JPWO2024214530A5 - - Google Patents
Info
- Publication number
- JPWO2024214530A5 JPWO2024214530A5 JP2025513871A JP2025513871A JPWO2024214530A5 JP WO2024214530 A5 JPWO2024214530 A5 JP WO2024214530A5 JP 2025513871 A JP2025513871 A JP 2025513871A JP 2025513871 A JP2025513871 A JP 2025513871A JP WO2024214530 A5 JPWO2024214530 A5 JP WO2024214530A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- molecular weight
- average molecular
- number average
- composition described
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023063536 | 2023-04-10 | ||
| PCT/JP2024/011892 WO2024214530A1 (ja) | 2023-04-10 | 2024-03-26 | 樹脂組成物、プリプレグ、樹脂フィルム、金属張積層板、プリント配線板、半導体パッケージ、及びアセナフチレンホモポリマ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024214530A1 JPWO2024214530A1 (https=) | 2024-10-17 |
| JPWO2024214530A5 true JPWO2024214530A5 (https=) | 2026-01-16 |
Family
ID=93059048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025513871A Pending JPWO2024214530A1 (https=) | 2023-04-10 | 2024-03-26 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024214530A1 (https=) |
| KR (1) | KR20250170041A (https=) |
| CN (1) | CN119110829A (https=) |
| TW (1) | TW202502951A (https=) |
| WO (1) | WO2024214530A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2834806B2 (ja) * | 1989-11-24 | 1998-12-14 | 出光興産株式会社 | スチレン系共重合体およびその製造方法 |
| JP4529247B2 (ja) * | 2000-07-12 | 2010-08-25 | Ｊｓｒ株式会社 | 熱硬化性樹脂組成物、その硬化物およびその硬化物を含む回路基板 |
| AU2003210504A1 (en) * | 2002-01-15 | 2003-07-30 | Honeywell International Inc. | Organic compositions for low dielectric constant materials |
| JP2004315725A (ja) | 2003-04-18 | 2004-11-11 | Hitachi Chem Co Ltd | プリプレグ，金属張積層板および印刷配線板の製造方法 |
| JP4591946B2 (ja) * | 2004-04-28 | 2010-12-01 | 日本化薬株式会社 | ポリ（ビニルベンジル）エーテル化合物およびその製造方法 |
| CN115836101B (zh) * | 2020-06-09 | 2025-07-29 | Dic株式会社 | 硬化性树脂、硬化性树脂组合物及硬化物 |
-
2024
- 2024-03-26 CN CN202480002234.1A patent/CN119110829A/zh active Pending
- 2024-03-26 WO PCT/JP2024/011892 patent/WO2024214530A1/ja not_active Ceased
- 2024-03-26 KR KR1020257032195A patent/KR20250170041A/ko active Pending
- 2024-03-26 JP JP2025513871A patent/JPWO2024214530A1/ja active Pending
- 2024-03-29 TW TW113111989A patent/TW202502951A/zh unknown
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