JPWO2024080195A5 - - Google Patents

Info

Publication number
JPWO2024080195A5
JPWO2024080195A5 JP2024551455A JP2024551455A JPWO2024080195A5 JP WO2024080195 A5 JPWO2024080195 A5 JP WO2024080195A5 JP 2024551455 A JP2024551455 A JP 2024551455A JP 2024551455 A JP2024551455 A JP 2024551455A JP WO2024080195 A5 JPWO2024080195 A5 JP WO2024080195A5
Authority
JP
Japan
Prior art keywords
prepreg according
glass
prepreg
zinc molybdate
spherical zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024551455A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024080195A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/036144 external-priority patent/WO2024080195A1/ja
Publication of JPWO2024080195A1 publication Critical patent/JPWO2024080195A1/ja
Publication of JPWO2024080195A5 publication Critical patent/JPWO2024080195A5/ja
Pending legal-status Critical Current

Links

JP2024551455A 2022-10-12 2023-10-04 Pending JPWO2024080195A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022164266 2022-10-12
PCT/JP2023/036144 WO2024080195A1 (ja) 2022-10-12 2023-10-04 プリプレグ、積層板、プリント配線板及び半導体パッケージ

Publications (2)

Publication Number Publication Date
JPWO2024080195A1 JPWO2024080195A1 (https=) 2024-04-18
JPWO2024080195A5 true JPWO2024080195A5 (https=) 2025-08-18

Family

ID=90669231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024551455A Pending JPWO2024080195A1 (https=) 2022-10-12 2023-10-04

Country Status (6)

Country Link
US (1) US20250287499A1 (https=)
JP (1) JPWO2024080195A1 (https=)
KR (1) KR20250087553A (https=)
CN (1) CN119156416A (https=)
TW (1) TW202428730A (https=)
WO (1) WO2024080195A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001113628A (ja) * 1999-10-22 2001-04-24 Hitachi Chem Co Ltd 金属張積層板の製造方法
US20120077401A1 (en) * 2009-03-27 2012-03-29 Tomohiko Kotake Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin film
EP2518115B1 (en) * 2009-12-25 2017-10-18 Hitachi Chemical Company, Ltd. Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
JP5862070B2 (ja) * 2011-06-29 2016-02-16 日立化成株式会社 積層板用樹脂組成物、プリプレグ及び積層板
JP5862069B2 (ja) * 2011-06-29 2016-02-16 日立化成株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板、及びプリント配線板
JP6724296B2 (ja) * 2015-05-22 2020-07-15 住友ベークライト株式会社 プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP2019199562A (ja) 2018-05-17 2019-11-21 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板
CN115335433B (zh) * 2020-03-25 2024-08-09 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、层叠板、覆金属箔层叠板、及印刷电路板
CN118541448A (zh) * 2022-01-28 2024-08-23 松下知识产权经营株式会社 树脂组合物、预浸料、具有树脂的膜、具有树脂的金属箔片材、覆金属层压体和印刷线路板

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