JP2024501879A5 - - Google Patents
Info
- Publication number
- JP2024501879A5 JP2024501879A5 JP2023540532A JP2023540532A JP2024501879A5 JP 2024501879 A5 JP2024501879 A5 JP 2024501879A5 JP 2023540532 A JP2023540532 A JP 2023540532A JP 2023540532 A JP2023540532 A JP 2023540532A JP 2024501879 A5 JP2024501879 A5 JP 2024501879A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- lateral extension
- package according
- semiconductor
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063132825P | 2020-12-31 | 2020-12-31 | |
| US63/132,825 | 2020-12-31 | ||
| US17/560,229 US20220230944A1 (en) | 2020-12-31 | 2021-12-22 | Configurable leaded package |
| US17/560,229 | 2021-12-22 | ||
| PCT/US2021/065534 WO2022147143A1 (en) | 2020-12-31 | 2021-12-29 | Configurable leaded package |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024501879A JP2024501879A (ja) | 2024-01-16 |
| JP2024501879A5 true JP2024501879A5 (https=) | 2024-12-27 |
| JP7827729B2 JP7827729B2 (ja) | 2026-03-10 |
Family
ID=82259651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023540532A Active JP7827729B2 (ja) | 2020-12-31 | 2021-12-29 | 構成可能なリード付きパッケージ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220230944A1 (https=) |
| EP (1) | EP4272242A4 (https=) |
| JP (1) | JP7827729B2 (https=) |
| KR (1) | KR20230126708A (https=) |
| TW (1) | TW202249220A (https=) |
| WO (1) | WO2022147143A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12400939B2 (en) * | 2021-08-12 | 2025-08-26 | Texas Instruments Incorporated | Packaged semiconductor device including heat slug |
| US20230317568A1 (en) * | 2022-03-31 | 2023-10-05 | Texas Instruments Incorporated | Isolation package with high thermal conductivity |
| IT202200008897A1 (it) * | 2022-05-03 | 2023-11-03 | St Microelectronics Srl | Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente |
| CN115207019B (zh) * | 2022-05-24 | 2023-05-12 | 重庆惠科金渝光电科技有限公司 | 显示面板及其制作方法 |
| US20240243042A1 (en) * | 2023-01-16 | 2024-07-18 | Infineon Technologies Ag | Power semiconductor module and discrete power semiconductor device having an active temperature sensor die, and corresponding methods of production |
| CN118723287A (zh) * | 2023-03-28 | 2024-10-01 | Jcet星科金朋韩国有限公司 | 具有改进的翘曲控制的承载半导体封装条的载体组件 |
| US20240413105A1 (en) * | 2023-06-07 | 2024-12-12 | Bae Systems Information And Electronic Systems Integration Inc. | Conductive lines for interconnection in stacked device structures |
| TWI878079B (zh) * | 2024-04-01 | 2025-03-21 | 英屬開曼群島商海珀電子股份有限公司 | 高電子遷移率電晶體的封裝結構 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5235211A (en) * | 1990-06-22 | 1993-08-10 | Digital Equipment Corporation | Semiconductor package having wraparound metallization |
| JPH04199739A (ja) * | 1990-11-29 | 1992-07-20 | Matsushita Electron Corp | 半導体装置用リードフレーム |
| JPH05275601A (ja) * | 1992-03-27 | 1993-10-22 | Kyocera Corp | 半導体素子収納用パッケージ |
| US5828126A (en) * | 1992-06-17 | 1998-10-27 | Vlsi Technology, Inc. | Chip on board package with top and bottom terminals |
| JP3432982B2 (ja) * | 1995-12-13 | 2003-08-04 | 沖電気工業株式会社 | 表面実装型半導体装置の製造方法 |
| JP2924854B2 (ja) * | 1997-05-20 | 1999-07-26 | 日本電気株式会社 | 半導体装置、その製造方法 |
| US6194777B1 (en) | 1998-06-27 | 2001-02-27 | Texas Instruments Incorporated | Leadframes with selective palladium plating |
| JP2000307030A (ja) | 1999-02-17 | 2000-11-02 | Matsushita Electric Ind Co Ltd | 表面実装型中空樹脂パッケージ |
| JP2001196488A (ja) | 1999-10-26 | 2001-07-19 | Nec Corp | 電子部品装置及びその製造方法 |
| JP2009224726A (ja) | 2008-03-18 | 2009-10-01 | Powertech Technology Inc | Ｃｏｌ型半導体パッケージ |
-
2021
- 2021-12-22 US US17/560,229 patent/US20220230944A1/en active Pending
- 2021-12-29 WO PCT/US2021/065534 patent/WO2022147143A1/en not_active Ceased
- 2021-12-29 KR KR1020237021656A patent/KR20230126708A/ko active Pending
- 2021-12-29 JP JP2023540532A patent/JP7827729B2/ja active Active
- 2021-12-29 EP EP21916428.2A patent/EP4272242A4/en active Pending
- 2021-12-30 TW TW110149600A patent/TW202249220A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2024501879A5 (https=) | ||
| JP3602453B2 (ja) | 半導体装置 | |
| JPH06112354A (ja) | 薄型オーバーモールデッド半導体デバイスおよびその製造方法 | |
| TW202133373A (zh) | 半導體封裝結構 | |
| TWI606560B (zh) | 封裝結構 | |
| JPS6042620B2 (ja) | 半導体装置の封止体 | |
| JP2021170679A (ja) | 半導体装置 | |
| US9318354B2 (en) | Semiconductor package and fabrication method thereof | |
| WO2015129185A1 (ja) | 樹脂封止型半導体装置、およびその製造方法、ならびにその実装体 | |
| CN216624270U (zh) | 半导体封装件以及电子器件 | |
| JP3447139B2 (ja) | チップ型発光ダイオード | |
| JPH0342860A (ja) | フレキシブルプリント配線板 | |
| JPH01102947A (ja) | 樹脂封止型半導体デバイスおよびリードフレーム | |
| JP2947563B2 (ja) | 半導体装置 | |
| TW201413878A (zh) | 柔性電路板及晶片封裝結構 | |
| JP2784209B2 (ja) | 半導体装置 | |
| JPH01132147A (ja) | 半導体装置 | |
| JPH03105961A (ja) | 樹脂封止型半導体装置 | |
| JPH04192450A (ja) | 複合リードフレーム | |
| US20140203440A1 (en) | Microelectronic package and method of manufacture thereof | |
| JPH07249708A (ja) | 半導体装置及びその実装構造 | |
| CN120072779A (zh) | 半导体结构及半导体结构的制造方法 | |
| JPH04119653A (ja) | 集積回路素子 | |
| JPH02122552A (ja) | 樹脂封止型半導体装置 | |
| JPS5856449A (ja) | 半導体装置 |