja)
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JPWO2024117183A1 (https=
JP7808189B2 (ja
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Priority claimed from PCT/JP2023/042743 external-priority patent/WO2024117183A1/ja
Publication of JPWO2024117183A1 publication Critical patent/JPWO2024117183A1/ja
Publication of JPWO2024117183A5 publication Critical patent/JPWO2024117183A5/ja
Application granted granted Critical
Publication of JP7808189B2 publication Critical patent/JP7808189B2/ja
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JP2024519637A 2022-11-30 2023-11-29 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Active JP7808189B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022191058 2022-11-30
JP2022191058 2022-11-30
PCT/JP2023/042743 WO2024117183A1 (ja) 2022-11-30 2023-11-29 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Publications (3)

Publication Number Publication Date
JPWO2024117183A1 JPWO2024117183A1 (https=) 2024-06-06
JPWO2024117183A5 true JPWO2024117183A5 (https=) 2024-10-31
JP7808189B2 JP7808189B2 (ja) 2026-01-28

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ID=91323823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024519637A Active JP7808189B2 (ja) 2022-11-30 2023-11-29 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Country Status (4)

Country Link
JP (1) JP7808189B2 (https=)
CN (1) CN119678226A (https=)
TW (1) TW202440851A (https=)
WO (1) WO2024117183A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018181694A1 (ja) * 2017-03-30 2020-02-06 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7534840B2 (ja) * 2017-06-12 2024-08-15 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
JP7280864B2 (ja) * 2018-09-14 2023-05-24 積水化学工業株式会社 導電材料及び接続構造体
JP7606348B2 (ja) * 2019-05-14 2024-12-25 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

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