JP7808187B2 - 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 - Google Patents

導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

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Publication number
JP7808187B2
JP7808187B2 JP2024519634A JP2024519634A JP7808187B2 JP 7808187 B2 JP7808187 B2 JP 7808187B2 JP 2024519634 A JP2024519634 A JP 2024519634A JP 2024519634 A JP2024519634 A JP 2024519634A JP 7808187 B2 JP7808187 B2 JP 7808187B2
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JP
Japan
Prior art keywords
conductive
conductive paste
meth
less
acrylate
Prior art date
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Application number
JP2024519634A
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English (en)
Japanese (ja)
Other versions
JPWO2024117181A5 (https=
JPWO2024117181A1 (https=
Inventor
洋 小林
悠人 土橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2024117181A1 publication Critical patent/JPWO2024117181A1/ja
Publication of JPWO2024117181A5 publication Critical patent/JPWO2024117181A5/ja
Application granted granted Critical
Publication of JP7808187B2 publication Critical patent/JP7808187B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
JP2024519634A 2022-11-30 2023-11-29 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Active JP7808187B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022191056 2022-11-30
JP2022191056 2022-11-30
PCT/JP2023/042741 WO2024117181A1 (ja) 2022-11-30 2023-11-29 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Publications (3)

Publication Number Publication Date
JPWO2024117181A1 JPWO2024117181A1 (https=) 2024-06-06
JPWO2024117181A5 JPWO2024117181A5 (https=) 2024-10-31
JP7808187B2 true JP7808187B2 (ja) 2026-01-28

Family

ID=91323807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024519634A Active JP7808187B2 (ja) 2022-11-30 2023-11-29 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Country Status (5)

Country Link
JP (1) JP7808187B2 (https=)
KR (1) KR20250115908A (https=)
CN (1) CN119678228A (https=)
TW (1) TW202428814A (https=)
WO (1) WO2024117181A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181694A1 (ja) 2017-03-30 2018-10-04 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
WO2018230470A1 (ja) 2017-06-12 2018-12-20 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
WO2020054288A1 (ja) 2018-09-14 2020-03-19 積水化学工業株式会社 導電材料及び接続構造体
WO2020230842A1 (ja) 2019-05-14 2020-11-19 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060111496A1 (en) 2004-11-24 2006-05-25 Stijn Gillissen Low temperature snap cure material with suitable worklife
JP6231257B2 (ja) 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181694A1 (ja) 2017-03-30 2018-10-04 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
WO2018230470A1 (ja) 2017-06-12 2018-12-20 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
WO2020054288A1 (ja) 2018-09-14 2020-03-19 積水化学工業株式会社 導電材料及び接続構造体
WO2020230842A1 (ja) 2019-05-14 2020-11-19 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
KR20250115908A (ko) 2025-07-31
CN119678228A (zh) 2025-03-21
TW202428814A (zh) 2024-07-16
JPWO2024117181A1 (https=) 2024-06-06
WO2024117181A1 (ja) 2024-06-06

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