KR20250115908A - 도전 페이스트, rfid 인레이 및 rfid 인레이의 제조 방법 - Google Patents

도전 페이스트, rfid 인레이 및 rfid 인레이의 제조 방법

Info

Publication number
KR20250115908A
KR20250115908A KR1020247039789A KR20247039789A KR20250115908A KR 20250115908 A KR20250115908 A KR 20250115908A KR 1020247039789 A KR1020247039789 A KR 1020247039789A KR 20247039789 A KR20247039789 A KR 20247039789A KR 20250115908 A KR20250115908 A KR 20250115908A
Authority
KR
South Korea
Prior art keywords
conductive
conductive paste
substrate
less
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247039789A
Other languages
English (en)
Korean (ko)
Inventor
히로시 고바야시
유토 도바시
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20250115908A publication Critical patent/KR20250115908A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H01L21/52—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
KR1020247039789A 2022-11-30 2023-11-29 도전 페이스트, rfid 인레이 및 rfid 인레이의 제조 방법 Pending KR20250115908A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022191056 2022-11-30
JPJP-P-2022-191056 2022-11-30
PCT/JP2023/042741 WO2024117181A1 (ja) 2022-11-30 2023-11-29 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Publications (1)

Publication Number Publication Date
KR20250115908A true KR20250115908A (ko) 2025-07-31

Family

ID=91323807

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247039789A Pending KR20250115908A (ko) 2022-11-30 2023-11-29 도전 페이스트, rfid 인레이 및 rfid 인레이의 제조 방법

Country Status (5)

Country Link
JP (1) JP7808187B2 (https=)
KR (1) KR20250115908A (https=)
CN (1) CN119678228A (https=)
TW (1) TW202428814A (https=)
WO (1) WO2024117181A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006144018A (ja) 2004-11-24 2006-06-08 Natl Starch & Chem Investment Holding Corp 適切な可使時間を有する低温スナップ硬化型材料
JP2013124330A (ja) 2011-12-15 2013-06-24 Dexerials Corp 導電性接着剤、及び電子部品の接続方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018181694A1 (ja) * 2017-03-30 2020-02-06 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7534840B2 (ja) * 2017-06-12 2024-08-15 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
JP7280864B2 (ja) * 2018-09-14 2023-05-24 積水化学工業株式会社 導電材料及び接続構造体
JP7606348B2 (ja) * 2019-05-14 2024-12-25 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006144018A (ja) 2004-11-24 2006-06-08 Natl Starch & Chem Investment Holding Corp 適切な可使時間を有する低温スナップ硬化型材料
JP2013124330A (ja) 2011-12-15 2013-06-24 Dexerials Corp 導電性接着剤、及び電子部品の接続方法

Also Published As

Publication number Publication date
CN119678228A (zh) 2025-03-21
TW202428814A (zh) 2024-07-16
JPWO2024117181A1 (https=) 2024-06-06
JP7808187B2 (ja) 2026-01-28
WO2024117181A1 (ja) 2024-06-06

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000