JPWO2024117181A5 - - Google Patents
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- Publication number
- JPWO2024117181A5 JPWO2024117181A5 JP2024519634A JP2024519634A JPWO2024117181A5 JP WO2024117181 A5 JPWO2024117181 A5 JP WO2024117181A5 JP 2024519634 A JP2024519634 A JP 2024519634A JP 2024519634 A JP2024519634 A JP 2024519634A JP WO2024117181 A5 JPWO2024117181 A5 JP WO2024117181A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- conductive
- substrate
- less
- rfid inlay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022191056 | 2022-11-30 | ||
| JP2022191056 | 2022-11-30 | ||
| PCT/JP2023/042741 WO2024117181A1 (ja) | 2022-11-30 | 2023-11-29 | 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024117181A1 JPWO2024117181A1 (https=) | 2024-06-06 |
| JPWO2024117181A5 true JPWO2024117181A5 (https=) | 2024-10-31 |
| JP7808187B2 JP7808187B2 (ja) | 2026-01-28 |
Family
ID=91323807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024519634A Active JP7808187B2 (ja) | 2022-11-30 | 2023-11-29 | 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7808187B2 (https=) |
| KR (1) | KR20250115908A (https=) |
| CN (1) | CN119678228A (https=) |
| TW (1) | TW202428814A (https=) |
| WO (1) | WO2024117181A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060111496A1 (en) | 2004-11-24 | 2006-05-25 | Stijn Gillissen | Low temperature snap cure material with suitable worklife |
| JP6231257B2 (ja) | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 導電性接着剤、及び電子部品の接続方法 |
| JPWO2018181694A1 (ja) * | 2017-03-30 | 2020-02-06 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP7534840B2 (ja) * | 2017-06-12 | 2024-08-15 | 積水化学工業株式会社 | 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子 |
| JP7280864B2 (ja) * | 2018-09-14 | 2023-05-24 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
| JP7606348B2 (ja) * | 2019-05-14 | 2024-12-25 | 積水化学工業株式会社 | 樹脂粒子、導電性粒子、導電材料及び接続構造体 |
-
2023
- 2023-11-29 KR KR1020247039789A patent/KR20250115908A/ko active Pending
- 2023-11-29 WO PCT/JP2023/042741 patent/WO2024117181A1/ja not_active Ceased
- 2023-11-29 CN CN202380059013.3A patent/CN119678228A/zh active Pending
- 2023-11-29 JP JP2024519634A patent/JP7808187B2/ja active Active
- 2023-11-30 TW TW112146553A patent/TW202428814A/zh unknown
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