TW202440851A - 導電膏、rfid嵌體以及rfid嵌體之製造方法 - Google Patents

導電膏、rfid嵌體以及rfid嵌體之製造方法 Download PDF

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Publication number
TW202440851A
TW202440851A TW112146562A TW112146562A TW202440851A TW 202440851 A TW202440851 A TW 202440851A TW 112146562 A TW112146562 A TW 112146562A TW 112146562 A TW112146562 A TW 112146562A TW 202440851 A TW202440851 A TW 202440851A
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TW
Taiwan
Prior art keywords
conductive paste
conductive
meth
substrate
acrylate
Prior art date
Application number
TW112146562A
Other languages
English (en)
Chinese (zh)
Inventor
小林洋
土橋悠人
Original Assignee
日商積水化學工業股份有限公司
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Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202440851A publication Critical patent/TW202440851A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW112146562A 2022-11-30 2023-11-30 導電膏、rfid嵌體以及rfid嵌體之製造方法 TW202440851A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-191058 2022-11-30
JP2022191058 2022-11-30

Publications (1)

Publication Number Publication Date
TW202440851A true TW202440851A (zh) 2024-10-16

Family

ID=91323823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112146562A TW202440851A (zh) 2022-11-30 2023-11-30 導電膏、rfid嵌體以及rfid嵌體之製造方法

Country Status (4)

Country Link
JP (1) JP7808189B2 (https=)
CN (1) CN119678226A (https=)
TW (1) TW202440851A (https=)
WO (1) WO2024117183A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018181694A1 (ja) * 2017-03-30 2020-02-06 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7534840B2 (ja) * 2017-06-12 2024-08-15 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
JP7280864B2 (ja) * 2018-09-14 2023-05-24 積水化学工業株式会社 導電材料及び接続構造体
JP7606348B2 (ja) * 2019-05-14 2024-12-25 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
WO2024117183A1 (ja) 2024-06-06
CN119678226A (zh) 2025-03-21
JPWO2024117183A1 (https=) 2024-06-06
JP7808189B2 (ja) 2026-01-28

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