JPWO2024095795A5 - - Google Patents

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Publication number
JPWO2024095795A5
JPWO2024095795A5 JP2024554397A JP2024554397A JPWO2024095795A5 JP WO2024095795 A5 JPWO2024095795 A5 JP WO2024095795A5 JP 2024554397 A JP2024554397 A JP 2024554397A JP 2024554397 A JP2024554397 A JP 2024554397A JP WO2024095795 A5 JPWO2024095795 A5 JP WO2024095795A5
Authority
JP
Japan
Prior art keywords
partition
electronic device
outer lead
resin
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024554397A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024095795A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/037986 external-priority patent/WO2024095795A1/ja
Publication of JPWO2024095795A1 publication Critical patent/JPWO2024095795A1/ja
Publication of JPWO2024095795A5 publication Critical patent/JPWO2024095795A5/ja
Pending legal-status Critical Current

Links

JP2024554397A 2022-11-01 2023-10-20 Pending JPWO2024095795A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022175672 2022-11-01
PCT/JP2023/037986 WO2024095795A1 (ja) 2022-11-01 2023-10-20 電子装置

Publications (2)

Publication Number Publication Date
JPWO2024095795A1 JPWO2024095795A1 (https=) 2024-05-10
JPWO2024095795A5 true JPWO2024095795A5 (https=) 2025-07-14

Family

ID=90930256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024554397A Pending JPWO2024095795A1 (https=) 2022-11-01 2023-10-20

Country Status (3)

Country Link
US (1) US20250266332A1 (https=)
JP (1) JPWO2024095795A1 (https=)
WO (1) WO2024095795A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3268688B2 (ja) * 1993-06-14 2002-03-25 株式会社日立製作所 半導体集積回路装置
JPH09275174A (ja) * 1996-04-05 1997-10-21 Toko Inc 電子部品
JP2016018821A (ja) * 2014-07-04 2016-02-01 新電元工業株式会社 半導体装置の製造方法、半導体装置、及び、リードフレーム
JP7527916B2 (ja) * 2020-09-29 2024-08-05 ローム株式会社 半導体装置

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