JPWO2025032956A5 - - Google Patents

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Publication number
JPWO2025032956A5
JPWO2025032956A5 JP2025539157A JP2025539157A JPWO2025032956A5 JP WO2025032956 A5 JPWO2025032956 A5 JP WO2025032956A5 JP 2025539157 A JP2025539157 A JP 2025539157A JP 2025539157 A JP2025539157 A JP 2025539157A JP WO2025032956 A5 JPWO2025032956 A5 JP WO2025032956A5
Authority
JP
Japan
Prior art keywords
adhesive sheet
thermosetting adhesive
sheet according
styrene
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025539157A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025032956A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/021198 external-priority patent/WO2025032956A1/ja
Publication of JPWO2025032956A1 publication Critical patent/JPWO2025032956A1/ja
Publication of JPWO2025032956A5 publication Critical patent/JPWO2025032956A5/ja
Pending legal-status Critical Current

Links

JP2025539157A 2023-08-10 2024-06-11 Pending JPWO2025032956A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023130949 2023-08-10
PCT/JP2024/021198 WO2025032956A1 (ja) 2023-08-10 2024-06-11 熱硬化型接着シート及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2025032956A1 JPWO2025032956A1 (https=) 2025-02-13
JPWO2025032956A5 true JPWO2025032956A5 (https=) 2025-09-10

Family

ID=94534190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025539157A Pending JPWO2025032956A1 (https=) 2023-08-10 2024-06-11

Country Status (5)

Country Link
JP (1) JPWO2025032956A1 (https=)
KR (1) KR20260049120A (https=)
CN (1) CN121368620A (https=)
TW (1) TW202506937A (https=)
WO (1) WO2025032956A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025220699A1 (ja) * 2024-04-17 2025-10-23 株式会社レゾナック 硬化物及び半導体装置の製造方法、並びに組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277135A (ja) * 2004-03-25 2005-10-06 Toray Ind Inc 半導体用接着剤組成物およびそれを用いた半導体用接着剤シート、半導体集積回路接続用基板、半導体装置
JP2013145840A (ja) * 2012-01-16 2013-07-25 Mitsubishi Chemicals Corp 三次元集積回路の層間充填層形成用塗布液、及び三次元集積回路の製造方法
JP7676761B2 (ja) * 2020-12-04 2025-05-15 ａｒｔｉｅｎｃｅ株式会社 絶縁性組成物、熱硬化性接着シート、熱伝導性接着層および複合部材
JPWO2022255078A1 (https=) * 2021-06-02 2022-12-08

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